公开(公告)号：US20140231979A1

公开(公告)日：2014-08-21

申请号：US13922577

申请日：2013-06-20

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B7/008 ,  B81C1/0023 ,  B81C1/00301 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73257 ,  H01L2924/10158 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An assembly of a MEMS integrated device envisages: a package having a base substrate with a main surface in a horizontal plane, and a coating set on the base substrate; a first body including semiconductor material and integrating a micromechanical structure, housed within the package on the base substrate; at least one second body including semiconductor material and integrating at least one electronic component, designed to be functionally coupled to the micromechanical structure, the first body and the second body being arranged within the package stacked in a vertical direction transverse to the horizontal plane. In particular, at least one between the first body and the base substrate defines a first recess, in which the second body is housed, at least in part.

Abstract translation: MEMS集成装置的组件设想：具有在水平面中具有主表面的基底基底和在基底基底上的涂层的封装; 包含半导体材料并将容纳在所述封装内的微机械结构集成在所述基底基板上的第一体; 包括半导体材料的至少一个第二主体并且集成至少一个电子部件，被设计成功能上耦合到微机械结构，第一主体和第二主体被布置在横向于水平面的垂直方向上堆叠的封装内。 特别地，第一主体和基底基板之间的至少一个至少部分地限定了容纳第二主体的第一凹部。