公开(公告)号：US11598633B2

公开(公告)日：2023-03-07

申请号：US17378999

申请日：2021-07-19

Applicant: Applied Materials Israel Ltd.

Inventor： Alexander Mairov ,  Gal Bruner ,  Yehuda Zur

IPC: G01B15/02 ,  H01J37/302 ,  H01J37/304

Abstract: Analyzing a buried layer on a sample includes milling a spot on the sample using a charged particle beam of a focused ion beam (FIB) column to expose the buried layer along a sidewall of the spot. From a first perspective a first distance is measured between a first point on the sidewall corresponding to an upper surface of the buried layer and a second point on the sidewall corresponding to a lower surface of the buried layer. From a second perspective a second distance is measured between the first point on the sidewall corresponding to the upper surface of the buried layer and the second point on the sidewall corresponding to the lower surface of the buried layer. A thickness of the buried layer is determined using the first distance and the second distance.

公开(公告)号：US11440151B2

公开(公告)日：2022-09-13

申请号：US16435367

申请日：2019-06-07

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Yehuda Zur

IPC: H01J37/08 ,  B23Q15/22 ,  B23Q1/70 ,  H01J37/305 ,  B23Q1/30 ,  B27C5/00

Abstract: A miller, a non-transitory computer readable medium, and a method for milling a multi-layered object. The method may include (i) receiving or determining milling parameters related to a milling process, the milling parameters may include at least two out of (a) a defocus strength, (b) a duration of the milling process, (c) a bias voltage supplied to an objective lens during the milling process, (d) an ion beam energy, and (e) an ion beam current density, and (ii) forming a crater by applying the milling process while maintaining the milling parameters, wherein the applying of the milling process includes directing a defocused ion beam on the multi-layered object.

公开(公告)号：US11276557B2

公开(公告)日：2022-03-15

申请号：US16573139

申请日：2019-09-17

Applicant: Applied Materials Israel Ltd.

Inventor： Yehuda Zur

IPC: H01J37/302 ,  H01J37/305

Abstract: A miller, a non-transitory computer readable medium, and a method. The miller may include an ion beam column that may be configured to form a vertical surface in an object by applying a milling process that may include forming a vertical surface by irradiating, for a certain period of time, an area of an upper surface of an object by a defocused ion beam that comprises multiple rays. During the certain period of time and at a plane of the upper surface of the object, a majority of the multiple rays are closer to an edge of the defocused ion beam than to a center of the defocused ion beam. The focal plane of the defocused ion beam is located below the upper surface of the object.

公开(公告)号：US20220005670A1

公开(公告)日：2022-01-06

申请号：US16919013

申请日：2020-07-01

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Yehuda Zur

IPC: H01J37/30 ,  H01J37/31

Abstract: A method of evaluating a region of a sample that includes two or more sub-regions adjacent to each other that have different milling rates. The method can include: scanning a focused ion beam over the region during a single scan frame such that the ion beam is scanned over a first sub-region of the region having a first milling rate at a first scan rate and then scanned over a second sub-region of the region having a second milling rate at a second scan rate, where the second milling rate is faster than the first milling rate and second scan rate is faster than the first scan rate; and repeating the scanning process a plurality of times to etch the region to a desired depth.

公开(公告)号：US11199401B1

公开(公告)日：2021-12-14

申请号：US17011955

申请日：2020-09-03

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Yehuda Zur

IPC: G01B15/02 ,  H01J37/30 ,  H01J37/302 ,  H01J37/31

Abstract: A method of evaluating a region of a sample that includes a first sub-region and a second sub-region, adjacent to the first sub-region, the region comprising a plurality of sets of vertically-stacked double-layers extending through both the first and second sub-regions with a geometry or orientation of the vertically-stacked double layers in the first sub-region being different than a geometry or orientation of the vertically-stacked double layers in the second region resulting in the first sub-region having a first milling rate and the second sub-region having a second milling rate different than the first milling rate, the method including: milling the region of a sample by scanning a focused ion beam over the region a plurality of iterations in which, for each iteration, the focused ion beam is scanned over the first sub-region and the second sub-region generating secondary electrons and secondary ions from each of the first and second sub-regions; detecting, during the milling, at least one of the generated secondary electrons or the secondary ions; generating, in real-time, an endpoint detection signal from the at least one of detected secondary electrons or secondary ions, the endpoint detection signal including a fast oscillating signal having a first frequency and a slow oscillating signal having a second frequency, slower than the first frequency; analyzing the fast and slow oscillating signals to determine original first and second frequencies of the fast and slow oscillating signals; and estimating, in real-time, a depth of each of the first and second sub-regions based on the determined first and second frequencies.

公开(公告)号：US20210335571A1

公开(公告)日：2021-10-28

申请号：US16859974

申请日：2020-04-27

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Ilya Blayvas ,  Gal Bruner ,  Yehuda Zur ,  Alexander Mairov ,  Ron Davidescu ,  Kfir Dotan ,  Alon Litman

IPC: H01J37/305 ,  G01N1/32

Abstract: A method of evaluating a region of a sample that includes alternating layers of different material. The method includes milling, with a focused ion beam, a portion of the sample that includes the alternating layers of different material; reducing the milling area; and repeating the milling and reducing steps multiple times during the delayering process until the process is complete.

公开(公告)号：US20210036142A1

公开(公告)日：2021-02-04

申请号：US16530331

申请日：2019-08-02

Applicant: Applied Materials Israel Ltd.

Inventor： Ron Davidescu ,  Yehuda Zur

IPC: H01L29/78

Abstract: A miller, a non-transitory computer-readable medium, and a method for milling a multi-layered object. The method may include milling each structural element of an array of structural elements that are spaced apart from each other by gaps to provide the milled structural elements, wherein each milled structural element has a flat upper surface, wherein prior the milling each one of the structural elements of the array has a flat upper surface of a certain width, wherein the certain width is of a nanometric scale. The milling of each structural element of the array may include scanning a defocused ion beam of the certain width along a longitudinal axis of the structural element. A current intensity of the defocused ion beam decreases with a distance from a middle of the defocused ion beam.