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公开(公告)号：US20230187849A1
公开(公告)日：2023-06-15
申请号：US18164162
申请日：2023-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehoon SONG , Seunghan SEO , Youngjin KANG , Seokwon KIM , Dongyeon KIM , Dongil SON
CPC classification number: H01Q25/002 , H01Q1/243 , G01S5/06 , H01Q21/08 , H01Q9/0407
Abstract: An electronic device having antennas is provided. The electronic device includes a housing at least partially comprising a conductive part, an antenna module disposed in an inner space and comprising a substrate disposed in the inner space, an array antenna disposed on the substrate and supporting a first communication mode, and two or more antennas disposed on the substrate and supporting a second communication mode, a first wireless communication circuit disposed in the inner space and configured to transmit and/or receive a wireless signal of the first communication mode by means of the array antenna, a second wireless communication circuit disposed in the inner space and configured to transmit and/or receive a wireless signal of the second communication mode by means of the two or more antennas, and at least one processor electrically connected to the first wireless communication circuit and second wireless communication circuit.
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52.发明公开公开(公告)号：US20230170948A1
公开(公告)日：2023-06-01
申请号：US18159332
申请日：2023-01-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Janghoon HAN , Dongil SON , Yeonwoo KIM , Sunmin HWANG
IPC: H04B7/0426 , H04B7/06 , H04B7/0408 , H04W52/36
CPC classification number: H04B7/043 , H04B7/0408 , H04B7/0695 , H04W52/367
Abstract: A mobile electronic device may be configured to identify multiple beams is provided. The mobile electronic device includes a first beam and a second beam for communication with at least one base station, when the first beam and the second beam correspond to the same first direction, identify a third beam which corresponds to a direction differing from the first direction and has a strength of a signal received from the at least one base station, the strength being equal to or greater than a designated value, when the identification of the third beam fails, apply, to the first beam and the second beam, a power back-off for multiple beams corresponding to the same direction, so as to perform communication with the at least one base station, and when the third beam is identified, change the second beam to the third beam and perform communication with the at least one base station without applying the power back-off for multiple beams corresponding to the same direction and by using the first beam and the third beam.
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公开(公告)号：US20230119719A1
公开(公告)日：2023-04-20
申请号：US18086094
申请日：2022-12-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngjin KANG , Dongil SON , Jaehoon SONG , Ungryeol LEE
Abstract: An electronic device is provided. The electronic device includes a first millimeter wave (mmWave) antenna module including a first array antenna, an intermediate frequency (IF) circuit electrically connected to the first mmWave antenna module through a first path, an ultra-wide band (UWB) antenna disposed to be adjacent to the first path, a UWB circuit electrically connected to the UWB antenna, and at least one processor electrically connected to the IF circuit and the UWB circuit, wherein the at least one processor controls the IF circuit to provide a signal of a first frequency band to the first mmWave antenna module, controls the UWB circuit to acquire, through the UWB antenna, a signal of a second frequency band partially overlapping the first frequency band, and may deactivate the UWB antenna or stop communication using the first mmWave antenna module according to whether a specified condition associated with the UWB antenna is satisfied.
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公开(公告)号：US20220400572A1
公开(公告)日：2022-12-15
申请号：US17893739
申请日：2022-08-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Seungbo SHIM , Yongjin WOO , Junhee HAN , Dongil SON
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in the inner space of the housing, a second printed circuit board disposed so as to overlap at least a portion of the first printed circuit board, when the first printed circuit board is viewed from above, a first interposer disposed between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board, and at least one second interposer which is disposed between the first printed circuit board and the second printed circuit board so as to be spaced apart from the first interposer when the first printed circuit board is viewed from above, and which electrically connects the first printed circuit board and the second printed circuit board.
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公开(公告)号：US20220261048A1
公开(公告)日：2022-08-18
申请号：US17733032
申请日：2022-04-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jungmin PARK , Yeonwoo KIM , Daehee PARK , Dongil SON , Janghoon HAN
IPC: G06F1/16
Abstract: An electronic device is provided, which includes a housing including a front surface on which a display glass is formed, a display panel, a display antenna layer, provided inside the housing, between the display glass and the display panel, and configured to transmit and receive a communication signal, a wireless communication module electrically connected to the display antenna layer, a grip sensor configured to detect a change in capacitance of the display antenna layer based on an approach of an external object, and a processor configured to receive a signal from the grip sensor and adjust a transmission energy of the display antenna layer, based on the received signal from the grip sensor.
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Patent Agency Ranking
56.发明申请公开(公告)号：US20220109472A1
公开(公告)日：2022-04-07
申请号：US17551786
申请日：2021-12-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyoseok NA , Dongil SON
IPC: H04B7/0456 , H01Q1/24 , H01Q3/02 , H04B7/06
Abstract: An electronic device may include a housing of which a shape is changeable, a plurality of antenna modules positioned inside the housing and including at least one antenna array, and at least one processor operatively connected to the plurality of antenna modules. The electronic device may detect a change in the shape of the housing and perform communication using a first beam book and/or a second beam book based at least on the change in the shape of the housing. In addition to the above, various embodiments identified through the specification are possible.
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公开(公告)号：US20210192858A1
公开(公告)日：2021-06-24
申请号：US17194837
申请日：2021-03-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Wooyong LEE , Yonggyoo KIM , Byunghyun MIN , Dongil SON , Chanhee YOON , Kihuk LEE , Cheolho CHEONG
Abstract: An electronic device is provided. The electronic device includes a camera, a display, and a processor configured to obtain a first image including one or more external objects by using the camera, display to output a three-dimensional (3D) object generated based on attributes related to a face among the one or more external objects using the display, receive a selection of at least one graphic attribute from a plurality of graphic attributes which can be applied to the 3D object, generate a 3D avatar for the face based on the at least one graphic attribute, and generate a second image including at least one object reflecting a predetermined facial expression or motion using the 3D avatar.
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公开(公告)号：US20210144856A1
公开(公告)日：2021-05-13
申请号：US17091349
申请日：2020-11-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Seungbo SHIM , Seunggoo KANG , Seockkeun HAN , Dongil SON
Abstract: Provided is an electronic device. The electronic device may include a housing; a first printed circuit board (PCB) disposed in an internal space of the housing and including a plurality of first conductive terminals; a second PCB arranged parallel to the first PCB in the internal space, and including a plurality of second conductive terminals; and an interposer disposed between the first PCB and the second PCB to electrically connect the first PCB and the second PCB, the interposer including: a dielectric substrate including a first substrate surface facing the first PCB, a second substrate surface facing the second PCB, and a substrate side surface surrounding a space between the first substrate surface and the second substrate surface; a plurality of conductive vias formed to penetrate from the first substrate surface of the dielectric substrate to the second substrate surface, and electrically connecting the plurality of first conductive terminals to the plurality of second conductive terminals; and a first conductive pattern formed from at least a portion of the substrate side surface to the first PCB, wherein the first conductive pattern may be electrically connected to a first conductive pad formed on the first PCB and electrically connected to the at least one first electrical element.
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公开(公告)号：US20210111622A1
公开(公告)日：2021-04-15
申请号：US16999644
申请日：2020-08-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungchul PARK , Dongil SON , Suha YOON , Euichang JUNG
Abstract: An apparatus and a method for controlling a voltage conversion mode in an electronic device are provided. The electronic device includes a power management module, a communication processor, and at least one processor operably connected to the communication processor, wherein the at least one processor identifies a modulation order used for communication with an external device, in a case that communication with the external device is performed using a wireless resource, and configures, based on the modulation order, a voltage conversion mode of the power management module that supplies power to the communication processor to a pulse frequency modulation (PFM) mode or a pulse width modulation (PWM) mode.
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公开(公告)号：US20210044686A1
公开(公告)日：2021-02-11
申请号：US16966797
申请日：2019-01-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Yonghwa KIM , Hyangbok LEE , Dongil SON
Abstract: Disclosed is an electronic device that includes a first printed circuit board including at least one electronic part, a first header mounted on the first printed circuit board, a first module that includes, on a first surface thereof, a first socket for engagement with the first header and includes a second header on a second surface opposite to the first surface and that performs a first function, a second module that includes, on one surface thereof, a second socket for engagement with the second header and that performs a second function, and a processor electrically connected with the first header, wherein the processor is configured to transfer at least one first signal for control of the first module or at least one second signal for control of the second module to the first header. Besides, it may be permissible to prepare various other embodiments speculated through the specification.
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