公开(公告)号：US08632014B2

公开(公告)日：2014-01-21

申请号：US12510347

申请日：2009-07-28

申请人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

发明人： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/07758 ,  G06K19/07786

摘要： A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.

摘要翻译： 无线IC器件包括安装无线IC芯片的辐射板，无线IC芯片和馈电电路板。 馈电电路板包括具有电感元件的谐振电路，并且谐振电路与辐射板电磁耦合。 无线IC芯片插在散热板和馈电电路板之间。

公开(公告)号：US08424769B2

公开(公告)日：2013-04-23

申请号：US13472520

申请日：2012-05-16

申请人： Noboru Kato

发明人： Noboru Kato

IPC分类号： G06K19/00

CPC分类号： H01Q7/00 ,  H01Q1/2216 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q5/378

摘要： In an antenna for an RFID device, a feed coil is coupled to a first booster coil and a second booster coil through an electromagnetic field. In the feed coil, a first region and a second region are disposed so as to overlap with the first booster coil and the second booster coil, respectively. The first region of the feed coil is coupled to the first booster coil through an electromagnetic field, and the second region of the feed coil is coupled to the second booster coil through an electromagnetic field. Accordingly, the antenna has a high degree of coupling between the feed coil and a booster antenna and superior transmission efficiency of an RF signal, and prevents the occurrence of a null point.

摘要翻译： 在用于RFID设备的天线中，馈电线圈通过电磁场耦合到第一升压线圈和第二升压线圈。 在馈送线圈中，第一区域和第二区域分别设置成与第一升压线圈和第二升压线圈重叠。 馈电线圈的第一区域通过电磁场耦合到第一升压线圈，馈电线圈的第二区域通过电磁场耦合到第二升压线圈。 因此，天线在馈电线圈和增强天线之间具有高度的耦合度，并且RF信号的传输效率优异，并且防止产生零点。

公开(公告)号：US08424762B2

公开(公告)日：2013-04-23

申请号：US13540694

申请日：2012-07-03

申请人： Noboru Kato ,  Nobuo Ikemoto

发明人： Noboru Kato ,  Nobuo Ikemoto

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/07756 ,  G06K19/07758 ,  G06K19/07771 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01Q1/2225 ,  H01Q7/00 ,  H04B5/0012

摘要： A wireless IC device includes a cutout portion having no aluminum-deposited film that is provided at an end of an article package made of an aluminum-deposited laminated film, and an electromagnetic coupling module is provided at the cutout portion. The electromagnetic coupling module and the aluminum-deposited film of the package define a wireless IC device. A loop electrode, which is a magnetic field transmission auxiliary radiator of the electromagnetic coupling module, is coupled to the aluminum-deposited film of the package. Thus, the article package functions as a radiator of an antenna.

摘要翻译： 无线IC器件包括没有铝沉积膜的切口部分，其设置在由铝沉积层压膜制成的物品包装的端部，并且在切口部分设置电磁耦合模块。 封装的电磁耦合模块和铝沉积膜定义了无线IC器件。 作为电磁耦合模块的磁场传输辅助散热器的环形电极耦合到封装的铝沉积膜。 因此，物品包用作天线的辐射器。

公开(公告)号：US08418928B2

公开(公告)日：2013-04-16

申请号：US13241823

申请日：2011-09-23

申请人： Noboru Kato ,  Yuya Dokai

发明人： Noboru Kato ,  Yuya Dokai

IPC分类号： G06K19/05

CPC分类号： G06K19/07754 ,  G06K19/07749 ,  G06K19/07756 ,  H01Q1/2225 ,  H01Q7/00 ,  H01Q9/26 ,  H01Q9/285

摘要： A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system.

摘要翻译： 无线IC器件包括无线IC芯片，耦合电极和辐射板。 耦合电极包括被布置成耦合到无线IC芯片的耦合部分和一对相对的端部。 一对相对的端部彼此电容耦合并且与待耦合到辐射板的辐射板相对。 无线IC芯片使用辐射板作为天线来发射和接收具有一定频率的信号到RFID系统。

公开(公告)号：US08378501B2

公开(公告)日：2013-02-19

申请号：US12833083

申请日：2010-07-09

申请人： Kosuke Yamada ,  Noboru Kato

发明人： Kosuke Yamada ,  Noboru Kato

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/06 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/06131 ,  H01L2224/06179 ,  H01L2224/06505 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3511

摘要： A semiconductor package is provided with a functionally necessary minimum number of components with which stress concentrated on specific solder bumps is reduced and ruptures of the bumps are prevented even when stress caused by physical bending or a difference in thermal expansion coefficient is applied to the package. The semiconductor package includes a tabular die and bonding pads arranged on a mounting surface of the die. A passivation layer and a protective film are provided on the mounting surface such that central areas of the bonding pads are open. Under-bump metals (UBMs) connected to the bonding pads are provided in the openings, and solder bumps are provided on the surfaces of the UBMs. The diameter of the UBMs provided at corners of the die is less than that of the UBM provided at the approximate center of the die so that the elastic modulus of the UBMs provided at the corners is small.

摘要翻译： 半导体封装设置有功能上必需的最小数量的组件，其中集中在特定焊料凸块上的应力被减小，并且即使当由物理弯曲引起的应力或热膨胀系数的差异施加到封装时，也可以防止凸块的破裂。 半导体封装包括布置在管芯的安装表面上的片状管芯和焊盘。 在安装表面上设置钝化层和保护膜，使得焊盘的中心区域是开放的。 连接到接合焊盘的凹凸下金属（UBM）设置在开口中，并且在UBM的表面上设置焊料凸块。 设置在模具角落处的UBM的直径小于设置在模具的大致中心处的UBM的直径，使得设置在拐角处的UBM的弹性模量小。

公开(公告)号：US20130038501A1

公开(公告)日：2013-02-14

申请号：US13368358

申请日：2012-02-08

申请人： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO ,  Katsumi TANIGUCHI

发明人： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO ,  Katsumi TANIGUCHI

IPC分类号： H01Q1/50

CPC分类号： H01Q9/0407

摘要： In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

摘要翻译： 在天线模块中，主要部分包括由柔性材料制成并彼此层叠的多个绝缘片。 配置为发送/接收高频信号的天线设置在主要部分中。 连接部分设置在主要部分中并连接到输入/输出高频信号的电子设备。 信号传输线设置在主要部分中并且具有带状结构或微带线结构以传送高频信号。 阻抗匹配电路设置在信号传输线的主要部分之间以及面向负x方向的天线与端部之间。 阻抗匹配电路设置在主体部分中，并且在连接部分和信号传输线的朝向正x方向的端部之间。

公开(公告)号：US08360324B2

公开(公告)日：2013-01-29

申请号：US12551037

申请日：2009-08-31

申请人： Shigeyuki Shioya ,  Noboru Kato ,  Yuya Dokai

发明人： Shigeyuki Shioya ,  Noboru Kato ,  Yuya Dokai

IPC分类号： G06K19/06 ,  G08B13/14 ,  H01L35/00 ,  H01Q1/36

CPC分类号： G06K19/07749 ,  H01Q1/2208 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q9/27 ,  H01Q9/285 ,  H01Q9/40 ,  H01Q21/30

摘要： A wireless IC device that is operable in a wide band and is suitable for RFID systems includes a radiating plate and an electromagnetically coupled module constituted by a wireless IC that processes transmitted/received signals and a feeding circuit board having a feeding circuit and coupled with the wireless IC. The radiating plate includes a linear electrode bent at a bent portion and apparently sectioned into two linear electrode portions having different lengths. The electromagnetically coupled module is arranged such that the feeding circuit board and the linear electrode portions are electromagnetically coupled. The wireless IC is operated by signals received by the radiating plate, and response signals from the wireless IC are radiated outward from the radiating plate.

摘要翻译： 可在宽带中操作并且适用于RFID系统的无线IC器件包括辐射板和由处理发射/接收信号的无线IC构成的电磁耦合模块，以及具有馈电电路的馈电电路板，并与 无线IC。 辐射板包括在弯曲部分弯曲并且明显地分成具有不同长度的两个线性电极部分的线性电极。 电磁耦合模块被布置成使得馈电电路板和线性电极部分电磁耦合。 无线IC由辐射板接收的信号操作，来自无线IC的响应信号从辐射板向外辐射。

公开(公告)号：US20120325915A1

公开(公告)日：2012-12-27

申请号：US13600256

申请日：2012-08-31

申请人： Noboru KATO ,  Hiromi MURAYAMA

发明人： Noboru KATO ,  Hiromi MURAYAMA

IPC分类号： G06K19/073

CPC分类号： H04B5/0037 ,  H01Q1/2225 ,  H01Q7/00 ,  H01Q21/29 ,  H02J5/005 ,  H02J50/20 ,  H04B5/0081

摘要： A radio communication device includes a radio frequency IC chip configured to process a radio signal, a feeding circuit board that is coupled to the radio frequency IC chip and includes a loop electrode including coil patterns having a predetermined winding width, and an antenna pattern that is magnetically coupled to the loop electrode. The feeding circuit board is arranged so that, in plan view, a first region of the loop electrode in which the coil patterns extend in a first direction overlaps the antenna pattern and a second region of the loop electrode in which the coil patterns extend in a second direction opposite to the first direction do not overlap the antenna pattern. The first direction and a line length direction of the antenna pattern are the same or substantially the same.

摘要翻译： 无线电通信装置包括被配置为处理无线电信号的射频IC芯片，耦合到射频IC芯片的馈电电路板，并且包括具有预定绕组宽度的线圈图案的环形电极，以及天线图案 磁耦合到环形电极。 供电电路板被布置成使得在平面图中，线圈图案沿第一方向延伸的环形电极的第一区域与天线图案重叠，并且环形电极的第二区域中线圈图案在其中延伸 与第一方向相反的第二方向不与天线图案重叠。 天线图案的第一方向和行长度方向相同或基本相同。

公开(公告)号：US20120306714A1

公开(公告)日：2012-12-06

申请号：US13558747

申请日：2012-07-26

申请人： Kuniaki YOSUI ,  Noboru KATO

发明人： Kuniaki YOSUI ,  Noboru KATO

IPC分类号： H01Q7/06

CPC分类号： H01Q1/2216 ,  G06K19/07777 ,  H01Q1/2208 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q7/06 ,  H04B5/0037 ,  H04B5/0081

摘要： An antenna apparatus includes a power supply coil, a booster electrode sheet, a magnetic sheet, and a ground substrate arranged in this order from the top. The power supply coil includes a spiral coil conductor located on a flexible substrate. The booster electrode sheet includes a booster electrode located on an insulating substrate. The booster electrode includes a conductor region covering the coil conductor, a conductor aperture covering a coil window, and a slit portion connecting the outer edge of the conductor region and the conductor aperture in plan view. The magnetic sheet covers the booster electrode sheet so that the magnetic sheet covers a region slightly larger than a region including the conductor aperture and the slit portion of the booster electrode.

摘要翻译： 天线装置包括从顶部开始依次布置的电源线圈，升压电极片，磁片和接地基片。 电源线圈包括位于柔性基板上的螺旋线圈导体。 增压电极片包括位于绝缘基板上的增压电极。 升压电极包括覆盖线圈导体的导体区域，覆盖线圈窗的导体孔和在平面图中连接导体区域的外边缘和导体孔的狭缝部分。 磁性片覆盖增强电极片，使得磁性片覆盖比包括导体孔和增强电极的狭缝部的区域稍大的区域。

公开(公告)号：US20120274431A1

公开(公告)日：2012-11-01

申请号：US13546007

申请日：2012-07-11

申请人： Noboru KATO ,  Kenichi ISHIZUKA

发明人： Noboru KATO ,  Kenichi ISHIZUKA

IPC分类号： H01F27/28

CPC分类号： H01P1/2135 ,  H01F19/04 ,  H01F2027/2809 ,  H01P1/20345 ,  H01Q1/243 ,  H01Q5/371 ,  Y10T29/4902

摘要： A transformer having a high degree of coupling is connected between, for example, an antenna element and a power feed circuit. The transformer having a high degree of coupling includes a first inductance element connected to the power feed circuit and a second inductance element coupled to the first inductance element. A first end of the first inductance element is connected to the power feed circuit and a second end of the first inductance element is connected to the antenna element. A first end of the second inductance element is connected to the antenna element and a second end of the second inductance element is grounded.

摘要翻译： 具有高度耦合度的变压器连接在例如天线元件和馈电电路之间。 具有高度耦合度的变压器包括连接到馈电电路的第一电感元件和耦合到第一电感元件的第二电感元件。 第一电感元件的第一端连接到馈电电路，并且第一电感元件的第二端连接到天线元件。 第二电感元件的第一端连接到天线元件，第二电感元件的第二端接地。