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公开(公告)号：US20190308762A1
公开(公告)日：2019-10-10
申请号：US16309429
申请日：2017-04-28
发明人： Yoichi Suzuki , Toshikazu Kawado , Chisa Inaka , Tatsuya Okada
摘要： An inspection device (1) includes a light source (10) projecting excitation light to an inner surface of a container (20); an imager (11) capturing a fluorescence image of fluorescence emitted from a foreign substance in response to the excitation light projected; and a detector (13) detecting the foreign substance adhering to the inner surface of the container from the fluorescence image captured by the imager. The foreign substance contains a material emitting fluorescence in response to the excitation light projected to the material. The detector includes a calculator (14) calculating an average brightness value in an inspection target region, and an adjuster (15) adjusting an image-capturing condition where the fluorescence image is captured such that the average brightness value falls within a preset range.
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公开(公告)号：US20190221466A1
公开(公告)日：2019-07-18
申请号：US16364833
申请日：2019-03-26
发明人： Yoshiyuki ARAI
IPC分类号： H01L21/683 , H01L25/075 , H01L33/62 , H01L23/00
摘要： A transfer method for transferring LED chips, a first surface of which is held on a transfer substrate, on a transfer-target substrate is provided that comprises disposing the transfer-target substrate such that the transfer-target substrate faces, across a gap, a second surface of the LED chips on an opposite side from the first surface of the LED chips, and transferring the LED chips on the transfer-target substrate by irradiating the transfer substrate with a laser light to separate the LED chips from the transfer substrate and by urging the LED chips toward the transfer-target substrate. At least the transferring of the LED chips to the transfer-target substrate being executed in a vacuum environment.
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43.发明申请公开(公告)号：US20190160483A1
公开(公告)日：2019-05-30
申请号：US16313190
申请日：2017-06-22
发明人： Kenichi SHIMATANI , Satoshi TOMOEDA
摘要： A coating pattern formation method includes adjusting lyophilicity of a pattern region provided on a substrate, and forming a coating pattern having a shape of the pattern region by applying a coating liquid to the pattern region after the adjusting of the lyophilicity of the pattern region. The lyophilicity of the pattern region is adjusted such that the pattern region is divided into a plurality of small pattern regions in at least one division direction, such that adjacent small pattern regions have different lyophilicity, such that a small pattern region spaced away from an end of the pattern region has the lowest lyophilicity among the small pattern regions in the at least one division direction, and such that the lyophilicity of the small pattern regions increases from the small pattern region having the lowest lyophilicity toward the end of the pattern region.
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公开(公告)号：US10181460B2
公开(公告)日：2019-01-15
申请号：US15562501
申请日：2016-03-29
摘要： A method for manufacturing a semiconductor device includes laminating a plurality of semiconductor wafers via an adhesive, heating such that the adhesive reaches a specific viscosity, and pressing the semiconductor wafers under a provisional pressure bonding load such that a gap between solder of through-electrodes provided to chip parts and through-electrodes of an adjacent semiconductor wafer falls within a specific range that is greater than zero, to produce a provisional pressure-bonded laminate; cutting the provisional pressure-bonded laminate with a cutter to produce a provisional pressure-bonded laminate chip part; and heating the provisional pressure-bonded laminate chip part to at least curing temperature of the adhesive and at least melting point of the solder, and pressing the provisional pressure-bonded laminate chip part under a main pressure bonding load to produce a main pressure-bonded laminate chip part such that the solder comes into contact with the through-electrodes of adjacent chip parts.
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公开(公告)号：US20180272462A1
公开(公告)日：2018-09-27
申请号：US15757156
申请日：2016-09-08
发明人： Masaki MORI
CPC分类号： B23K20/103 , B21F15/02 , B21K25/00 , B23K20/10 , B23K20/233 , B23K2101/32 , B23K2101/38 , B23K2103/08 , H01L39/02 , H01R4/68 , H01R43/0207
摘要： A superconducting wire joining method joins superconducting wires each having a superconducting layer and a stabilizing layer that contacts with the superconducting layer to cover the superconducting layer. The superconducting wire joining method includes overlapping the superconducting wires such that the stabilizing layers of the superconducting wires face each other, and performing ultrasonic joining relative to overlapped portions of the superconducting wires. The overlapping of the superconducting wires and the performing of the ultrasonic joining are performed at room temperature.
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公开(公告)号：US20180206929A1
公开(公告)日：2018-07-26
申请号：US15745614
申请日：2016-07-19
发明人： Tetsuya ABE , Chisa INAKA
CPC分类号： A61B34/76 , A61B90/00 , G05G5/03 , G09B9/00 , G09B23/285
摘要： An operational feeling reproduction device includes an operation component, an actuator, and a drive shaft. The actuator generates a haptic drive force in response to operation of the operation component. The drive shaft couples the operation component and the actuator. The haptic drive force is transmitted to the operation component through the drive shaft in response to the operation of the operation component such that an actual operational feeling is experienced. The actuator has a stationary element and a movable element. The actuator generates the haptic drive force by a relative displacement while one of the stationary element and the movable element is inserted into the other one of the stationary element and the movable element. The movable element and the operation component are coupled by the drive shaft. Center axes of the stationary element, the movable element, and the drive shaft are provided on the same axis.
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公开(公告)号：US10028796B1
公开(公告)日：2018-07-24
申请号：US15745614
申请日：2016-07-19
发明人： Tetsuya Abe , Chisa Inaka
摘要： An operational feeling reproduction device includes an operation component, an actuator, and a drive shaft. The actuator generates a haptic drive force in response to operation of the operation component. The drive shaft couples the operation component and the actuator. The haptic drive force is transmitted to the operation component through the drive shaft in response to the operation of the operation component such that an actual operational feeling is experienced. The actuator has a stationary element and a movable element. The actuator generates the haptic drive force by a relative displacement while one of the stationary element and the movable element is inserted into the other one of the stationary element and the movable element. The movable element and the operation component are coupled by the drive shaft. Center axes of the stationary element, the movable element, and the drive shaft are provided on the same axis.
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公开(公告)号：US20180199953A1
公开(公告)日：2018-07-19
申请号：US15743329
申请日：2016-07-12
申请人： National University Corporation Tokyo Medical and Dental University , TORAY ENGINEERING CO., LTD.
发明人： Kenji Kawashima , Takahiro Kanno , Ryoken Miyazaki , Keiichi Akahoshi , Daisuke Ban , Minoru Tanabe
IPC分类号： A61B17/29
摘要： A forceps system includes a forceps manipulator and a control unit. The forceps manipulator includes a forceps tip unit capable of bending with two degrees of freedom including a bending direction and a bending angle, a drive unit that generates a driving force for the forceps tip unit, an operation unit for instructing the bending direction and the bending angle, and a first detection unit that detects an angle in a rotation direction with respect to an axis of the drive transmitting unit. The control unit that controls the drive unit such that the forceps tip unit bends depending on a predetermined target bending direction and a predetermined target bending angle. The control unit sets a target bending direction on the basis of the bending direction instructed from the operation unit and the angle detected by the first detection unit.
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公开(公告)号：US20170363528A1
公开(公告)日：2017-12-21
申请号：US15627675
申请日：2017-06-20
发明人： Ryo NAKANO , Yuji OKADA , Daisuke URAKAMI , Katsuya SAKABA , Masatoshi KOBAYASHI , Koji DAN
CPC分类号： G01N11/00 , G01L19/0092 , G01N33/442
摘要： A resin flow analysis method includes dividing a mold space model into small elements, acquiring a penetration coefficient, acquiring a flow conductance, and performing flow analysis of a resin in each of the small elements in the mold space model based on a first relational expression of the small elements of a base material portion relating to the penetration coefficient and a second relational expression of the small elements of a space portion relating to the flow conductance.
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公开(公告)号：US20140353016A1
公开(公告)日：2014-12-04
申请号：US14363184
申请日：2012-11-06
CPC分类号： H05K3/125 , H05K1/0296 , H05K3/1208 , H05K3/1241 , H05K2201/09781 , H05K2203/0126 , H05K2203/1173
摘要： With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region. This allows for easier formation of the circuit pattern.
摘要翻译： 当喷嘴沿一个方向移动到基板单元时，导电油墨以带状方式从喷嘴的狭缝排出到基板单元。 导电油墨以带状方式排放到具有对导电油墨具有疏液性的拒水区域的基板单元和对导电油墨具有亲液性的亲液性区域并具有与期望的相同的形式 形成电路图案。 由此，将导电油墨施加到亲液性区域，同时导电油墨在剩余的疏液区域排斥并流入亲液性区域。 这允许更容易地形成电路图案。
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