公开(公告)号：US20110141864A1

公开(公告)日：2011-06-16

申请号：US12785204

申请日：2010-05-21

Applicant: Wei-Chih LIN ,  Ling-Hao Yu ,  Chen-I Kuo

Inventor： Wei-Chih LIN ,  Ling-Hao Yu ,  Chen-I Kuo

IPC: G11B7/00

CPC classification number: G11B7/0908 ,  G11B7/0956 ,  G11B7/1374 ,  G11B7/1387 ,  G11B2007/13727

Abstract: A tilt control method for a near-field optical disc drive is provided. A gap between a lens and a disc is estimated. A tilt compensation for the lens is estimated according to a tilt signal when the lens is within a far-field region. A coarse tilt control is performed on the lens according to the tilt compensation when the lens is within the far-field region.

Abstract translation: 提供了一种用于近场光盘驱动器的倾斜控制方法。 估计透镜和光盘之间的间隙。 当透镜在远场区域内时，根据倾斜信号来估计透镜的倾斜补偿。 当透镜在远场区域内时，根据倾斜补偿在透镜上进行粗略倾斜控制。

公开(公告)号：US20110134733A1

公开(公告)日：2011-06-09

申请号：US12818487

申请日：2010-06-18

Applicant: Wei-Chih LIN ,  George Leenknegt ,  Jan van de Ven

Inventor： Wei-Chih LIN ,  George Leenknegt ,  Jan van de Ven

IPC: G11B7/00

CPC classification number: G11B7/0956 ,  G11B7/0908 ,  G11B7/0945 ,  G11B7/1387 ,  G11B2007/13727

Abstract: A tilt adjustment control method for a near-field optical system is provided. The method includes the following steps. A gap between a lens and a disc is detected. A gain corresponding to the gap is provided. A tilt signal is detected. A tilt compensation value according to the tilt signal and the gain is obtained. A tilt adjustment control is performed on the lens according to the tilt compensation value.

Abstract translation: 提供了一种用于近场光学系统的倾斜调节控制方法。 该方法包括以下步骤。 检测透镜与光盘之间的间隙。 提供对应于间隙的增益。 检测到倾斜信号。 获得根据倾斜信号和增益的倾斜补偿值。 根据倾斜补偿值对透镜进行倾斜调整控制。

公开(公告)号：US20110128944A1

公开(公告)日：2011-06-02

申请号：US12630831

申请日：2009-12-03

Applicant: Po-Wen CHI ,  Ching-Lun LIN ,  Yu-Hsiang LIN ,  Wei-Chih LIN ,  Chih-Hsiang HO ,  Heng-Iang HSU

Inventor： Po-Wen CHI ,  Ching-Lun LIN ,  Yu-Hsiang LIN ,  Wei-Chih LIN ,  Chih-Hsiang HO ,  Heng-Iang HSU

IPC: H04W4/00

CPC classification number: H04W76/10 ,  H04W84/045

Abstract: A femto access point (FAP) for use in a network system and a communication method for the femto access point are provided. A mobile station is wirelessly connected to the FAP. The FAP comprises a storage unit, a sniffer unit, and a process unit. The sniffer unit sniffs a packet of the mobile station. The process unit retrieves an identity (ID) code of the mobile station from the packet and stores the ID code into the storage unit. The process unit further establishes an uplink local area network (LAN) service flow and a downlink LAN service flow of the mobile station. The uplink LAN service flow and the downlink LAN service flow established by the FAP and the mobile station are used to transfer packets within the LAN.

Abstract translation: 提供了一种用于网络系统的毫微微接入点（FAP）和用于毫微微接入点的通信方法。 移动台无线连接到FAP。 FAP包括存储单元，嗅探单元和处理单元。 嗅探器单元嗅探移动台的数据包。 处理单元从分组中检索移动站的身份（ID）代码，并将ID代码存储到存储单元中。 处理单元进一步建立移动台的上行局域网（LAN）服务流和下行LAN服务流。 由FAP和移动台建立的上行LAN服务流和下行LAN服务流用于传送LAN内的数据包。

公开(公告)号：US07940617B2

公开(公告)日：2011-05-10

申请号：US12179032

申请日：2008-07-24

Applicant: Wei Chih Lin

Inventor： Wei Chih Lin

IPC: G11B5/09

CPC classification number: G11B7/094 ,  G11B7/0945 ,  G11B7/13925

Abstract: A method for calibrating an SA compensation level of an optical drive is provided. The method includes steps of providing a plurality of SA compensation levels; obtaining a peak-to-peak value of an S curve corresponding to each of the SA compensation levels; selecting a maximum of the peak-to-peak values of the S curves and the SA compensation level corresponding to the maximum; and setting the selected SA compensation level to be an optimal SA compensation level.

Abstract translation: 提供了一种用于校准光盘驱动器的SA补偿电平的方法。 该方法包括提供多个SA补偿电平的步骤; 获得对应于每个SA补偿电平的S曲线的峰 - 峰值; 选择S曲线的峰 - 峰值的最大值和对应于最大值的SA补偿电平; 并将所选择的SA补偿电平设置为最佳SA补偿电平。

公开(公告)号：US20110045682A1

公开(公告)日：2011-02-24

申请号：US12858794

申请日：2010-08-18

Applicant: WEI-CHIH LIN

Inventor： WEI-CHIH LIN

IPC: H01R13/62 ,  H01R24/00

CPC classification number: G01R1/0458

Abstract: A socket connector (100) includes a base (1) defining a receiving room, an insulative housing (2) received in the receiving room, a number of contacts (6) retained in the insulative housing, a floating plate (3) secured to the base and attached to an upper face of the insulative housing, and a number of springs (7). The insulative housing includes a first block portion (22), a second block portion (21) located upon the first block portion, and a side shoulder (23). The floating plate includes a rectangular main portion (30) and a plurality of fixing legs (31) extending from corners of the main portion towards the base. The springs have a first group of springs sandwiched between the edges of the main portion and the base, and a second group of springs sandwiched between the fixing legs and the side shoulder of the insulative housing.

Abstract translation: 插座连接器（100）包括限定接收室的基座（1），容纳在接收室中的绝缘壳体（2），保持在绝缘壳体中的多个触点（6），固定到 所述基座并且连接到所述绝缘壳体的上表面，以及多个弹簧（7）。 绝缘壳体包括第一块部分（22），位于第一块部分上的第二块部分（21）和侧肩部（23）。 浮板包括矩形主体部分（30）和从主要部分的角向基部延伸的多个固定支脚（31）。 弹簧具有夹在主体部分和基部的边缘之间的第一组弹簧，以及夹在固定腿和绝缘壳体的侧肩之间的第二组弹簧。

公开(公告)号：US07878831B2

公开(公告)日：2011-02-01

申请号：US12719838

申请日：2010-03-08

Applicant: Wei-Chih Lin

Inventor： Wei-Chih Lin

IPC: H01R13/62

CPC classification number: G01R31/2867 ,  G01R1/0466 ,  H05K7/1023

Abstract: An electrical connector (100) electrically connects a first IC package (800) having a first width and a second IC package (900) having a second width different from the first width. The electrical connector includes an insulative housing (2) defining a number of contact recesses (20), a number of contacts (3) inserted in the contact recesses, a connecting member (4) mounted on the insulative housing, and a number of guiding members (6) assembled to the connecting member for guiding the first IC package in the connecting member at a first state, and detachable from the connecting member for facilitating insertion of the second IC package in the connecting member at a second state.

Abstract translation: 电连接器（100）电连接具有第一宽度的第一IC封装（800）和具有不同于第一宽度的第二宽度的第二IC封装（900）。 电连接器包括限定多个接触凹部（20）的绝缘壳体（2），插入到接触凹部中的多个触点（3），安装在绝缘壳体上的连接部件（4） 构件（6）组装到连接构件上，用于在第一状态下引导连接构件中的第一IC封装，并且能够从连接构件拆卸，以便于在第二状态下将第二IC封装插入连接构件。

公开(公告)号：US07839070B2

公开(公告)日：2010-11-23

申请号：US11477938

申请日：2006-06-30

Applicant: Jung-Yu Li ,  Shih-Pu Chen ,  Yi-Ping Lin ,  Wei-Chih Lin

Inventor： Jung-Yu Li ,  Shih-Pu Chen ,  Yi-Ping Lin ,  Wei-Chih Lin

IPC: H01J63/04

CPC classification number: H01J1/74 ,  H01J29/04 ,  H01J29/08 ,  H01J31/127 ,  H01J2329/0407 ,  H01J2329/08 ,  H01J2329/18

Abstract: A field emission device has pixels with cathode and anode provided on the same plane, so that electrons directly penetrate an independently provided fluorescent powder layer to produce light, giving the display the advantages of easy focusing, no dark spots, high brightness, and enhanced light emitting performance. Since the light produced by the fluorescent powder layer is not blocked by the anode, the problem of charge accumulation on the fluorescent powder layer is avoided, and it is not necessary to use expensive light-transmittable conducting glass as the anode. With the cathode and the anode located at the same plane, it is not necessary to use a high precision spacer to maintain a fixed distance between the cathode and the anode, enabling the device to be manufactured at reduced cost and high good yield.

Abstract translation: 场发射器件具有设置在同一平面上的阴极和阳极的像素，使得电子直接穿透独立提供的荧光粉层以产生光，使显示器具有容易聚焦，无黑点，高亮度和增强的光的优点 发射性能。 由于由荧光粉层产生的光不被阳极阻挡，所以避免了荧光粉层上的电荷积聚的问题，并且不需要昂贵的透光导电玻璃作为阳极。 在阴极和阳极位于同一平面上的情况下，不需要使用高精度间隔物来保持阴极和阳极之间的固定距离，从而能够以降低的成本和高的良率获得器件的制造。

公开(公告)号：US07775821B2

公开(公告)日：2010-08-17

申请号：US12543433

申请日：2009-08-18

Applicant: Hsiu-Yuan Hsu ,  Wei-Chih Lin

Inventor： Hsiu-Yuan Hsu ,  Wei-Chih Lin

IPC: H01R11/22

CPC classification number: H05K7/1046

Abstract: A socket adapted for interconnecting an IC package (3), such as TSOP (Thin Small Outline Package), and a circuit board, includes a socket body (1), a plurality of contacts (2) received in the socket body, and an operating member (5) movable mounted on the socket body. Each contact includes a base portion (21) retained into the slot of the socket body and a first and a second contact beams (24, 25), each extending upwardly from an upper edge of the base portion. When a force is applied on the operating member, both of the first and the second contact beams cooperated with the operating member and moving away from its original position. A stick (6) mounted to the member (5) may be provided to cause movement of the second contact (25).

Abstract translation: 用于互连诸如TSOP（Thin Small Outline Package）的IC封装（3）和电路板的插座包括插座主体（1），容纳在插座主体中的多个触点（2）和 操作构件（5）可移动地安装在插座主体上。 每个接触件包括保持在插座本体的狭槽中的基部（21）和从基部的上边缘向上延伸的第一和第二接触梁（24,25）。 当力施加在操作构件上时，第一和第二接触梁都与操作构件配合并且远离其初始位置移动。 可以设置安装到构件（5）上的杆（6）以引起第二触点（25）的移动。

公开(公告)号：US20100120269A1

公开(公告)日：2010-05-13

申请号：US12536496

申请日：2009-08-06

Applicant: SHIH-WEI HSIAO ,  WEI-CHIH LIN

Inventor： SHIH-WEI HSIAO ,  WEI-CHIH LIN

IPC: H01R12/00

CPC classification number: G01R1/0466 ,  H01R13/2428 ,  H01R13/2435 ,  H05K7/1053

Abstract: A socket adapted for electrically connecting a semiconductor package to a printed circuit board, includes a main body defining a number of contact passageways and a plurality of contacts received in the contact passageways of the main body. Each contact has a base portion, a first contacting portion and a second contacting portion upwardly extending from the base portion, and a spring arm bent from a bottom edge of the base portion. The spring arm extends substantially in a horizontal direction and is bent downwardly at a free end thereof to form a tail. The spring arm can deform to provide an elastic force for the tail to press against the printed circuit board.

Abstract translation: 一种适于将半导体封装电连接到印刷电路板的插座，包括限定多个接触通道的主体和容纳在主体的接触通道中的多个触点。 每个触点具有从基部向上延伸的基部，第一接触部和第二接触部，以及从基部的底部边缘弯曲的弹簧臂。 弹簧臂基本上在水平方向上延伸并且在其自由端向下弯曲以形成尾部。 弹簧臂可以变形以提供用于尾部压靠印刷电路板的弹性力。

公开(公告)号：US20100041254A1

公开(公告)日：2010-02-18

申请号：US12543433

申请日：2009-08-18

Applicant: Hsiu-Yuan Hsu ,  Wei-Chih Lin

Inventor： Hsiu-Yuan Hsu ,  Wei-Chih Lin

IPC: H01R12/00 ,  H01R13/40

CPC classification number: H05K7/1046

Abstract: A socket adapted for interconnecting an IC package (3), such as TSOP (Thin Small Outline Package), and a circuit board, includes a socket body (1), a plurality of contacts (2) received in the socket body, and an operating member (5) movable mounted on the socket body. Each contact includes a base portion (21) retained into the slot of the socket body and a first and a second contact beams (24, 25), each extending upwardly from an upper edge of the base portion. When a force is applied on the operating member, both of the first and the second contact beams cooperated with the operating member and moving away from its original position.

Abstract translation: 用于互连诸如TSOP（Thin Small Outline Package）的IC封装（3）和电路板的插座包括插座主体（1），容纳在插座主体中的多个触点（2）和 操作构件（5）可移动地安装在插座主体上。 每个接触件包括保持在插座本体的狭槽中的基部（21）和从基部的上边缘向上延伸的第一和第二接触梁（24,25）。 当力施加在操作构件上时，第一和第二接触梁都与操作构件配合并且远离其初始位置移动。