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    Filter bank optimization for acoustic echo cancellation
    62.
    发明授权
    Filter bank optimization for acoustic echo cancellation 有权
    用于声学回声消除的滤波器组优化

    公开(公告)号：US08155304B2

    公开(公告)日：2012-04-10

    申请号：US11784893

    申请日：2007-04-10

    Applicant: Qin Li ,  Wei-ge Chen ,  Chao He

    Inventor： Qin Li ,  Wei-ge Chen ,  Chao He

    IPC: H04M9/08

    CPC classification number: H04M9/082

    Abstract: A communications device is presented for providing bi-directional audio communications between a near-end user and a far-end user via a bidirectional communications channel. The communications device includes an adaptive echo canceller receiving a near-end audio signal and a far-end audio signal and providing an echo-canceled near-end audio signal for transmission to the far-end user via the communications channel. The adaptive echo canceller includes a first bank of analysis filters for filtering the near-end audio signal, a second bank of analysis filters for filtering the far-end audio signal, and a bank of synthesis filters for filtering sub-band echo-canceled signals generated within the adaptive echo canceller. The first and second filter banks have a frequency response optimized to reduce echo residual gain.

    Abstract translation: 呈现通信设备，用于经由双向通信信道在近端用户和远端用户之间提供双向音频通信。 通信设备包括接收近端音频信号和远端音频信号的自适应回波消除器，并提供回波消除的近端音频信号，以经由通信信道传输给远端用户。 自适应回波消除器包括用于滤波近端音频信号的第一组分析滤波器，用于滤波远端音频信号的第二组分析滤波器，以及用于滤波子带回波消除信号的一组合成滤波器 在自适应回波消除器内产生。 第一和第二滤波器组具有优化的频率响应以减少回波残余增益。

    Circuit board assembly
    69.
    发明授权
    Circuit board assembly 失效
    电路板组装

    公开(公告)号：US07864536B2

    公开(公告)日：2011-01-04

    申请号：US12464560

    申请日：2009-05-12

    Applicant: Qin Li ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

    Inventor： Qin Li ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

    IPC: H05K7/20 ,  H01L23/36

    CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K3/0064 ,  H05K7/205 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009

    Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.

    Abstract translation: 电路板组件包括其上安装有两个散热组件的电路板和附接到电路板的下侧的L形背板。 每个散热组件在其相对的角部处包括至少一对固定构件。 背板包括第一部分和第二部分，每个部分限定与散热组件的固定部件相对应的至少一对圆形突起。

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