公开(公告)号：US20110042137A1

公开(公告)日：2011-02-24

申请号：US12543290

申请日：2009-08-18

申请人： Mark Eskridge

发明人： Mark Eskridge

IPC分类号： H01L23/495

CPC分类号： H01L23/041 ,  B81B7/0048 ,  H01L23/49572 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

摘要： An apparatus and method for packaging an electronic device that mechanically isolates the electronic device from its supporting substrate, eliminating transfer of mechanical stress from the substrate to the device. The apparatus includes a plurality of elongated members that extend from a frame support to a center opening, where the ends of the elongated members together support the electronic device. The shape, material and orientation of the elongated members combine to both support the electronic device and absorb mechanical force transmitted from the substrate to the support frame. In one example, the absorbing portion is substantially perpendicular to the direction of the transmitted force and the transmitted force is absorbed by mechanical displacement of one end of the perpendicular portion. The apparatus and method are particularly effective in eliminating the negative effects of thermal expansion mismatch between the electronic device and its supporting substrate.

摘要翻译： 一种用于封装电子装置的装置和方法，其将电子装置与其支撑基板机械隔离，从而消除机械应力从基板转移到装置。 该装置包括从框架支撑件延伸到中心开口的多个细长构件，其中细长构件的端部一起支撑电子装置。 细长构件的形状，材料和取向结合在一起以支撑电子装置并吸收从衬底传递到支撑框架的机械力。 在一个示例中，吸收部分基本上垂直于透射力的方向，并且透射的力被垂直部分的一端的机械位移吸收。 该装置和方法在消除电子器件与其支撑衬底之间的热膨胀失配的负面影响方面特别有效。

公开(公告)号：US20100255622A1

公开(公告)日：2010-10-07

申请号：US12418871

申请日：2009-04-06

申请人： Mark Eskridge

发明人： Mark Eskridge

IPC分类号： H01L21/50

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K2101/42 ,  B81B7/0048 ,  B81C3/008 ,  H01L24/16 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/206

摘要： Methods of affixing a device to a support structure are disclosed. In an embodiment, the device includes a face on which is disposed at least one electrical connector. The method includes forming a ribbon suspender having a width, a first connection portion, a second connection portion, and a support portion coupling the first connection portion to the second connection portion. The support portion defines an apex portion of the ribbon suspender. The apex portion is bonded to the device. The first and second connection portions of the ribbon suspender are bonded to the support structure. The support portion of the ribbon suspender flexes to accommodate acceleration of the support structure.

摘要翻译： 公开了将装置固定到支撑结构的方法。 在一个实施例中，该装置包括面，其上设置有至少一个电连接器。 该方法包括形成具有宽度的带状悬挂件，第一连接部分，第二连接部分和将第一连接部分连接到第二连接部分的支撑部分。 支撑部分限定了带状吊杆的顶部。 顶点部分结合到装置上。 带状悬挂件的第一和第二连接部分结合到支撑结构。 带状吊架的支撑部分弯曲以适应支撑结构的加速度。

公开(公告)号：US20100105167A1

公开(公告)日：2010-04-29

申请号：US12259953

申请日：2008-10-28

申请人： Mark Eskridge ,  Galen Magendanz

发明人： Mark Eskridge ,  Galen Magendanz

IPC分类号： H01L21/98

CPC分类号： B81C3/004 ,  B81C2203/051 ,  H01L24/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  Y10S438/975 ,  H01L2924/00 ,  H01L2224/0401

摘要： A Micro ElectroMechanical Systems device according to an embodiment of the present invention is formed by dicing a MEMS wafer and attaching individual MEMS dies to a substrate. The MEMS die includes a MEMS component attached to a glass layer, which is attached to a patterned metallic layer, which in turn is attached to a number of bumps. Specifically, the MEMS component on the glass layer is aligned to one or more bumps using windows that are selectively created or formed in the metallic layer. One or more reference features are located on or in the glass layer and are optically detectable. The reference features may be seen from the front surface of the glass layer and used to align the MEMS components and may be seen through the windows and used to align the bumps. As an end result, the MEMS component may be precisely aligned with the bumps via optical detection of the reference features in the glass layer.

摘要翻译： 根据本发明的实施例的微电子机械系统装置通过将MEMS晶片切割并将各个MEMS管芯附着到基板上而形成。 MEMS管芯包括附接到玻璃层的MEMS部件，其附接到图案化的金属层，该金属层又附接到多个凸块。 具体来说，使用在金属层中选择性地形成或形成的窗口，玻璃层上的MEMS部件与一个或多个凸块对准。 一个或多个参考特征位于玻璃层上或玻璃层中，并且是可光学检测的。 可以从玻璃层的前表面看到参考特征，并且用于对准MEMS部件，并且可以通过窗户看到并且用于对准凸块。 作为最终结果，MEMS部件可以通过光学检测玻璃层中的参考特征而与凸块精确对准。

公开(公告)号：US20070159803A1

公开(公告)日：2007-07-12

申请号：US11328992

申请日：2006-01-09

申请人： Mark Eskridge

发明人： Mark Eskridge

IPC分类号： H05K7/00 ,  H01L23/48

CPC分类号： B81B7/007 ,  H01L2224/13

摘要： An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed of two or more thermotropic liquid crystal polymer (LCP) films laminated over a selected number of metal electrical conductors carrying signals into and out of package.

摘要翻译： 一种用于近密封芯片载体封装的装置和方法，具有基模和盖模具，每个基模和盖模具由基本上不可渗透的材料形成，并且由仅仅几千英寸厚度的半透性片或带基片结合， 两个或更多个热致变液晶聚合物（LCP）膜层压在选定数量的将信号传入和流出封装的金属电导体上。

公开(公告)号：US20050202585A1

公开(公告)日：2005-09-15

申请号：US11000652

申请日：2004-11-30

申请人： Mark Eskridge

发明人： Mark Eskridge

IPC分类号： B81B3/00 ,  G01P15/08 ,  G01P15/097 ,  G01P15/10 ,  G01P15/125 ,  H01L21/00 ,  G01P15/00

CPC分类号： G01P15/125 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/058 ,  B81C2201/0133 ,  G01P15/08 ,  G01P15/097 ,  G01P2015/0828 ,  G01P2015/0831

摘要： A method for suspending a movable structure form a support structure wherein first and second flat and thin arcuately shaped flexures are formed having spaced apart substantially planar and parallel opposing surfaces, each of the first and second flexures being structured for connection between a support structure and a movable structure to be suspended from the support structure and being aligned along a common axis of rotation between the support structure and the movable structure.

摘要翻译： 一种用于将可移动结构悬挂形成支撑结构的方法，其中形成具有间隔开的基本上平坦且平行的相对表面的第一和第二扁平和细弧形弯曲的弯曲部，所述第一和第二挠曲中的每一个构造成用于在支撑结构和 可移动结构从支撑结构悬挂并且沿着支撑结构和可移动结构之间的公共旋转轴对准。