公开(公告)号：US20130077247A1

公开(公告)日：2013-03-28

申请号：US13676313

申请日：2012-11-14

申请人： International Business Machines Corporation

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809

摘要： A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

公开(公告)号：US20130077246A1

公开(公告)日：2013-03-28

申请号：US13676242

申请日：2012-11-14

申请人： International Business Machines Corporation

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US20130070420A1

公开(公告)日：2013-03-21

申请号：US13676227

申请日：2012-11-14

申请人： International Business Machines Corporation

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H02K7/20

CPC分类号： H05K7/20809 ,  H05K7/20309 ,  H05K7/20318 ,  Y10T29/4935 ,  Y10T29/49377 ,  Y10T29/49378

摘要： A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive structure which has one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

摘要翻译： 提供了一种用于促进从发热电子部件提取热量的方法。 该方法包括提供散热器，散热器包括具有一个或多个冷却剂传送通道和一个或多个蒸汽冷凝通道的导热结构。 一个薄膜设置在冷却剂输送通道和蒸汽冷凝通道之间。 膜包括至少一个透气区域，其至少一部分覆盖着一部分冷却剂输送通道，并且有助于将蒸气从冷却剂输送通道移除到蒸汽冷凝通道（ s）。 散热器还包括一个或多个冷却剂入口，所述冷却剂入口联接以向所述冷却剂输送通道提供第一液体冷却剂流，以及第二液体冷却剂流以冷凝所述蒸气冷凝通道内的蒸汽。