摘要:
A method for producing a laminated tile product is disclosed which comprises provided a sheet of natural stone having opposed first and second major surfaces and providing a plurality of ceramic substrates, each of the plurality of ceramic substrates having opposed first and second major surfaces. An adhesive material is provided on at least one of the first major surface of the sheet of natural stone and the first major surface of each of the plurality of ceramic substrates. The plurality of ceramic substrates and the sheet of natural stone are assembled such that the first surface of each of the plurality of ceramic substrates faces the first major surface of the sheet of natural stone with the adhesive material therebetween. Preferably, the second major surface of the ceramic substrate is polished and then the second major surface of the sheet of natural stone is polished. The resulting laminated assembly may be cut into a plurality of tiles. The laminated tiles produced by the method are also disclosed.
摘要:
A composite panel consists of a natural stone layer (1) and a reinforcing layer (13) that has a fibre layer (2) embedded in synthetic resin, and at least one layer (3) of synthetic resin. The fibre layer (2) serves as tensile reinforcement and the layer (3) of synthetic resin serves as compression reinforcement for the natural stone layer (1), so that the composite panel can absorb both positive and negative bending moments. The synthetic resin layer (3) is reinforced, for example, with a fine-mesh glass fibre textile (6) that faces towards the tensile reinforcing fibre layer (2) and an adjacent glass fibre mat (8). In order to produce the composite panels, natural stone panels that have been cut to a greater thickness are coated on both sides with the reinforcing layer (13). A plurality of coated natural stone panels are then arranged so as to be equally spaced on their center planes, and then simultaneously divided.
摘要:
Apparatus for cutting thin laminae of stone, e.g. marble, comprising a saw having two disc blades, a bogie movable beneath the saw and having a pair of vacuum-operated slab-gripping devices each of which is adapted to support a slab upwardly on its edge, and a second bogie movable in a direction transverse to the first bogie and carrying structure for tumbling a slab supported on one longitudinal edge, through 180.degree., so that it rests on its opposite longitudinal edge.
摘要:
The invention relates to a method of cutting thin laminae of stone, e.g. marble, which comprises bonding a backing layer to the opposed faces of a slab of stone, supporting the slab with backing layers attached, in an upward position on its edge, cutting the slab along a cutting plane parallel to and midway between the opposed faces of the slab to a depth which is about half the depth of the slab, tumbling the slab on to its opposite longitudinal edge, and cutting through the remainder of the depth of the slab to leave a lamina of stone adhered to each backing layer. The invention also includes apparatus for carrying out the aforesaid method, comprising a saw having two disc blades, a bogie movable beneath the saw and having a pair of vacuum-operated slab-gripping devices each of which is adapted to support a slab upwardly on its edge, and a second bogie movable in a direction transverse to the first bogie and carrying means for tumbling a slab supported on one longitudinal edge, through 180.degree., so that it rests on its opposite longitudinal edge.
摘要:
Thin sections of marble or like stone are made by sawing of a block to produce preliminary slabs which are held together, either by integral bridging portions, bonded base portions, or external shoring, while a spacer material, for example resin, is introduced into the clefts between the slabs. A second sawing operation then divides each slab into two halves, which can be ground and polished before separation.
摘要:
A bonded wafer production method for producing a bonded wafer having a thin film on a base wafer by forming an ion implanted layer in a bond wafer by implanting at least one of gas ion of a hydrogen ion and a rare gas ion from a surface of the bond wafer and, after directly bonding an ion implanted surface of the bond wafer and a surface of the base wafer together or bonding the ion implanted surface of the bond wafer and the surface of the base wafer together with an insulator film placed therebetween, delaminating the bond wafer at the ion implanted layer, wherein, as at least one of the bond wafer and the base wafer, an epitaxial wafer is used, and, as cleaning of the epitaxial wafer which is performed before the formation of an epitaxial layer, single wafer processing spin cleaning is performed.
摘要:
Methods for controlling the surface profiles of wafers sliced from an ingot with a wire saw include measuring an amount of displacement of a sidewall of a frame of the wire saw. The sidewall is connected to a bearing of a wire guide supporting a wire web in the wire saw. The measured amount of displacement of the sidewall is stored as displacement data. Based on the stored data, a pressure profile for adjusting a position of the sidewall is determined by a computing device. Pressure is applied to the sidewall using a displacement device according to the determined pressure profile to control the position of the sidewall.
摘要:
[Problem]A mortar peeling method which can keep a sound generated during a peeling work to an allowable quiet sound and can peel a mortar off a concrete framework smoothly.[Solution]In a mortar peeling method, by gradually extending a piston rod 42 of a hydraulic jack 13 in a mortar peeling device 10A forward in one direction, a cutter 14 is gradually advanced forward in one direction so as to execute a mortar peeling process of peeling a mortar 21 with a predetermined thickness off a concrete framework 20 by using the cutter 14. In the mortar peeling method, after the piston rod 42 of the hydraulic jack 13 is extended forward in one direction and the mortar 21 is peeled, by retreating the piston rod 42 rearward in one direction, a session of the mortar peeling process is completed.
摘要:
The invention relates to a method for producing a semiconductor, of the photovoltaic cell type, or similar electronic components. According to the invention, at least one silicon wafer is cut from the cross-section of a silicon rod and, after doping, a substrate is assembled on either side of the silicon wafer and the latter is cut into two parts through the thickness of the silicon, so as to form two semiconductor units each comprising a substrate and a thin silicon film.
摘要:
A thin veneer stone saw and related methods are provided. The thin veneer stone saw includes one or more circular saw blades. In an embodiment, two circular saw blades are arranged such that a masonry block, such as stone, may be sawed completely through in a single pass through the thin veneer stone saw. The stone may be delivered to, and processed through, the circular saw blades by a conveyor system. One of the circular saw blades may be centered below the top surface of the conveyor and protrude through a gap between two sections of the conveyor system. The other circular saw blade may be positioned entirely above the top surface of the conveyor system. The thin veneer stone saw may be operable to produce thin veneer stones in a variety of widths. The thin veneer stones may be used to form facade for a structure.