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    Magnetic sensor device
    41.
    发明授权
    Magnetic sensor device 有权

    公开(公告)号：US11796609B2

    公开(公告)日：2023-10-24

    申请号：US17506098

    申请日：2021-10-20

    Applicant: Melexis Technologies SA

    Inventor： Yves Bidaux ,  Lionel Tombez

    IPC: G01R33/07 ,  H10N52/01 ,  H10N52/80 ,  H10N52/00

    CPC classification number: G01R33/07 ,  H10N52/01 ,  H10N52/101 ,  H10N52/80

    Abstract: An integrated sensor device includes: a semiconductor substrate comprising a horizontal Hall element, and an integrated magnetic flux concentrator located substantially above said horizontal Hall element, wherein the first magnetic flux concentrator has a shape with a geometric center which is aligned with a geometric centre of the horizontal Hall element; and wherein the shape has a height H and a transversal dimension D, wherein H≥30 μm and/or wherein (H/D)≥25%. The integrated magnetic flux concentrator may be partially incorporated in the “interconnection stack”. A method is provided for producing such an integrated sensor device.

    Magnetic sensor devices, systems and methods with error detection
    42.
    发明授权
    Magnetic sensor devices, systems and methods with error detection 有权

    公开(公告)号：US11789092B2

    公开(公告)日：2023-10-17

    申请号：US17837456

    申请日：2022-06-10

    Applicant: Melexis Technologies SA

    Inventor： Zsombor Lazar ,  Mathieu Poezart ,  Lionel Tombez

    IPC: G01R33/00 ,  G01R33/07

    CPC classification number: G01R33/0029 ,  G01R33/077

    Abstract: A method of magnetic sensing uses at least two magnetic sensing elements including a first and a second magnetic sensor element. The method includes: a) measuring in a first configuration a combination of the first and second signal obtained from both sensors; b) measuring in a second configuration an individual signal obtained from the first sensor only; c) testing a consistency of the combined signal and the individual signal, or testing a consistency of signals derived therefrom, in order to detect an error. A sensor device is configured for performing this method. A sensor system includes the sensor device and optionally a second processor connected thereto.

    Magnetic sensor system
    45.
    发明授权
    Magnetic sensor system 有权

    公开(公告)号：US11754646B2

    公开(公告)日：2023-09-12

    申请号：US17688439

    申请日：2022-03-07

    Applicant: Analog Devices International Unlimited Company

    Inventor： Jochen Schmitt ,  Enno Lage ,  Michael Joseph Browne

    IPC: G01R33/09 ,  G01R33/07

    CPC classification number: G01R33/091 ,  G01R33/072 ,  G01R33/093 ,  G01R33/096 ,  G01R33/098

    Abstract: The present disclosure provides magnetic sensor system that includes a magnetic sensor package comprising a magnetic single turn sensor and a magnetic multi-turn sensor, and a shield arrangement for shielding the magnetic sensor from stray magnetic fields. The shielding arrangement comprises a ferromagnetic tube that houses one or more magnets and connects to an end of rotating shaft, such that rotation of the shaft causes a corresponding rotation of the ferromagnetic tube and magnets. The magnetic sensor package is positioned on a surface of a PCB substrate, which is positioned in close proximity to the ferromagnetic tube and magnet arrangement. A shielding device is then arranged in close proximity to the magnetic sensor package, for example, on the opposite side of the PCB substrate or directly between the PCB substrate and the ferromagnetic tube, to provide additional shielding of any stray magnetic fields. The shielding device may be in the form of a disc or a ring of ferromagnetic material that has a higher level of magnetic conductivity.

    Position sensor architecture for cameras
    47.
    发明授权
    Position sensor architecture for cameras 有权

    公开(公告)号：US11700441B1

    公开(公告)日：2023-07-11

    申请号：US17237896

    申请日：2021-04-22

    Applicant: Apple Inc.

    Inventor： Shahrooz Shahparnia ,  Anish Bhide

    IPC: H04N5/232 ,  G03B5/00 ,  G01R33/07 ,  H04N23/55 ,  G01R33/09 ,  H04N23/68

    CPC classification number: H04N23/55 ,  G01R33/07 ,  G01R33/072 ,  G01R33/098 ,  H04N23/685

    Abstract: A camera system may include circuitry for measuring the positions of an optics assembly (e.g., one or more lenses) and/or an image sensor of the camera system. The circuitry may include analog circuits comprising a first and a second position sensors to produce a first and a second sensor signals based on a first magnetic field and a second magnetic field respectively. The magnetic fields may have the same or different polarities detectable by the position sensors. The position sensors may be coupled in parallel in the same or reverse directions to produce a combined sensor output. The circuitry may determine position information for the optics assembly and/or the image sensor based on the combined sensor output. The camera system may use the position information as a feedback signal to control the position of the optics assembly (e.g., for autofocus) and/or the position of the image sensor (e.g., for optical image stabilization (OIS)).

    COMPOSITE MOLDED COMPONENT
    49.
    发明公开
    COMPOSITE MOLDED COMPONENT 审中-公开

    公开(公告)号：US20230213363A1

    公开(公告)日：2023-07-06

    申请号：US18000495

    申请日：2021-05-19

    Applicant: Sumitomo Wiring Systems, Ltd.

    Inventor： Hironobu YAMAMOTO ,  Yukitoshi TERASAKA ,  Kyungwoo KIM ,  Toshinari KOBAYASHI

    IPC: G01D11/24 ,  G01R33/07

    CPC classification number: G01D11/245 ,  G01R33/072

    Abstract: The object of the present invention is to further improve the performance of a seal between an inner molded portion and an outer molded portion. A composite molded component includes: an internal component; an inner molded portion that covers the internal component; and an outer molded portion that covers the inner molded portion. A hole that reaches the inner molded portion is formed in the outer molded portion. A ring-shaped seal portion that surrounds the hole is provided between the inner molded portion and the outer molded portion. The ring-shaped seal portion is formed of a softer material than the inner molded portion.

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