公开(公告)号：US10818435B2

公开(公告)日：2020-10-27

申请号：US15955280

申请日：2018-04-17

Applicant: Samsung Electro-Mechanics, Co., Ltd.

Inventor： Taek Jung Lee ,  Jin Kyung Joo ,  Seung Woo Song ,  Hyo Youn Lee ,  Sung Kwon An

IPC: H01G4/232 ,  H01G4/224 ,  H01G4/236 ,  H01G4/012 ,  H01G4/30 ,  H01G4/12

Abstract: A capacitor component includes a body including an active layer and an upper cover and a lower cover disposed on an upper part and a lower part of the active layer, respectively; first internal electrodes and second internal electrodes disposed inside the active layer; a first active via and a second active via extending in a thickness direction of the active layer to be connected to the first and second internal electrodes, respectively; first and second cover vias extending in a thickness direction of the lower cover to be electrically connected to the first and second active vias and disposed at an interval narrower than an interval between the first and second active vias; and first and second lower electrodes disposed in a lower surface of the lower cover to be connected to the first and second cover vias, respectively.

公开(公告)号：US10784047B2

公开(公告)日：2020-09-22

申请号：US16198473

申请日：2018-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Woo Song ,  Min Gon Lee ,  Sang Soo Park ,  Jin Man Jung ,  Woo Chul Shin ,  Jin Kyung Joo

IPC: H01G4/232 ,  H01G4/236 ,  H01G4/30 ,  H01G4/008 ,  H01G4/12

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, and a first internal electrode and a second internal electrode facing each other with the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrode, and a second external electrode electrically connected to the second internal electrode, disposed in an outer portion of the ceramic body, the first and second external electrodes comprise a first electrode layer including a conductive metal, a first plating layer disposed on the first electrode layer and including nickel (Ni), and a second plating layer disposed on the first plating layer and including tin (Sn), and a ratio (t1/t2) is within a range from 1.0 to 9.0, where t1 is a thickness of the first plating layer including nickel (Ni), and t2 is a thickness of the second plating layer including tin (Sn).

公开(公告)号：US10553364B2

公开(公告)日：2020-02-04

申请号：US15595070

申请日：2017-05-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Ok Han ,  Jin Kyung Joo ,  Jin Ju Park ,  Jae Yeol Choi ,  Hong Seok Kim

IPC: H01G4/40 ,  H01G4/232 ,  H01G2/06 ,  H01G4/008 ,  H01G4/018 ,  H01G4/30 ,  H01L21/304

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction in which the dielectric layers are stacked, and contacting the first and second internal electrodes, respectively; and first and second via electrodes formed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.

公开(公告)号：US10325725B2

公开(公告)日：2019-06-18

申请号：US15495121

申请日：2017-04-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Won Seo ,  Jin Kyung Joo ,  Ik Hwan Chang ,  Jin Woo Chun ,  Jin Man Jung

IPC: H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01K1/18 ,  H05K1/11 ,  H05K1/18 ,  H01G4/005 ,  H01G4/228

Abstract: A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. A first via electrode penetrates through the plurality of first internal electrodes and is exposed at the first surface of the capacitor body. A second via electrode penetrates through the plurality of second internal electrodes, is exposed at the first surface of the capacitor body, and is spaced apart from the first via electrode. First and second external electrodes are on a first surface of the capacitor body, spaced apart from each other, and respectively connected to end portions of the first and second via electrodes. The first and second external electrodes each include a nickel (Ni) layer on the first surface of the capacitor body and a gold (Au) plating layer on the nickel layer.

公开(公告)号：US10076036B2

公开(公告)日：2018-09-11

申请号：US15591619

申请日：2017-05-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kyo Kwang Lee ,  Jin Kyung Joo ,  Chang Su Kim ,  Ho Jun Lee

IPC: H05K1/18 ,  H05K1/11 ,  H01G4/232 ,  H01G4/012 ,  H01G4/018 ,  H01G4/30

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G4/012 ,  H01G4/018 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K2201/10015

Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with one of the dielectric layers interposed between each pair of adjacent first and second internal electrodes. First and second via electrodes penetrate through the plurality of second internal electrodes to thereby be exposed to a first surface of the capacitor body, and are disposed to be spaced apart from each other. First and second external electrodes are disposed on two side surfaces of the capacitor body and connected to opposing ends of the first internal electrodes, respectively. Third and fourth external electrodes are disposed on the first surface of the capacitor body to be spaced apart from each other, and are connected to end portions of the first and second via electrodes, respectively.