公开(公告)号：US20200286926A1

公开(公告)日：2020-09-10

申请号：US16630657

申请日：2019-01-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yanan NIU ,  Jiushi WANG ,  Lei CHEN ,  Hongwei TIAN ,  Zhanfeng CAO ,  Feng GUAN ,  Feng ZHANG ,  Shi SHU ,  Kuanjun PENG ,  Yichi ZHANG ,  Qi QI

IPC: H01L27/12 ,  H01L21/02 ,  H01L29/66 ,  H01L29/786

Abstract: The present disclosure provides a display backplane and a method for manufacturing the same, a display panel, and a display device. The display backplane includes: a substrate; a first thin film transistor located on one side of the substrate; and a second thin film transistor located on the one side of the substrate, wherein: the first thin film transistor comprises a first active layer, the second thin film transistor comprises a second active layer, wherein the first active layer and the second active layer are located in a same layer, and a material of the first active layer is different from that of the second active layer.

公开(公告)号：US20200235329A1

公开(公告)日：2020-07-23

申请号：US15755034

申请日：2017-07-11

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hongwei TIAN ,  Yanan NIU

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/56

Abstract: Embodiments of the present disclosure provide an OLED package substrate, a manufacturing method thereof, and an OLED display panel. The OLED package substrate comprises a display area and a non-display area, the display area comprising a pixel definition area. The OLED package substrate comprises a base substrate, and a conductor on the base substrate and within the pixel definition area. The conductor is configured to be in contact with a cathode or an anode at a surface of an array substrate for assembly with the OLED package substrate.

公开(公告)号：US20180090521A1

公开(公告)日：2018-03-29

申请号：US15522811

申请日：2016-10-21

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hongwei TIAN ,  Yanan NIU ,  Liang TANG ,  Chaobo ZHANG ,  Luopeng CHUO

IPC: H01L27/12 ,  H01L29/66 ,  H01L29/786

CPC classification number: H01L27/1248 ,  H01L27/1255 ,  H01L27/1259 ,  H01L27/1262 ,  H01L27/3272 ,  H01L29/66757 ,  H01L29/78633 ,  H01L29/78675

Abstract: The embodiments of the present disclosure relate to an array substrate, a thin film transistor, methods for fabricating the same, and a display device. The method for fabricating the array substrate provided by the embodiments of the present disclosure comprises: forming an active layer on a substrate; forming a gate on the active layer; forming a first insulation layer on the gate; forming a light blocking portion on the first insulation layer, the light blocking portion being arranged above an edge portion of the gate, so that the light blocking portion blocks light entering the active layer from the edge portion of the gate.