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公开(公告)号:US11930747B2
公开(公告)日:2024-03-19
申请号:US18202386
申请日:2023-05-26
发明人: Se Ryung Kim
IPC分类号: A01G7/04 , F21V23/00 , F21Y113/10
CPC分类号: A01G7/045 , F21V23/003 , F21Y2113/10
摘要: A light module includes a substrate, at least one first light source, at least one second light source, and at least one third light source. The first light source is disposed on the substrate and emits a first type of light towards a plant. The second light source is disposed on the substrate and emits a second type of light towards the plant. The third light source is disposed on the substrate and emits a third type of light towards the plant. The first to third types of light have peak wavelengths in different wavelength bands. The first type of light is UV light or blue light in a short wavelength band, the second type of light is UV light, and the third type of light is visible light.
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公开(公告)号:US20240088107A1
公开(公告)日:2024-03-14
申请号:US18515850
申请日:2023-11-21
发明人: Chung Hoon LEE , Dae Sung CHO , So Ra LEE
IPC分类号: H01L25/075 , H01L33/00 , H01L33/38 , H01L33/62
CPC分类号: H01L25/0756 , H01L25/0753 , H01L33/0093 , H01L33/382 , H01L33/62 , H01L33/32 , H01L2924/12041 , H01L2933/0016
摘要: A light emitting device includes a short wavelength light emitting portion, a long wavelength light emitting portion, and a coupling layer combining the short wavelength emitting portion and the long wavelength light emitting portion. Each of the short wavelength light emitting portion and the long wavelength light emitting portion includes a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The active layer of the long wavelength light emitting portion contains more Indium (In) than the active layer of the short wavelength light emitting portion, and the short wavelength light emitting portion emits light of a shorter wavelength than that of light emitted from the long wavelength light emitting portion.
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公开(公告)号:US11904059B2
公开(公告)日:2024-02-20
申请号:US18074516
申请日:2022-12-05
发明人: Hee Ho Bae , A Young Lee , Yeong Min Yoon
IPC分类号: A61L2/08 , H01L25/075 , H01L33/62 , F21K9/62 , H01L33/50 , A61L2/24 , F21Y115/10 , F21Y113/13
CPC分类号: A61L2/084 , A61L2/24 , F21K9/62 , H01L25/0753 , H01L33/505 , H01L33/507 , H01L33/62 , A61L2202/11 , A61L2202/14 , F21Y2113/13 , F21Y2115/10
摘要: A light emitting apparatus including a first light emitter including at least one first light emitting diode and a wavelength converter, and a second light emitter including at least one second light emitting diode, in which the first light emitting diode emits light having a central wavelength in a range of violet or blue, the second light emitting diode emits light having a central wavelength in a range of about 400 nm to 420 nm, the wavelength converter includes green and red phosphors to convert light of the first light emitting diode into the white light, in the white light, an irradiance of light emitted from the first light emitting diode is less than that from the red phosphor, and an irradiance of light emitted from the second light emitting diode is greater than that of the white light emitted from the first light emitter at the same wavelength.
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公开(公告)号:US20240025770A1
公开(公告)日:2024-01-25
申请号:US18373283
申请日:2023-09-27
发明人: Jae Young Choi , Woong Ki Jeong , Kyu Won Han , Yeo Jin Yoon
IPC分类号: C02F1/32
CPC分类号: C02F1/325 , C02F2201/322 , C02F2303/04
摘要: A light emitting module including a light source configured to irradiate ultraviolet light, a board on which the light source is disposed, a tube accommodating the board and including a transparent region to transmit the ultraviolet light emitted from the light source, a first base coupled to one side of the tube, a second base coupled to the other side of the tube, a fixation groove disposed in the tube and connected to at least one of the first and second bases, in which the board is coupled to be inserted into the fixation groove, and the fixation groove is spaced apart from a center of the first base when viewed in a cross-section perpendicular to a length direction of the tube.
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公开(公告)号:US11876069B2
公开(公告)日:2024-01-16
申请号:US18087690
申请日:2022-12-22
发明人: Jong Hyeon Chae
IPC分类号: H01L23/00 , H01L25/075 , H01L33/62
CPC分类号: H01L24/72 , H01L25/0753 , H01L33/62
摘要: A display apparatus including a circuit board, at least one LED stack configured to emit light, electrode pads disposed on the at least one LED stack and electrically connected to the at least one LED stack, and electrodes disposed on the electrode pads and electrically connected to the electrode pads, respectively, in which each of the electrodes has a fixed portion that is fixed to one of the electrode pads and an extending portion that is spaced apart from the one of the electrode pads, and the electrodes include at least two metal layers having different thermal expansion coefficients from each other.
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公开(公告)号:US11855121B2
公开(公告)日:2023-12-26
申请号:US16848914
申请日:2020-04-15
发明人: Jong Min Jang , Chang Yeon Kim , Myoung Hak Yang
CPC分类号: H01L27/15 , H01L25/0753 , H01L33/007 , H01L33/0095 , H01L33/38 , H01L33/44 , H01L33/54 , H01L33/62 , H01L2933/005 , H01L2933/0016 , H01L2933/0025 , H01L2933/0066
摘要: A light emitting chip including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a first bonding layer interposed between the first and second LED sub-units, a second bonding layer interposed between second and third LED sub-units, and a first connection electrode electrically connected to and overlapping at least one of the first, second, and third LED sub-units, the first connection electrode having first and second opposing side surfaces, the first side surface having a first length and the second side surface having a second length, in which the difference in length between the first side surface and the second side surface of the first connection electrode is greater than a thickness of at least one of the LED sub-units.
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公开(公告)号:US20230411436A1
公开(公告)日:2023-12-21
申请号:US18229143
申请日:2023-08-01
发明人: Se Hee OH , Jong Kyu Kim , Joon Sub Lee
CPC分类号: H01L27/15 , H01L33/0016 , H01L33/405 , H01L33/62
摘要: A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflection layer.
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公开(公告)号:US20230402434A1
公开(公告)日:2023-12-14
申请号:US18140072
申请日:2023-04-27
发明人: MiSo KO , EunMi CHOI
IPC分类号: H01L25/075 , H01L25/16
CPC分类号: H01L25/0753 , H01L25/167 , H01L33/62
摘要: According to one aspect of the present disclosure, there may be provided a light-emitting module, including: a base substrate; and a plurality of light emitting elements disposed on the base substrate to generate light, wherein the plurality of light emitting elements include: a first light emitting element for generating light having a first peak wavelength and a first dominant wavelength; and a second light emitting element for generating light having a second peak wavelength and a second dominant wavelength, and wherein a first absolute value, which is an absolute value of the difference between the first peak wavelength and the first dominant wavelength, is smaller than a second absolute value, which is an absolute value of the difference between the second peak wavelength and the second dominant wavelength.
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公开(公告)号:US20230378412A1
公开(公告)日:2023-11-23
申请号:US18200400
申请日:2023-05-22
发明人: Jong Min JANG , Chang Yeon KIM
IPC分类号: H01L33/62 , H01L33/24 , H01L33/56 , H01L25/075 , H01L33/00
CPC分类号: H01L33/62 , H01L33/24 , H01L33/56 , H01L25/0753 , H01L33/0008 , H01L25/0756
摘要: A light emitting device including a first light emitter, a second light emitter, and a third light emitter, each including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer. An adhesive layer includes a first adhesive portion disposed between the first light emitter, and the second light emitter, and a second adhesive portion disposed between the second light emitter and the third light emitter, in which the second light emitter is disposed between the first light emitter and the third light emitter, and the first adhesive portion and the second adhesive portion are optically transmitting and connect adjacent light emitters.
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公开(公告)号:US11824141B2
公开(公告)日:2023-11-21
申请号:US17700395
申请日:2022-03-21
发明人: Chung Hoon Lee
CPC分类号: H01L33/44 , H01L27/156 , H01L33/08 , H01L33/382 , H01L33/62
摘要: A light emitting device including a cell area, a peripheral area surrounding the cell area, a light source disposed in the cell area and including at least one light emitting layer, a first light shielding layer disposed in the cell area and the peripheral area, a portion of the first light shielding layer overlapping with the light source, and a rough structure disposed in the cell area and overlapping with the light source.
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