Abstract:
An electronic device may have housing structures, electrical components, and other electronic device structures. Stress sensing structures may be formed using coatings on these electronic device structures. Stress sensing structures may have strip-shaped links that extend between pads or may be formed from blanket films. A stress sensing coating may be formed from a transparent thin film. The transparent thin film may be illuminated with monochromatic light while a video camera captures video images of resulting optical interference patterns. The video images may be captured during a test in which a device structure is exposed to stress from an impact between the device and an external object. Stress sensing coatings may also be formed from layers of material that develop cracks upon exposure to stress. Stress sensing structures may be used to evaluate stress during tests and to monitor stress during normal device use.
Abstract:
Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.
Abstract:
Provided in one embodiment is a method of forming a connection mechanism in or on a bulk-solidifying amorphous alloy by casting in or on, or forming with the bulk-solidifying amorphous alloy, a machinable metal. The connection mechanism can be formed by machining the machinable metal.
Abstract:
Disclosed herein is a bulk metallic glasses (BMG) comprising 0.0001 wt % to 0.7 wt % of Be, 0.0001 wt % to 0.2 wt % of Be, or 0.06 wt % to 0.08 wt % of Be. Be may have the effect of reducing a liquidus temperature of the BMG relative to melting temperatures of individual alloying elements of the BMG.
Abstract:
Various embodiments provide apparatus and methods for melting and introducing alloy feedstock for molding by using a hollow branch having a constraint mechanism therein. In one embodiment, a hollow branch can extend upward from a cold chamber that is substantially horizontally configured. The hollow branch including a constraint mechanism can be capable of containing an alloy feedstock for melting into the molten alloy in the hollow branch and introducing the molten alloy to the cold chamber for molding.
Abstract:
Exemplary embodiments described herein relate to methods and systems for casting metal alloys into articles such as BMG articles. In one embodiment, processes involved for storing, pre-treating, alloying, melting, injecting, molding, etc. can be combined as desired and conducted in different chambers. During these processes, each chamber can be independently, separately controlled to have desired chamber environment, e.g., under vacuum, in an inert gas environment, or open to the surrounding environment. Due to the flexible, independent control of each chamber, the casting cycle time can be reduced and the production throughput can be increased. Contaminations of the molten materials and thus the final products are reduced or eliminated.
Abstract:
Described herein is a method of melting a bulk metallic glass (BMG) feedstock, comprising: heating at least a portion of the BMG feedstock to temperatures slightly below a solidus temperature of the BMG, wherein the portion remains a solid at the temperatures slightly below the solidus temperature and wherein a temperature distribution of the portion is essentially uniform; heating the portion of the BMG feedstock to temperatures above a liquidus point.
Abstract:
The disclosure provides members formed from multiple layers as well as enclosures and electronic devices that include the members. The members include glass members formed from multiple layers of glass. In some cases, the members include a protruding feature provided over a camera assembly of the electronic device. The member may define one or more through-holes that extend through the protruding feature. The protruding feature may define a textured region that may be configured to provide a matte or glossy appearance.
Abstract:
An electronic device may have a display for displaying images. The display may be coupled to a housing on a front face of the device. The housing may have a transparent portion on an opposing rear face of the device. The electronic device may have structures with an adjustable appearance. The adjustable-appearance structures may include a mask with openings or other mask elements and a corresponding overlapped patterned layer containing an array of visual elements. The visual elements may have different appearances, so that movement of the mask relative to the patterned layer changes the appearance of the adjustable-appearance structures. The state of the adjustable-appearance structure may be changed during use of the device by a user or may be adjusted then fixed during manufacturing.
Abstract:
A housing or enclosure for an electronic device is formed from a shell and chassis may positioned along an interior of the shell. The shell may be formed from a hard or cosmetic material and the chassis may be formed from a machinable material. The chassis may define one or more machined surfaces that are configured to receive or mount a component of the electronic device.