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公开(公告)号：US10368457B2
公开(公告)日：2019-07-30
申请号：US15466739
申请日：2017-03-22
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
IPC: G06F1/16 , H04M1/02 , H05K7/14 , H05K5/03 , G02B7/02 , H04N5/225 , H05K5/00 , G02B13/00 , B29L31/34
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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公开(公告)号：US10353436B2
公开(公告)日：2019-07-16
申请号：US15134621
申请日：2016-04-21
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US09992891B2
公开(公告)日：2018-06-05
申请号：US14993058
申请日：2016-01-11
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
IPC: H05K5/02 , H04M1/03 , H05K5/03 , H04M1/02 , G06F1/16 , A45C11/00 , A45F5/00 , G06F3/041 , H05K5/00
CPC classification number: H05K5/03 , A45C11/00 , A45F5/00 , G06F1/1626 , G06F1/1656 , G06F3/041 , H04M1/0249 , H04M1/0266 , H05K5/0017
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号：US20180072021A1
公开(公告)日：2018-03-15
申请号：US15812058
申请日：2017-11-14
Applicant: Apple Inc.
Inventor： Douglas Weber , Christopher Prest , David Pakula , Stephen Paul Zadesky
Abstract: Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
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公开(公告)号：US20170196112A1
公开(公告)日：2017-07-06
申请号：US15466739
申请日：2017-03-22
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
CPC classification number: H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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Patent Agency Ranking
公开(公告)号：US09606579B2
公开(公告)日：2017-03-28
申请号：US13967636
申请日：2013-08-15
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
CPC classification number: H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
Abstract: Improved housings for electronic devices are disclosed. An electronic device housing can make use of at least one outer member (e.g., cover) that can be aligned, protected and/or secured with respect to other portions of the housing for the electronic device. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. Protective sides can be provided in some embodiments to protect the edges of the one or more glass surfaces so as to dissipate impact forces and thus reduce damage to the electronic device housing. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic device can be portable and in some cases handheld.
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公开(公告)号：US20160234360A1
公开(公告)日：2016-08-11
申请号：US15134621
申请日：2016-04-21
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
CPC classification number: H05K5/0247 , G06F1/1626 , G06F1/1656 , G06F1/1658 , G06F1/1684 , G06F1/1698 , H01Q1/2258 , H01Q1/241 , H01Q1/42 , H04M1/0249 , H04M1/026 , H04M1/0274 , H05K5/02 , H05K5/0208 , H05K5/03 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
Abstract translation: 这旨在通过连接多个元件构建的部件上提供化妆品。 可以将单个制造过程（诸如机械加工或研磨）应用于连接的元件以从部分或全部元件中移除材料，并且在部件的各个元件之间的界面之间形成平滑且连续的表面。 在某些情况下，材料去除过程的设置可以根据元件的材料进行调整。 例如，可以基于每个元件材料的制造或机械性质来调整设置。
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48.发明申请公开(公告)号：US20160212872A1
公开(公告)日：2016-07-21
申请号：US14993058
申请日：2016-01-11
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
CPC classification number: H05K5/03 , A45C11/00 , A45F5/00 , G06F1/1626 , G06F1/1656 , G06F3/041 , H04M1/0249 , H04M1/0266 , H05K5/0017
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
Abstract translation: 公开了一种电子设备，其具有由至少一个玻璃盖和邻近玻璃盖周边形成的外围结构形成的外壳。 周边结构可以用粘合剂固定在玻璃盖附近。 外围结构可以在玻璃盖附近模制，从而在外围结构和玻璃罩周边之间形成无间隙的界面。 在一个实施例中，外围结构至少包括内周结构和外周结构。
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公开(公告)号：US20160062398A1
公开(公告)日：2016-03-03
申请号：US14936456
申请日：2015-11-09
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers
IPC: G06F1/16
CPC classification number: H05K7/14 , B29L2031/3481 , G02B7/02 , G02B13/001 , G06F1/1626 , G06F1/1637 , G06F1/1656 , G06F1/1658 , H04M1/0202 , H04M1/0266 , H04N5/2252 , H04N5/2254 , H05K5/0086 , H05K5/03 , Y10T29/49002 , Y10T156/10
Abstract: Improved housings for electronic devices are disclosed. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. In other embodiments, apparatus, systems and methods for robustly attaching a cover portion of an electronic device to a bottom portion, e.g., a housing portion, of the electronic device are described. The electronic device can be portable and in some cases handheld.
Abstract translation: 公开了改进的电子设备外壳。 在一个实施例中，电子设备外壳可以具有由玻璃形成的一个或多个外部构件（例如，暴露的主表面），例如前表面或后表面。 一个或多个玻璃表面可以是可以固定到电子设备外壳的其它部分的外部构件组件的一部分。 在其他实施例中，描述了用于将电子设备的盖部分牢固地附接到电子设备的底部（例如，壳体部分）的装置，系统和方法。 电子设备可以是便携式的，并且在某些情况下是手持的。
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50.发明申请Techniques for Marking a Substrate Using a Physical Vapor Deposition Material 审中-公开使用物理气相沉积材料标记基材的技术公开(公告)号：US20140134429A1
公开(公告)日：2014-05-15
申请号：US14161493
申请日：2014-01-22
Applicant: Apple Inc.
Inventor： DOUGLAS WEBER , Christopher Prest , David Pakula , Stephen Paul Zadesky
CPC classification number: B32B15/04 , B05D5/06 , B05D5/068 , B05D7/52 , C23C14/024 , C23C14/042 , Y10T428/265 , Y10T428/31645 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31855
Abstract: Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
Abstract translation: 公开了用于在诸如电子设备的产品上提供标记的技术，工艺和结构。 例如，可以使用物理气相沉积（PVD）工艺形成标记以沉积一层材料。 标记或标签可以是文字和/或图形。 标记沉积在设置在要标记的表面上的柔顺层上。 柔性层布置成将待标记的表面与使用PVD工艺沉积的材料层隔离。
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