公开(公告)号：US10522374B2

公开(公告)日：2019-12-31

申请号：US15857047

申请日：2017-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dongyun Yeo ,  Dougyong Sung ,  Suho Lee ,  Yun-Kwang Jeon

IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  H02N13/00 ,  H01L21/3065 ,  H01L21/324 ,  H01L21/311 ,  H01L21/3213

Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.

公开(公告)号：US20190013222A1

公开(公告)日：2019-01-10

申请号：US15857047

申请日：2017-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsung Kim ,  Myoung Soo Park ,  Dongyun Yeo ,  Dougyong Sung ,  Suho Lee ,  Yun-Kwang Jeon

IPC: H01L21/67 ,  H02N13/00 ,  H01L21/683 ,  H01L21/324 ,  H01L21/3065 ,  H01J37/32

CPC classification number: H01L21/67248 ,  H01J37/321 ,  H01J37/32724 ,  H01J37/32733 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/32137 ,  H01L21/324 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H02N13/00

Abstract: An electrostatic chuck, a substrate processing apparatus, and a method of manufacturing a semiconductor device are provided. The electrostatic chuck comprises a chuck base, an insulation plate on the chuck base, a first heater comprising a cell heater in the insulation plate, and a heater controller configured to control the cell heater. The heater controller obtains a resistance of the cell heater and compares the resistance with a threshold value to control a heating power provided to the cell heater.