公开(公告)号：US20140239477A1

公开(公告)日：2014-08-28

申请号：US14272681

申请日：2014-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tongsuk KIM ,  Jangwoo LEE ,  Heeseok LEE ,  Kyoungsei CHOI

IPC: H01L23/06 ,  H01L23/34 ,  H01L23/552

CPC classification number: H01L23/06 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06568 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16251 ,  H01L2924/00

Abstract: A semiconductor package including a package substrate having a chip mounting region and a peripheral region and including a ground layer formed in the peripheral region, first solder balls on the package substrate in the chip mounting region, second solder balls on the ground layer, at least one semiconductor chip stacked on the package substrate in the chip mounting region, and a package cap covering the semiconductor chip and contacting the package substrate in the peripheral region may be provided. The package cap is electrically connected to the second solder balls. Methods of fabricating the semiconductor package are also provided.

Abstract translation: 一种半导体封装，包括具有芯片安装区域和周边区域的封装基板，并且包括形成在周边区域中的接地层，在芯片安装区域中的封装基板上的第一焊球，接地层上的第二焊球，至少 可以提供在芯片安装区域中堆叠在封装基板上的一个半导体芯片，以及覆盖半导体芯片并且在周边区域中与封装基板接触的封装帽。 封装帽电连接到第二焊球。 还提供了制造半导体封装的方法。