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    Micro light emitting device array and method of manufacturing the same preliminary class
    36.
    发明授权
    Micro light emitting device array and method of manufacturing the same preliminary class 有权

    公开(公告)号：US12166021B2

    公开(公告)日：2024-12-10

    申请号：US17990953

    申请日：2022-11-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

    IPC: H01L25/13 ,  H01L23/00

    Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

    Dispenser for micro LED suspension and method of transferring micro LED
    37.
    发明授权
    Dispenser for micro LED suspension and method of transferring micro LED 有权

    公开(公告)号：US12165890B2

    公开(公告)日：2024-12-10

    申请号：US17469390

    申请日：2021-09-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Joonyong Park ,  Dongho Kim ,  Hyunjoon Kim ,  Seogwoo Hong ,  Kyungwook Hwang ,  Junsik Hwang

    IPC: H01L21/67 ,  H01L21/673 ,  H01L33/00

    Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

    Hybrid element and method of fabricating the same
    38.
    发明授权
    Hybrid element and method of fabricating the same 有权

    公开(公告)号：US12087754B2

    公开(公告)日：2024-09-10

    申请号：US17667241

    申请日：2022-02-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

    IPC: H01L25/00 ,  H01L25/16 ,  H01L27/15

    CPC classification number: H01L25/50 ,  H01L25/167 ,  H01L27/15

    Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.

    Chip transfer apparatus
    39.
    发明授权
    Chip transfer apparatus 有权

    公开(公告)号：US12068178B2

    公开(公告)日：2024-08-20

    申请号：US17736352

    申请日：2022-05-04

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongkyun Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Kyungwook Hwang

    IPC: H01L21/67 ,  B65G51/02 ,  H01L21/673

    CPC classification number: H01L21/67121 ,  B65G51/02 ,  H01L21/67333

    Abstract: A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.

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