-
-
公开(公告)号：US2750334A
公开(公告)日：1956-06-12
申请号：US33408153
申请日：1953-01-29
申请人： UDYLITE RES CORP
发明人： HENRY BROWN
-
公开(公告)号：US1905105A
公开(公告)日：1933-04-25
申请号：US43013530
申请日：1930-02-20
发明人： KERSTEN HAROLD J
IPC分类号： C25D3/62
CPC分类号： C25D3/62
-
公开(公告)号：US11674235B2
公开(公告)日：2023-06-13
申请号：US16366064
申请日：2019-03-27
发明人： Douglas P. Riemer , Peter F. Ladwig
IPC分类号： C25D3/48 , C25D3/62 , C25D5/04 , C25D5/18 , C25D7/00 , H05K3/18 , H05K1/09 , C25D5/10 , C25D5/00
CPC分类号： C25D7/00 , C25D3/48 , H05K1/09 , H05K3/188 , C25D5/10 , C25D5/623 , H05K2201/0347 , H05K2203/0723
摘要： A method of plating a copper substrate with gold that reduces or eliminates the presence of microvoids at the interface of the gold/copper substrate is described. Suitably, live entry of the substrate into the plating bath is performed with application of external current to the bath such that no portion of the substrate is exposed to the bath for more than one second without the application of the external current. Increase of the applied current for gold strike to the mass-transfer-limit for gold reduction accomplishes the full measure of improvement in eliminating microvoids.
-
35.发明申请公开(公告)号：US20200240030A1
公开(公告)日：2020-07-30
申请号：US16847699
申请日：2020-04-14
IPC分类号： C25D3/62
摘要： A method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide, where the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.
-
36.发明授权公开(公告)号：US10233555B2
公开(公告)日：2019-03-19
申请号：US12678984
申请日：2008-09-11
摘要： The invention relates to an electrolytic deposition in the form of a gold alloy with a thickness of between 1 and 800 microns and which includes copper. According to the invention, the deposition includes indium as the third main compound. The invention concerns the field of electroplating methods.
-
公开(公告)号：US20170215289A1
公开(公告)日：2017-07-27
申请号：US15314524
申请日：2015-05-27
IPC分类号： H05K3/46 , H05K3/24 , C25D3/56 , C25D3/60 , C25D3/48 , C25D3/12 , C25D3/30 , C25D3/62 , H05K3/28 , C25D7/06
摘要： A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.
-
38.发明授权公开(公告)号：US09683303B2
公开(公告)日：2017-06-20
申请号：US14244071
申请日：2014-04-03
摘要： The invention relates to a make-up solution for a galvanic bath comprising organometallic components, a wetting agent, a complexing agent and free cyanide, wherein the make-up solution further comprises copper in the form of copper II cyanide and potassium, and complex indium allowing, after addition of alkaline aurocyanide, to galvanically depositing a gold alloy.
-
39.发明授权Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials 有权通过电铸成形术获得黄金合金沉积而不使用有毒物质的方法公开(公告)号：US09567684B2
公开(公告)日：2017-02-14
申请号：US14452364
申请日：2014-08-05
摘要： The invention concerns the field of galvanic depositions and relates to a method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide. According to the invention, the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.
摘要翻译： 本发明涉及电沉积领域，涉及一种将金合金浸入浸入包含碱金属氰化物形式的金属金，有机金属化合物，润湿剂，多价螯合剂和游离氰化物的浴中的电镀锌的方法。 根据本发明，合金金属是双铜和氰化钾形式的铜，氰化物形式的银，允许在电极上沉积镜面明亮的黄金合金。
-
公开(公告)号：US20160048159A1
公开(公告)日：2016-02-18
申请号：US14460286
申请日：2014-08-14
发明人： Mark Thomas McCormack , Anthony Allen Fischer , Raj Master , Farah Shariff , Dennis Tom , Zulfiqar Alam
摘要： An electronic device includes an electronic component configured to receive electric current and a plated contact electrically coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the device. The plated contact includes a copper-alloy layer, a platinum-group metal (PGM) layer plated over the copper-alloy layer, and a gold-alloy layer plated over the PGM layer.
摘要翻译： 电子设备包括被配置为接收电流的电子部件和电耦合到电子部件并被配置为将电流从设备外部的系统传送到电子部件的电镀触点。 电镀触点包括铜合金层，镀在铜合金层上的铂族金属（PGM）层和镀在PGM层上的金合金层。
-
-
-
-
-
-
-
-
-
搜索结果
187 条记录 (耗时 0.014 秒)
