公开(公告)号：US08752995B2

公开(公告)日：2014-06-17

申请号：US13369801

申请日：2012-02-09

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： H01L33/64

CPC分类号： H05K1/0209 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  H05K2201/066 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting module includes a plurality of light emitting diodes; and a module substrate having a wiring portion disposed with the plurality of light emitting diodes, and a heat radiation portion folded from the wiring portion and disposed under the plurality of light emitting diodes, wherein the plurality of light emitting diodes includes a first light emitting diode disposed on a first outer region of the wiring portion, a second light emitting diode disposed on a second outer region of the wiring portion, and a third light emitting diode disposed on a center of the wiring portion, and in the heat radiation portion of the module substrate, the width between the center of the wiring portion and the end of the heat radiation portion is wider than that between the first outer region of the wiring portion and the end of the heat radiation portion.

摘要翻译： 发光模块包括多个发光二极管; 以及具有布置在所述多个发光二极管上的布线部分的模块基板和从所述布线部分折叠并设置在所述多个发光二极管下方的散热部分，其中所述多个发光二极管包括第一发光二极管 布置在布线部分的第一外部区域上，布置在布线部分的第二外部区域上的第二发光二极管和布置在布线部分的中心的第三发光二极管，以及布置在布线部分的热辐射部分中的第三发光二极管 模块基板之间，布线部分的中心与散热部分的端部之间的宽度比布线部分的第一外部区域和散热部分的端部之间的宽度宽。

公开(公告)号：US08545075B2

公开(公告)日：2013-10-01

申请号：US12067032

申请日：2007-08-17

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： F21V7/04

CPC分类号： G02F1/133605 ,  G02F1/133603

摘要： Provided are a backlight unit and a liquid crystal display apparatus including the same. The backlight unit comprises: a housing comprising an opening part; a module substrate in the opening part of the housing; a light emitting diode on the module substrate; and a reflection sheet in which the light emitting diode inserted thereto.

摘要翻译： 提供一种背光单元和包括该背光单元的液晶显示装置。 背光单元包括：壳体，包括开口部分; 在所述壳体的开口部分中的模块基板; 模块基板上的发光二极管; 以及其中插入发光二极管的反射片。

公开(公告)号：US08324638B2

公开(公告)日：2012-12-04

申请号：US13114962

申请日：2011-05-24

申请人： Wan Ho Kim ,  Jun Seok Park

发明人： Wan Ho Kim ,  Jun Seok Park

IPC分类号： H01L27/15

CPC分类号： H01L33/385 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2924/1815 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

公开(公告)号：US08282229B2

公开(公告)日：2012-10-09

申请号：US13340348

申请日：2011-12-29

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： G02F1/13357

CPC分类号： H05K3/284 ,  F21K9/00 ,  H05K1/021 ,  H05K3/3452 ,  H05K2201/10106

摘要： Provided is a light emitting module, which includes a module board, at least one light emitting diode, a metal layer and a resin material. The module board includes a photo solder resist (PSR) layer, an electrical conduction layer under the PSR layer, an insulation layer under the electrical conduction layer, and a plurality of diode holes passes through the PSR layer, the electrical conduction layer, and the insulation layer. The light emitting diode is disposed inside the plurality of diode holes and is contacted to the metal layer exposed through the plurality of diode holes.

摘要翻译： 提供了一种发光模块，其包括模块板，至少一个发光二极管，金属层和树脂材料。 模块板包括光阻抗层（PSR）层，PSR层下的导电层，导电层下的绝缘层，多个二极管孔通过PSR层，导电层和 绝缘层。 发光二极管配置在多个二极管孔的内部，与通过多个二极管孔露出的金属层接触。

公开(公告)号：US08267539B2

公开(公告)日：2012-09-18

申请号：US12698394

申请日：2010-02-02

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： G02F1/13357

CPC分类号： G02F1/133608 ,  G02F1/133603 ,  G02F2001/133613

摘要： A light emitting module and a light unit having the same are provided. The light emitting module may include a substrate including a body and a plurality of branches that extend from the body. A plurality of light emitting devices may be provided on the branches. A connector may be coupled to the body, and may be electrically connected to the plurality of light emitting devices.

摘要翻译： 提供了一种发光模块和具有该发光模块的光单元。 发光模块可以包括包括主体和从主体延伸的多个分支的基板。 可以在分支上设置多个发光装置。 连接器可以耦合到主体，并且可以电连接到多个发光器件。

公开(公告)号：US08253686B2

公开(公告)日：2012-08-28

申请号：US12275732

申请日：2008-11-21

申请人： Ki Uk Kyung ,  Jun Young Lee ,  Jun Seok Park ,  Chang Seok Bae ,  Dong Won Han ,  Jin Tae Kim

发明人： Ki Uk Kyung ,  Jun Young Lee ,  Jun Seok Park ,  Chang Seok Bae ,  Dong Won Han ,  Jin Tae Kim

IPC分类号： G06F3/033

CPC分类号： G06F3/016 ,  G06F3/03545

摘要： Provided are a pointing apparatus capable of providing haptic feedback, and a haptic interaction system and method using the same. The pointing apparatus includes a wireless communication unit, a controller, and a haptic stimulator. The wireless communication unit receives an event including haptic output information through wireless communication with the outside. The controller generates a control signal for reproducing a haptic pattern corresponding to the haptic output information. The haptic stimulator reproduces the haptic pattern by means of the control signal. Thus, it is possible to increase the performance and usability of a user interface of a user terminal including a touch screen.

摘要翻译： 提供能够提供触觉反馈的指示装置，以及使用其的触觉交互系统和方法。 指示装置包括无线通信单元，控制器和触觉刺激器。 无线通信单元通过与外部的无线通信来接收包括触觉输出信息的事件。 控制器产生用于再现与触觉输出信息对应的触觉模式的控制信号。 触觉刺激器通过控制信号再现触觉模式。 因此，可以提高包括触摸屏的用户终端的用户界面的性能和可用性。

公开(公告)号：US08104912B2

公开(公告)日：2012-01-31

申请号：US13006594

申请日：2011-01-14

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： G02F1/13357

CPC分类号： H05K3/284 ,  F21K9/00 ,  H05K1/021 ,  H05K3/3452 ,  H05K2201/10106

摘要： Provided is a light emitting module, which includes a module board, a light emitting diode, and a resin material. The module board includes a plurality of holes. The light emitting diode is in the hole. The resin material is in the hole. The module board includes a printed circuit board (PCB), and the PCB includes a photo solder resist (PSR) layer, an electrical conduction layer, and an insulation layer.

摘要翻译： 提供了一种发光模块，其包括模块板，发光二极管和树脂材料。 模块板包括多个孔。 发光二极管在孔中。 树脂材料在孔中。 模块板包括印刷电路板（PCB），PCB包括光阻抗层（PSR）层，导电层和绝缘层。

公开(公告)号：US08035121B2

公开(公告)日：2011-10-11

申请号：US11719701

申请日：2004-12-31

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： H01L29/22

CPC分类号： F21V5/04 ,  F21K9/69 ,  F21V5/045 ,  F21V29/70 ,  F21Y2115/10 ,  G02B5/1876 ,  G02B5/1885 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/056 ,  H01L2924/00014 ,  H01L2924/00

摘要： There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increased.

摘要翻译： 提供了一种发光器件封装及其制造方法。 发光装置包括：设置在金属电路板上方的多个屏障; 放置在屏障之间的空间中的多个发光器件; 以及设置在屏障的上侧的透镜单元。 因此，可以将多个发光装置作为模块格式方便地安装，并且可以提高亮度。 此外，可以提高散热器的效率。

公开(公告)号：US07821020B2

公开(公告)日：2010-10-26

申请号：US10578150

申请日：2005-07-21

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： H01L29/227

CPC分类号： H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device includes a metal base, an electrical circuit layer provided at an upper side of the metal base for providing a conductive path, a light emitting device mounted in a second region having a smaller thickness than a first region on the metal base, an insulating layer sandwiched between the metal base and the electrical circuit layer, an electrode layer provided at an upper side of the electrical circuit layer, and a wire for electrically connecting the electrode layer and the light emitting device. The light emitting device package has improved light emission efficiency since the light emitting device is placed on a small thickness portion of the metal base.

摘要翻译： 发光器件包括金属基底，设置在金属基底的上侧的用于提供导电路径的电路层，安装在具有比金属基底上的第一区域更小的厚度的第二区域中的发光器件， 夹在金属基底和电路层之间的绝缘层，设置在电路层上侧的电极层和用于电连接电极层和发光器件的导线。 发光器件封装具有改善的发光效率，因为发光器件被放置在金属基底的小厚度部分上。

公开(公告)号：US20100220473A1

公开(公告)日：2010-09-02

申请号：US12784237

申请日：2010-05-20

申请人： Jun Seok Park

发明人： Jun Seok Park

IPC分类号： F21V9/00 ,  F21V5/00 ,  F21V7/00 ,  F21S4/00 ,  F21V1/00 ,  F21V29/00

CPC分类号： F21V5/04 ,  F21K9/69 ,  F21V5/045 ,  F21V29/70 ,  F21Y2115/10 ,  G02B5/1876 ,  G02B5/1885 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/056 ,  H01L2924/00014 ,  H01L2924/00

摘要： There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increase.