公开(公告)号：US11610872B2

公开(公告)日：2023-03-21

申请号：US17315596

申请日：2021-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/13 ,  H01L23/00

Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

公开(公告)号：US20220344542A1

公开(公告)日：2022-10-27

申请号：US17591772

申请日：2022-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Seogwoo Hong ,  Kyungwook Hwang ,  Dongho Kim ,  Joonyong Park ,  Junsik Hwang

IPC: H01L33/38 ,  H01L33/10 ,  H01L33/62 ,  H01L33/20 ,  H01L25/075

Abstract: A light-emitting device may include a light-emitting cell emitting first-color light and second-color light, an insulating layer having a flat upper surface while covering the light-emitting cell, a first trench exposing a first semiconductor layer, a second trench exposing a second semiconductor layer, a first electrode in contact with the first semiconductor layer, a second electrode in contact with the second semiconductor layer, and a third electrode in contact with a third semiconductor layer.

公开(公告)号：US11469132B2

公开(公告)日：2022-10-11

申请号：US17154773

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon Kim ,  Kyungwook Hwang

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/20 ,  H01L33/62

Abstract: A method of aligning micro light emitting elements includes supplying the plurality of micro light emitting elements on a substrate including a plurality of grooves having different shapes, the plurality of micro light emitting elements being configured to be inserted exclusively and respectively into the plurality of grooves; respectively inserting the plurality of micro light emitting elements into the plurality of grooves; and aligning the plurality of micro light emitting elements, wherein at least one groove of the plurality of grooves has a shape that is different from a shape of a respective micro light emitting element inserted into the at least one groove.

公开(公告)号：US20220246448A1

公开(公告)日：2022-08-04

申请号：US17469390

申请日：2021-09-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong Park ,  Dongho Kim ,  Hyunjoon Kim ,  Seogwoo Hong ,  Kyungwook Hwang ,  Junsik Hwang

IPC: H01L21/67 ,  H01L21/673 ,  H01L33/00

Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

公开(公告)号：US20220190192A1

公开(公告)日：2022-06-16

申请号：US17477875

申请日：2021-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Seogwoo Hong ,  Kyungwook Hwang ,  Hyunjoon Kim ,  Junsik Hwang

IPC: H01L33/00 ,  H01L33/62 ,  H01L27/15

Abstract: Provided is a method of manufacturing a display, the method including a first operation of transferring a plurality of micro light emitting diodes (LEDs) to a plurality of wells of an interposer through a fluidic self assembly (FSA) process, a second operation of aligning a driving substrate on the interposer, a third operation of injecting a penetrating solvent between the interposer and the driving substrate, such that the penetrating solvent penetrates between the plurality of micro LEDs and the plurality of wells, and a fourth operation of transferring the plurality of micro LEDs to the driving substrate by radiating light to the interposer to vaporize the penetrating solvent.

公开(公告)号：US20200168663A1

公开(公告)日：2020-05-28

申请号：US16589359

申请日：2019-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhee Choi ,  Sungjin Kang ,  Kiho Kong ,  Junghun Park ,  Jinjoo Park ,  Joohun Han ,  Kyungwook Hwang

IPC: H01L27/15 ,  H01L33/14 ,  H01L33/22 ,  H01L33/40 ,  H01L33/42 ,  H01L33/50 ,  H01L33/60 ,  H01L33/00

Abstract: Provided are a display apparatus and a method of manufacturing the same. The display apparatus includes a support substrate, a driving layer provided on the support substrate and including a driving element configured to apply power to a pixel electrode, and a light-emitting layer provided on the driving layer.

公开(公告)号：US12206045B2

公开(公告)日：2025-01-21

申请号：US17477810

申请日：2021-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongho Kim ,  Kyungwook Hwang

IPC: H01L33/10 ,  H01L25/075 ,  H01L33/00 ,  H01L33/04 ,  H01L33/12 ,  H01L33/32

Abstract: Provided is a light emitting device including a buffer layer, a body provided on the buffer layer, the body including a first semiconductor layer, an active layer, and a second semiconductor layer, a reflective layer configured to reflect light incident from the active layer, and a scattering pattern provided between the first semiconductor layer and the buffer layer, the scattering pattern being configured to scatter the light incident from the active layer and light incident from the reflective layer.

公开(公告)号：US12183719B2

公开(公告)日：2024-12-31

申请号：US17483103

申请日：2021-09-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik Hwang ,  Seogwoo Hong ,  Kyungwook Hwang

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/20 ,  H01L33/50 ,  H01L33/62

Abstract: A display transferring structure includes a transfer substrate including a plurality of recesses, each of the plurality of recesses including a first trap having a space in which a predetermined object can be moved and a second trap connected to the first trap and having a shape and size in which the object can be seated; and a micro-semiconductor chip positioned in the second trap. The micro-semiconductor chip may be self-aligned in a correct position by the display transferring structure.

公开(公告)号：US12148857B2

公开(公告)日：2024-11-19

申请号：US17477875

申请日：2021-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong Park ,  Seogwoo Hong ,  Kyungwook Hwang ,  Hyunjoon Kim ,  Junsik Hwang

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/62

Abstract: Provided is a method of manufacturing a display, the method including a first operation of transferring a plurality of micro light emitting diodes (LEDs) to a plurality of wells of an interposer through a fluidic self assembly (FSA) process, a second operation of aligning a driving substrate on the interposer, a third operation of injecting a penetrating solvent between the interposer and the driving substrate, such that the penetrating solvent penetrates between the plurality of micro LEDs and the plurality of wells, and a fourth operation of transferring the plurality of micro LEDs to the driving substrate by radiating light to the interposer to vaporize the penetrating solvent.

公开(公告)号：US12148739B2

公开(公告)日：2024-11-19

申请号：US18234798

申请日：2023-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Junsik Hwang ,  Kyungwook Hwang

IPC: H01L25/075 ,  H01L27/12 ,  H01L33/50 ,  H01L33/62

Abstract: The present disclosure provides a micro-light-emitting diode display apparatus and a method of manufacturing the same. Provided is a micro-light-emitting diode (LED) display apparatus including a plurality of pixels, the micro-LED display apparatus including a driving circuit substrate, a first electrode provided on the driving circuit substrate, one or more microlight-emitting diodes (LEDs) provided on the first electrode, an insulating layer provided on the one or more micro-LEDs, a via pattern provided in the insulating layer, electrical contacts provided in the via pattern, and a second electrode provided on the electrical contacts, wherein the via pattern exposes a portion of the one or more micro-LEDs.