公开(公告)号：US20140167242A1

公开(公告)日：2014-06-19

申请号：US14103574

申请日：2013-12-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun Kim ,  Kwang Soo Kim ,  Sun Woo Yun ,  Young Ki Lee ,  Do Jae Yoo

IPC: H01L23/02

CPC classification number: H01L23/053 ,  H01L23/3735 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module.

Abstract translation: 本文公开了一种功率模块封装，包括：第一模块，其由具有一个表面和另一个表面的第一衬底构成，安装在第一衬底的一个表面上的第一半导体芯片和形成为覆盖第一半导体芯片的第一密封构件 在第一基板的厚度方向上从两侧安装在第一基板的一个表面上，并露出第一基板的另一个表面; 以及包围第一模块的壳体。

公开(公告)号：US20140167237A1

公开(公告)日：2014-06-19

申请号：US13950205

申请日：2013-07-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Tae Hyun Kim ,  Kwang Soo Kim ,  Joon Seok Chae

IPC: H01L23/495 ,  H01L23/48

CPC classification number: H01L24/73 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49811 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed herein is a power module package, including: a substrate; semiconductor chips mounted on one surface of the substrate; external connection terminals connected to one surface of the substrate; and a connecting member having one end contacting the semiconductor chips and the other end contacting the external connection terminals and electrically and mechanically connecting between the semiconductor chips and the external connection terminals.

Abstract translation: 本文公开了一种功率模块封装，包括：基板; 安装在基板的一个表面上的半导体芯片; 连接到基板的一个表面的外部连接端子; 以及连接构件，其一端接触半导体芯片，另一端接触外部连接端子，并且在半导体芯片和外部连接端子之间电气和机械连接。

公开(公告)号：US20140003013A1

公开(公告)日：2014-01-02

申请号：US13846626

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Sun Woo Yun ,  Joon Seok Chae ,  Kwang Soo Kim

IPC: H01L23/00 ,  H05K1/18

CPC classification number: H01L24/80 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/181 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10962 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/14 ,  H01L2924/0665

Abstract: Disclosed herein is a power module package including an external connection terminal; a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is buried at a predetermined depth in a thickness direction; and a semiconductor chip mounted on one surface of the substrate.

Abstract translation: 这里公开了一种功率模块封装，其包括外部连接端子; 将允许外部连接端子的一端插入其中的紧固单元埋设在厚度方向上的预定深度的基板; 以及安装在基板的一个表面上的半导体芯片。