Micro light emitting device array and method of manufacturing the same

    公开(公告)号:US11610872B2

    公开(公告)日:2023-03-21

    申请号:US17315596

    申请日:2021-05-10

    Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

    HYBRID ELEMENT SUBSTRATE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20230064207A1

    公开(公告)日:2023-03-02

    申请号:US17982347

    申请日:2022-11-07

    Abstract: Provided is a method of fabricating a hybrid element substrate, the method including forming a plurality of first elements on a first substrate which is a silicon substrate or a silicon-on-insulator (SOI) substrate; forming a plurality of second elements on a second substrate which has a material different from a material of the first substrate; separating a plurality of second elements from the second substrate; primarily transferring the plurality of second elements onto a transfer substrate comprising a plurality of grooves by a fluidic self-assembly method such that the plurality of second elements are arranged in the plurality of grooves of the transfer substrate, respectively; and secondarily transferring, onto the first substrate, the plurality of second elements transferred onto the transfer substrate such that the plurality of second elements are next to the first elements on the first substrate and spaced apart from each other, or overlap upper portions of the first elements, respectively.

    DISPENSER FOR MICRO LED SUSPENSION AND METHOD OF TRANSFERRING MICRO LED

    公开(公告)号:US20220246448A1

    公开(公告)日:2022-08-04

    申请号:US17469390

    申请日:2021-09-08

    Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

    METHOD OF MANUFACTURING MICRO-LED DISPLAY

    公开(公告)号:US20220190192A1

    公开(公告)日:2022-06-16

    申请号:US17477875

    申请日:2021-09-17

    Abstract: Provided is a method of manufacturing a display, the method including a first operation of transferring a plurality of micro light emitting diodes (LEDs) to a plurality of wells of an interposer through a fluidic self assembly (FSA) process, a second operation of aligning a driving substrate on the interposer, a third operation of injecting a penetrating solvent between the interposer and the driving substrate, such that the penetrating solvent penetrates between the plurality of micro LEDs and the plurality of wells, and a fourth operation of transferring the plurality of micro LEDs to the driving substrate by radiating light to the interposer to vaporize the penetrating solvent.

    Capacitive micromachined ultrasonic transducer module using wire-bonding

    公开(公告)号:US09643212B2

    公开(公告)日:2017-05-09

    申请号:US14665555

    申请日:2015-03-23

    CPC classification number: B06B1/0292 H01L2224/48091 H01L2924/00014

    Abstract: Provided are capacitive micromachined ultrasonic transducer (CMUT) modules. A CMUT module includes a CMUT chip which includes a plurality of first electrode pads on a first surface thereof; a flexible printed circuit (FPC) which is disposed on the first surface of the CMUT chip, the FPC including a plurality of first holes which are configured to expose the plurality of first electrode pads; a plurality of second electrode pads formed on the FPC so as to correspond to the plurality of first electrode pads; and a plurality of wires which connect each respective one of the plurality of first electrode pads to the corresponding one of the plurality of second electrode pads.

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