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164 条记录 (耗时 0.019 秒)

    LIGHT SOURCE MODULE
    51.
    发明申请
    LIGHT SOURCE MODULE 有权
    光源模块

    公开(公告)号：US20140332829A1

    公开(公告)日：2014-11-13

    申请号：US13890262

    申请日：2013-05-09

    申请人： HTC Corporation

    发明人： Fu-Cheng Fan

    IPC分类号： H01L33/50 ,  H01L25/075

    CPC分类号： G02B6/005 ,  B82Y15/00 ,  G02B6/0001 ,  G02B6/0018 ,  G02B6/0023 ,  G02F1/133603 ,  G02F1/133609 ,  H01L25/075 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/502 ,  H01L2924/00 ,  H01L2924/0002

    摘要： A light source module includes a light guide element, at least one light-emitting element, and a quantum dot element. The light guide element has a light incident surface and a light exiting surface. The light-emitting element is disposed at the light incident surface for providing a first color light. The quantum dot element converts only a portion of the first color light into a first monochromatic light. The first color light and the first monochromatic light are mixed into a white light.

    摘要翻译： 光源模块包括导光元件，至少一个发光元件和量子点元件。 导光元件具有光入射面和光出射面。 发光元件设置在光入射面上，用于提供第一色光。 量子点元件仅将第一颜色光的一部分转换为第一单色光。 将第一色光和第一单色光混合成白光。

    LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION APPARATUS EMPLOYING THE LIGHT EMITTING DEVICE PACKAGE
    53.
    发明申请
    LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE PACKAGE, AND ILLUMINATION APPARATUS EMPLOYING THE LIGHT EMITTING DEVICE PACKAGE 有权
    用于发光装置包装的发光框架，发光装置包装件以及使用发光装置包装件的照明装置

    公开(公告)号：US20140103371A1

    公开(公告)日：2014-04-17

    申请号：US14137885

    申请日：2013-12-20

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Kyung-mi MOON ,  Young-hee SONG ,  Ill-heung CHOI ,  Jeong-wook LEE ,  Young-jin LEE

    IPC分类号： H01L25/075

    CPC分类号： H01L25/075 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.

    摘要翻译： 用于发光器件封装的引线框架，发光器件封装以及采用发光器件封装的照明设备。 所述引线框架包括多个安装部分，所述多个安装部分安装有多个发光器件芯片; 用于电路连接多个发光器件芯片的多个连接部分; 从所述多个连接部分延伸的端子部分。 发光器件封装通过将多个发光器件芯片直接安装在引线框架上并将安装的发光器件芯片封装在引线框架上而形成。 引线框架包括用于电路连接多个发光器件芯片的多个连接部分和其一部分电路暴露的端子部分。

    Backlight module
    55.
    发明授权
    Backlight module 有权
    背光模组

    公开(公告)号：US08596808B2

    公开(公告)日：2013-12-03

    申请号：US12727366

    申请日：2010-03-19

    申请人： Daekeun Yoon ,  Sangjig Lee

    发明人： Daekeun Yoon ,  Sangjig Lee

    IPC分类号： G09F13/04 ,  F21S4/00 ,  F21V9/00

    CPC分类号： H01L25/075 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133613 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided is a backlight module comprising a substrate comprising a plurality of honeycombed protrusions arranged on a surface; main tricolor light emitting diodes (LEDs), wherein on each of the honeycombed protrusions of the substrate is provided one of the main tricolor LEDs, and sub tricolor LEDs, each of which is provided between two neighboring honeycombed protrusions.

    摘要翻译： 提供了一种背光模块，包括：基板，包括布置在表面上的多个蜂窝状突起; 主要的三色发光二极管（LED），其中在基板的每个蜂窝状突起上设置有主三色LED和次三色LED之一，其中每一个都设置在两个相邻的蜂窝状突起之间。

    OPTICAL ELEMENT MODULE AND METHOD OF MANUFACTURING THE SAME
    56.
    发明申请
    OPTICAL ELEMENT MODULE AND METHOD OF MANUFACTURING THE SAME 有权
    光学元件及其制造方法

    公开(公告)号：US20130178005A1

    公开(公告)日：2013-07-11

    申请号：US13725291

    申请日：2012-12-21

    申请人： Hamamatsu Photonics K.K.

    发明人： Yoshihisa Warashina ,  Masayuki Ishida

    IPC分类号： H01L33/60 ,  H01L31/0232

    CPC分类号： H01L33/60 ,  G02B6/4214 ,  G02B6/423 ,  H01L25/075 ,  H01L31/02325 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of manufacturing an optical element module in which an optical element and a semiconductor circuit element are mounted on one surface of a silicon substrate, a mirror surface inclined at approximately 45 degrees is formed on the other surface, and an optical fiber facing the mirror surface is disposed in a V groove formed along the other surface, the method of manufacturing includes the steps of forming the mirror surface and V-shaped side surfaces of the V groove simultaneously by first crystal anisotropic etching on the other surface, and forming an attaching surface substantially perpendicular to the one surface and the other surface, which is formed at an end side of the V groove, and for attaching an end of the optical fiber, by second crystal anisotropic etching in a crystal plane orientation different from that of the first crystal anisotropic etching.

    摘要翻译： 一种光学元件模块的制造方法，其中将光学元件和半导体电路元件安装在硅衬底的一个表面上，在另一个表面上形成大约45度倾斜的镜面，并且与该镜面对置的光纤 表面设置在沿着另一个表面形成的V形槽中，该制造方法包括以下步骤：通过在另一个表面上的第一晶体各向异性蚀刻同时形成V形槽的V形侧表面和V形侧表面，并且形成附着 基本上垂直于形成在V槽的端侧的一个表面和另一个表面的表面，并且用于通过第二晶体各向异性蚀刻在不同于第一 晶体各向异性蚀刻。

    LED DEVICE WITH IMPROVED THERMAL PERFORMANCE
    57.
    发明申请
    LED DEVICE WITH IMPROVED THERMAL PERFORMANCE 有权
    具有改进的热性能的LED器件

    公开(公告)号：US20120119228A1

    公开(公告)日：2012-05-17

    申请号：US12944895

    申请日：2010-11-12

    申请人： Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Hung-Yi Kuo ,  Chyi Shyuan Chern

    发明人： Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Hung-Yi Kuo ,  Chyi Shyuan Chern

    IPC分类号： H01L33/00

    CPC分类号： H01L33/64 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.

    摘要翻译： 一种装置包括其中具有多个开口的晶片。 对于每个开口，LED器件以这样的方式耦合到导电载体和晶片，使得每个耦合的LED器件和导电载体的一部分至少部分地填充开口。 制造LED器件的方法包括在晶片中形成多个开口。 该方法还包括将发光二极管（LED）器件耦合到导电载体上。 具有导电载体的LED装置至少部分地填充每个开口。

    Edge-emitting LED light source
    58.
    发明申请
    Edge-emitting LED light source 审中-公开
    边缘发光LED光源

    公开(公告)号：US20070029555A1

    公开(公告)日：2007-02-08

    申请号：US11197010

    申请日：2005-08-04

    申请人： Steven Lester ,  Virginia Robbins ,  Jeffrey Miller ,  Scott Corzine

    发明人： Steven Lester ,  Virginia Robbins ,  Jeffrey Miller ,  Scott Corzine

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0756 ,  H01L25/075 ,  H01L33/02 ,  H01L33/08 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Edge-emitting LED light source, and method for fabricating an edge-emitting LED light source. The edge-emitting LED light source has a plurality of edge-emitting LEDs arranged in close proximity to one another to define an array of edge-emitting LEDs. Light beams separately emitted by each of the plurality of edge-emitting LEDs in the array together form a single light beam that has a generally two-dimensional cross-sectional shape, for example, a square or other rectangular shape, and an increased overall light flux.

    摘要翻译： 边缘发光LED光源，以及制造边缘发光LED光源的方法。 边缘发射LED光源具有彼此靠近布置的多个边缘发射LED，以限定边缘发射LED的阵列。 阵列中的多个边缘发光LED中的每一个单独发射的光束一起形成具有大致二维横截面形状的单个光束，例如正方形或其它矩形形状，以及增加的整体光线 助焊剂

    Light emitting diode and method of making the same
    59.
    发明申请
    Light emitting diode and method of making the same 审中-公开
    发光二极管及其制作方法

    公开(公告)号：US20040089864A1

    公开(公告)日：2004-05-13

    申请号：US10396821

    申请日：2003-03-26

    发明人： Wu-Sheng Chi ,  Tzer-Perng Chen ,  Chih-Sung Chang ,  Tzong-Liang Tsai

    IPC分类号： H01L021/00 ,  H01L027/15 ,  H01L031/12 ,  H01L033/00

    CPC分类号： H01L25/075 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention provides a structure of white light-emitting diode (LED) and a method of making the same. The structure according to the present invention comprises two LED chips that have light-emitting layers of multi-layer epitaxial structure and emit the lights of one or more colors. The structure comprises an LED emitting the visible light of short wavelength, and another LED emitting the visible light of long wavelength. Wherein, at least one chip in the present invention has two or more transition energy levels used for emitting two or more colored lights. With the use of the present invention, multiple colored lights emitted by the LED can be mixed into full-spectral white light source having excellent color rendering property and high light emitting efficiency. The white LED in the present invention is an ideal light source for general-purpose illumination applications

    摘要翻译： 本发明提供一种白色发光二极管（LED）的结构及其制造方法。 根据本发明的结构包括具有多层外延结构的发光层并发射一种或多种颜色的光的两个LED芯片。 该结构包括发射短波长可见光的LED和发射长波长可见光的另一LED。 其中，本发明中的至少一个芯片具有用于发射两个或更多个彩色光的两个或多个过渡能级。 利用本发明，由LED发出的多个彩色光可以混合成具有优异显色性和高发光效率的全光谱白光源。 本发明中的白色LED是用于通用照明应用的理想光源