公开(公告)号：US08963036B2

公开(公告)日：2015-02-24

申请号：US13902953

申请日：2013-05-27

Applicant: Apple Inc.

Inventor： Adam Mittleman ,  Nicholas G. Merz

IPC: H03K17/975 ,  H03K17/96

CPC classification number: H03K17/975 ,  H01H2215/006 ,  H01H2239/006 ,  H03K17/962 ,  H03K2217/96062 ,  H03K2217/960755 ,  Y10T29/49105 ,  Y10T307/74

Abstract: This is directed to a dome switch that includes a capacitive sensor. A dome switch can include a dome operative to deform to provide tactile feedback to a user. To provide an electrical instruction to the device, the region underneath the dome can define a free space separating conductive regions forming a capacitor. For example, a tip of the dome, a button placed between the dome and a circuit board, or a user's finger can form a first conductor of a capacitor, and a support structure for the dome can include a terminal forming a second conductor completing the capacitor. When the dome deflects, the distance between the conductors can change and provide a measurable capacitance variation, which the device can detect.

Abstract translation: 这是针对包括电容式传感器的穹顶开关。 圆顶开关可以包括操作以变形以向用户提供触觉反馈的圆顶。 为了向装置提供电气指令，圆顶下方的区域可以限定形成电容器的导电区域的自由空间。 例如，圆顶的顶端，放置在圆顶和电路板之间的按钮或用户的手指可以形成电容器的第一导体，并且用于圆顶的支撑结构可以包括形成第二导体的端子， 电容器。 当圆顶偏转时，导体之间的距离可以改变并提供可测量的电容变化，该装置可以检测。

公开(公告)号：US20140160684A1

公开(公告)日：2014-06-12

申请号：US13707175

申请日：2012-12-06

Applicant: APPLE INC.

Inventor： Michael B. Wittenberg ,  Nicholas G. Merz ,  Shayan Malek

IPC: H05K1/02 ,  H01L23/34

CPC classification number: H05K1/0201 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09063 ,  H05K2201/09781 ,  H01L2924/00

Abstract: Examples of electronic components and printed circuit board assemblies which may be configured for directional heat transport are described herein. A circuit board assembly according to the examples herein may include a plurality of stacked planar layers, including a signal layer with a plurality of signal traces, a ground layer separated from the signal layer using an insulating layer, and a plurality of heat sink traces extending from the ground layer through at least a portion of the thickness of the insulating layer, each of the plurality of heat sink traces being electrically insulated from the signal traces and coupled to ground. The circuit board assembly may further include one or more electronic components electrically coupled to the signal layer using one or more of the signal traces, with the heat sink traces arranged around the one or more electronic components such that heat is selectively directed from one location of the board (e.g. a heat source, or hotter one of a plurality of components) to another location of the board (e.g. a perimeter of the board, or off the board).

Abstract translation: 这里描述了可以被配置用于定向热传输的电子部件和印刷电路板组件的示例。 根据本文实施例的电路板组件可以包括多个堆叠的平面层，包括具有多个信号迹线的信号层，使用绝缘层与信号层分离的接地层，以及延伸的多个散热片迹线 通过绝缘层的厚度的至少一部分从接地层，多个散热片轨迹中的每一个与信号迹线电绝缘并耦合到地面。 电路板组件还可以包括使用一个或多个信号迹线电耦合到信号层的一个或多个电子部件，散热片轨迹布置在一个或多个电子部件周围，使得热量从 板（例如，热源或多个部件中较热的部件）到板的另一位置（例如板的周边或板上）。

公开(公告)号：US20140043751A1

公开(公告)日：2014-02-13

申请号：US14055784

申请日：2013-10-16

Applicant: Apple Inc.

Inventor： Nicholas G. Merz ,  John C. DiFonzo ,  Stephen P. Zadesky ,  Michael J. Prichard

IPC: G06F1/20 ,  F28D15/02 ,  F28F3/02

CPC classification number: G06F1/20 ,  F28D15/02 ,  F28D15/0275 ,  F28F3/02 ,  G02F1/133308 ,  G02F2201/503 ,  G06F1/1616 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/1658 ,  G06F1/1662 ,  G06F1/1681 ,  G06F1/183 ,  G06F1/184 ,  G06F1/187 ,  G06F1/203 ,  G11B33/08 ,  G11B33/1426 ,  H01L23/367 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20336 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract translation: 公开了一种计算设备。 该计算装置包括一个冲击安装组件，其被配置为向诸如显示器和光盘驱动器的敏感部件提供冲击吸收。 计算设备还包括由机壳和计算设备的其他结构容纳的无外壳光盘驱动器。 计算装置还包括从计算装置的发热元件移除热量的传热系统。 传热系统被配置为将发热元件热耦合到计算装置的结构构件，以便通过结构构件吸收热量，结构构件通常具有用于散热的大的表面积。