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    GLASS COVER MEMBER FOR AN ELECTRONIC DEVICE ENCLOSURE
    43.
    发明申请
    GLASS COVER MEMBER FOR AN ELECTRONIC DEVICE ENCLOSURE 有权

    公开(公告)号：US20210303031A1

    公开(公告)日：2021-09-30

    申请号：US17185723

    申请日：2021-02-25

    Applicant: Apple Inc.

    Inventor： Joseph C. Poole ,  Matthew S. Rogers ,  Dale N. Memering

    IPC: G06F1/16

    Abstract: The disclosure provides members formed from multiple layers as well as enclosures and electronic devices that include the members. The members include glass members formed from multiple layers of glass. In some cases, the members include a protruding feature provided over a camera assembly of the electronic device. The member may define one or more through-holes that extend through the protruding feature. The protruding feature may define a textured region that may be configured to provide a matte or glossy appearance.

    Methods for constructing parts with improved properties using metallic glass alloys
    47.
    发明授权
    Methods for constructing parts with improved properties using metallic glass alloys 有权

    公开(公告)号：US10161025B2

    公开(公告)日：2018-12-25

    申请号：US14690239

    申请日：2015-04-17

    Applicant: Apple Inc.

    Inventor： Joseph C. Poole ,  Theodore A. Waniuk ,  Jeffrey L. Mattlin ,  Michael S. Nashner ,  Christopher D. Prest

    IPC: C22C1/00 ,  C22C45/00 ,  B05D5/00 ,  B22F3/105 ,  B22F3/11 ,  B22F9/08 ,  C22C33/02 ,  C22C47/14 ,  C22C49/14

    Abstract: Described herein are methods of constructing a part having improved properties using metallic glass alloys, layer by layer. In accordance with certain aspects, a layer of metallic glass-forming powder is deposited to selected positions and then fused to a surface layer (i.e. layer below) by suitable methods such as laser heating or electron beam heating. The deposition and fusing are then repeated as need to construct the part, layer by layer. In certain embodiments, one or more sections or layers of non-metallic glass-forming material can be included as needed to form a composite final part. In certain aspects, the metallic glass-forming powder may be crystalized during depositing and fusing, or may be recrystallized during subsequent processing to provide selectively crystalized sections or layers, e.g., to impart desired functionality. In other aspects, non-metallic glass-forming materials may be deposited and fused at selected positions, e.g., to provide selective shear banding to impart improved ductile properties and plasticity. In yet other aspects, the metallic glass-forming powder or metallic glass material and non-metallic glass-forming material are deposited and fused to form a foam-like, bellow or similar structure, which is able to crumple under high stress to absorb energy under impact.

    Manipulating Surface Topology of BMG Feedstock
    49.
    发明申请
    Manipulating Surface Topology of BMG Feedstock 审中-公开
    操纵BMG原料的表面拓扑

    公开(公告)号：US20160102391A1

    公开(公告)日：2016-04-14

    申请号：US14740182

    申请日：2015-06-15

    Applicant: Apple Inc.

    Inventor： Christopher D. Prest ,  Joseph C. Poole ,  Joseph Stevick ,  Quoc Tran Pham ,  Theodore Andrew Waniuk

    IPC: C22C45/10 ,  C22C45/00 ,  C22C30/00 ,  C22C45/02

    CPC classification number: C22C45/10 ,  B22D17/00 ,  B22D25/06 ,  B22D41/01 ,  C22C1/002 ,  C22C1/02 ,  C22C30/00 ,  C22C33/003 ,  C22C45/00 ,  C22C45/001 ,  C22C45/003 ,  C22C45/02

    Abstract: Described herein is a feedstock comprising BMG. The feedstock has a surface with an average roughness of at least 200 microns. Also described herein is a feedstock comprising BMG. The feedstock, when supported on a support during a melting process of the feedstock, has a contact area between the feedstock and the support up to 50% of a total area of the support. These feedstocks can be made by molding ingots of BMG into a mole with surface patterns, enclosing one or more cores into a sheath with a roughened surface, chemical etching, laser ablating, machining, grinding, sandblasting, or shot peening. The feedstocks can be used as starting materials in an injection molding process.

    Abstract translation: 本文描述的是包含BMG的原料。 原料具有平均粗糙度至少为200微米的表面。 本文还描述了包含BMG的原料。 原料在原料熔化过程中支持在载体上时，在原料和载体之间具有高达载体总面积的50％的接触面积。 这些原料可以通过将BMG的铸锭成型为具有表面图案的摩尔制成，将一个或多个芯部包裹在具有粗糙表面，化学蚀刻，激光烧蚀，机械加工，研磨，喷砂或喷丸硬化的护套中。 原料可以在注射成型工艺中用作原料。

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