公开(公告)号：US20180090521A1

公开(公告)日：2018-03-29

申请号：US15522811

申请日：2016-10-21

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hongwei TIAN ,  Yanan NIU ,  Liang TANG ,  Chaobo ZHANG ,  Luopeng CHUO

IPC: H01L27/12 ,  H01L29/66 ,  H01L29/786

CPC classification number: H01L27/1248 ,  H01L27/1255 ,  H01L27/1259 ,  H01L27/1262 ,  H01L27/3272 ,  H01L29/66757 ,  H01L29/78633 ,  H01L29/78675

Abstract: The embodiments of the present disclosure relate to an array substrate, a thin film transistor, methods for fabricating the same, and a display device. The method for fabricating the array substrate provided by the embodiments of the present disclosure comprises: forming an active layer on a substrate; forming a gate on the active layer; forming a first insulation layer on the gate; forming a light blocking portion on the first insulation layer, the light blocking portion being arranged above an edge portion of the gate, so that the light blocking portion blocks light entering the active layer from the edge portion of the gate.

公开(公告)号：US20170278897A1

公开(公告)日：2017-09-28

申请号：US15502390

申请日：2016-08-17

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.

Inventor： Ning AO ,  Luopeng CHUO ,  Chonkyu MIN ,  Jin XU

IPC: H01L27/32 ,  H01S5/42 ,  H01L33/64 ,  G09G3/3208 ,  H01S5/022

CPC classification number: H01L27/32 ,  G09G3/3208 ,  H01L33/641 ,  H01L51/5246 ,  H01S5/02236 ,  H01S5/42

Abstract: A package substrate and a manufacturing method thereof, and an OLED display device and a manufacturing method thereof are provided. The package substrate comprises a base substrate (1), the base substrate (1) includes a bonding region (11) for coating an adhesive. The package substrate further comprises a first barrier wall (2) located on the base substrate (1), and the first barrier wall (2) is arranged along an outer side edge of the bonding region (11).