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公开(公告)号：US10573227B2
公开(公告)日：2020-02-25
申请号：US15995248
申请日：2018-06-01
发明人： Feng Gu , Chuanbiao Liu , Kuai Qin , Xi Zheng , Yuanbin Lin
摘要： The disclosure provides an LED display unit group and display panel, including a pixel unit array of n rows and m columns of pixel units. n and m are positive integers not less than 2. Each pixel unit includes a first, a second and a third LED chip. In the i-th row, the A-electrodes of all the LED chips in m pixel units are connected together, and are electrically connected to the i-th common A-electrode pin. In the j-th column, the B-electrodes of n first LED chips are connected together and are electrically connected to the j-th first B-electrode pin, the B-electrodes of n second LED chips are connected together and electrically connected to the j-th second B-electrode pin, and the B-electrodes of n third LED chips are connected together and are electrically connected to j-th third B-electrode pin of the LED display unit group.
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公开(公告)号：US10297730B2
公开(公告)日：2019-05-21
申请号：US15816126
申请日：2017-11-17
发明人： Chuanbiao Liu , Hu Xu , Xiaofeng Liu , Zhuang Peng , Aidi Chen , Ling Li , Hongxin Chen
IPC分类号： H01L33/54 , H01L25/075 , H01L33/62 , H01L33/48 , H01L33/60
摘要： An LED device, a method for manufacturing an LED device, and an LED display module are provided. The LED device includes an LED bracket, an LED chip and an encapsulation sealant. The LED bracket includes a metal bracket and a cup cover encasing the metal bracket. The cup cover includes a reflective cup having a cavity. The LED chip is fixed in the cavity of the reflective cup. The cavity of the reflective cup is filled with the encapsulation sealant. The encapsulation sealant includes an under sealant and a surface sealant. The under sealant covers the LED chip, and the surface sealant covers the under sealant. The under sealant is a transparent layer. The surface sealant is a matte layer.
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公开(公告)号：US20130322088A1
公开(公告)日：2013-12-05
申请号：US13604987
申请日：2012-09-06
申请人： Yangcheng HUANG , Cuie WEI , Guilin WANG , Weixian LU , Changqing WU , Shunguo HUANG
发明人： Yangcheng HUANG , Cuie WEI , Guilin WANG , Weixian LU , Changqing WU , Shunguo HUANG
IPC分类号： F21V5/04
CPC分类号： G02B19/0071 , F21V5/004 , G02B19/0014 , G02B19/0061 , G02B27/0927 , G02B27/0955 , H01L33/58
摘要： Disclosed is a large-angle LED lens including a main body which has an incident surface on the inner side of the main body and an exit surface on the outer side thereof. The surfaces are provided symmetrically about the central axis of the main body. The incident and exit surfaces are transparent concave and convex surfaces, respectively. The maximum thickness d1 of the main body at the lower part and the minimum thickness d2 thereof at the top satisfy the relation: 4 4*d2; and the convex height h2 of the convex surface and the thickness d2 satisfy the relation: h2>5*d2. With the disclosure, the light-emitting angle is increased while maximizing the utilization of the light. A large-angle emission LED light source module is also disclosed herein.
摘要翻译： 公开了一种大角度LED透镜，其包括主体，该主体在主体的内侧具有入射面，其外侧具有出射面。 表面围绕主体的中心轴线对称设置。 入射面和出射面分别是透明的凹凸表面。 下部的主体的最大厚度d1和顶部的最小厚度d2满足关系：4
4 * d2; 并且凸面的凸高h2和厚度d2满足关系：h2> 5 * d2。 通过本发明，发光角度增加，同时使光的利用最大化。 此外还公开了大角度发射LED光源模块。 -
44.发明申请公开(公告)号：US20130121007A1
公开(公告)日：2013-05-16
申请号：US13579110
申请日：2010-08-25
申请人： Binhai Yu , Bairong Sun , Weiping Li , Xunli Xia , Cheng Li , Menghua Long , Lifang Liang
发明人： Binhai Yu , Bairong Sun , Weiping Li , Xunli Xia , Cheng Li , Menghua Long , Lifang Liang
CPC分类号： F21V21/00 , B23P11/00 , H01L33/486 , H01L33/62 , H01L2224/48247 , H01L2933/0033 , H01L2933/0066 , H05K1/183 , H05K2201/0394 , H05K2201/10106 , Y10T29/49996 , H01L2224/48091 , H01L2924/00014
摘要： A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.
摘要翻译： 一种用于表面贴装电源LED支架的制造方法，包括提供具有双面金属层的布线板。 另外，该方法包括形成孔。 此外，该方法包括在孔的表面设置金属层。 此外，该方法包括使布线板的金属层变厚。 该方法还包括蚀刻布线板的金属层。 此外，该方法包括切割布线板以形成单个支撑单元。 表面安装的功率LED支撑件包括双面布线板，形成在布线板中的孔和设置在布线板表面上的布线层。
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45.发明申请STRUCTURE OF HEAT DISSIPATION SUBSTRATE FOR POWER LED AND A DEVICE MANUFACTURED BY IT 失效电力LED散热基板的结构及其制造的器件公开(公告)号：US20100110692A1
公开(公告)日：2010-05-06
申请号：US12527295
申请日：2008-10-15
申请人： Binhai Yu , Junzheng Li , Xunli Xia
发明人： Binhai Yu , Junzheng Li , Xunli Xia
CPC分类号： H01L33/642 , H01L33/483 , H01L2224/48091 , H01L2924/00014
摘要： A structure of heat dissipation substrate of power LED and a device made thereof overcomes drawbacks such as complex structure of power LED, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other, and the through hole is smaller than the blind hole, and both of them share the same direction of axis; the heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit; a plurality of counterbores may be arranged on the circuit board; the circuit board may also comprise a plurality of position lines for cutting and a plurality of slots and/or holes. The power LED device manufactured by using the heat dissipation substrate includes a heat sink, a circuit board with a counterbore, a LED chip, bonding wires, and encapsulation colloid. The encapsulation colloid covers the side of the circuit board carrying the chip and lead lines, and an external electrode part is kept outside. The encapsulation colloid functions not only as a sealing layer for sealing the chip and the bonding wire, but also as an optical lens integrated with the device.
摘要翻译： 功率LED散热基板及其制造装置克服了功率LED结构复杂，制造工艺严格，生产效率低，生产成本高，产品质量不可靠等缺陷。 散热基板的结构包括在其上具有沉孔和金属线的一体式电路板，其中沉孔由通孔和彼此连通的盲孔形成，并且通孔小于盲孔， 并且它们都具有相同的轴方向; 散热器具有由上部露台和下部露台形成的一体式梯田结构; 散热器与沉孔匹配形成牢固的配合; 可以在电路板上布置多个沉孔; 电路板还可以包括用于切割的多个位置线和多个槽和/或孔。 通过使用散热基板制造的电力LED装置包括散热器，具有沉孔的电路板，LED芯片，接合线和封装胶体。 封装胶体覆盖承载芯片和引线的电路板的一侧，外部电极部分保持在外部。 封装胶体不仅用作密封芯片和接合线的密封层，而且还用作与该器件集成的光学透镜。
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公开(公告)号：US12100690B2
公开(公告)日：2024-09-24
申请号：US17281433
申请日：2019-09-26
发明人： Feng Gu , Chuanbiao Liu , Kuai Qin , Kailiang Fan
IPC分类号： H01L25/075 , H01L23/544 , H01L33/62
CPC分类号： H01L25/0753 , H01L23/544 , H01L33/62 , H01L2223/54426
摘要： Provided is an LED display unit group, comprising: an insulation substrate, a front circuit board, and a back circuit board. The front circuit board is divided into pixel areas arranged in an array of 2m rows and 2n columns. Each pixel area comprises three A-electrode pads, three LED light-emitting chips of different light emission colors, and B-electrode pads corresponding to the three LED light-emitting chips. In each pixel area, the electrode A of each LED light-emitting chip is electrically connected to a corresponding A-electrode pad, and the electrode B of each LED light-emitting chip is electrically connected to a corresponding B-electrode pad. In the same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are electrically connected to each other. In the same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of the same light emission color are electrically connected to each other.
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公开(公告)号：US11898712B2
公开(公告)日：2024-02-13
申请号：US17607045
申请日：2019-12-12
发明人： Jinhui Zhang , Yikai Yuan , Long Zhao , Chuyi Li , Cheng Li
摘要： A white light emitting device, a light bar and a light apparatus. A relative spectrum of the white light emitting device is ϕ(λ). A relative spectrum of a black body radiation with a corresponding color temperature is S(λ). An area normalization is performed on ϕ(λ) and S(λ) to convert an equal energy spectrum ϕ′(λ) of the white light emitting device and an equal energy spectrum S′(λ) of the black body radiation with the corresponding color temperature. A degree of similarity R of the equal energy spectrum of the white light emitting device and the equal energy spectrum of the black body radiation satisfies the following formula:
R
=
1
-
Σ
λ
i
λ
n
S
′
(
λ
)
-
Φ
′
(
λ
)
Σ
λ
i
λ
n
S
′
(
λ
)
,
when λi is 380 nm, λn is 680 nm, R≥85%.-
48.发明公开公开(公告)号：US20240006572A1
公开(公告)日：2024-01-04
申请号：US18215980
申请日：2023-06-29
发明人： Kuai QIN , Shaojia XIE , Bin CAI , Fangping HE , Zhuang PENG , Caineng HUO
IPC分类号： H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L2933/0066
摘要： A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer, an ink layer and an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.
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49.发明公开公开(公告)号：US20230351974A1
公开(公告)日：2023-11-02
申请号：US18136018
申请日：2023-04-18
发明人： Weineng CHEN , Xiang CHEN , Dequan ZHENG , Zhonghai YAN , Fabo LIU , Danlei GONG , Hua FAN
IPC分类号： G09G3/34
CPC分类号： G09G3/342 , G09G2310/08 , G09G2320/0626 , G09G2300/0426 , H01L25/0753
摘要： Provided are a backlight board and a driving method thereof, a backlight module and a driving method thereof, and a display device. The backlight board includes light-emitting devices arranged in rows and columns and a first connector, where each first pin of the first connector is electrically connected to first electrodes of light-emitting devices in one row, each second pin of the first connector is electrically connected to second electrodes of light-emitting devices in one column; and in one drive cycle, a first drive signal drives light-emitting devices in each row for a duration T/n at different times, and a second drive signal drives light-emitting devices in each column for a duration T/n at different times.
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公开(公告)号：US20230216011A1
公开(公告)日：2023-07-06
申请号：US18090665
申请日：2022-12-29
发明人： Libing PAN , Zhiguo XIE , Man ZHAO , Jiapeng ZHANG , Danwei LI , Pingxia LIANG , Fuhai LI
IPC分类号： H01L33/62
摘要： Provided are a bracket and a LED device. The bracket includes a lead frame and a molded structure connected to the lead frame. The lead frame includes a first lead portion, a second lead portion, and a barrier structure. The first lead portion includes a first base. The second lead portion includes a second base spaced from the first base. A gap between the first base and the second base forms a channel. The barrier structure is disposed on a side of at least one of the first base or the second base facing the channel. The barrier structure is disposed between two opposite ends of the first base and/or the second base and protrudes from the first base and/or the second base, and a length between two opposite ends of the channel is greater than a length of a middle part so that a “wide-narrow-wide” pattern is formed.
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