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    Light emitting device and method of manufacture
    32.
    发明授权
    Light emitting device and method of manufacture 有权
    发光装置及其制造方法

    公开(公告)号：US08420417B2

    公开(公告)日：2013-04-16

    申请号：US12974237

    申请日：2010-12-21

    申请人： Hwan Hee Jeong ,  Ji Hyung Moon ,  So Jung Kim ,  June O Song

    发明人： Hwan Hee Jeong ,  Ji Hyung Moon ,  So Jung Kim ,  June O Song

    IPC分类号： H01L21/00

    CPC分类号： H01L33/38 ,  H01L33/0079 ,  H01L33/405 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method of making a light emitting device includes forming an active layer between first and semiconductor layers of different conductivity types, and forming a transparent conductive layer adjacent the second semiconductor layer. The transparent conductive layer includes a first transparent conductive region contacting a first region of the second semiconductor layer and a second transparent conductive region contacting a second region of the second semiconductor layer. An electrode is formed adjacent the first semiconductor layer in vertical alignment with the second region.

    摘要翻译： 制造发光器件的方法包括在不同导电类型的第一半导体层和半导体层之间形成有源层，以及在第二半导体层附近形成透明导电层。 透明导电层包括与第二半导体层的第一区域接触的第一透明导电区域和与第二半导体层的第二区域接触的第二透明导电区域。 与第二区域垂直对准地形成与第一半导体层相邻的电极。

    Light emitting device and light emitting device package having the same
    35.
    发明授权
    Light emitting device and light emitting device package having the same 有权
    发光器件和具有该发光器件的发光器件封装

    公开(公告)号：US08354664B2

    公开(公告)日：2013-01-15

    申请号：US13024883

    申请日：2011-02-10

    申请人： Ji Hyung Moon ,  Hwan Hee Jeong ,  Sang Youl Lee ,  June O Song

    发明人： Ji Hyung Moon ,  Hwan Hee Jeong ,  Sang Youl Lee ,  June O Song

    IPC分类号： H01L29/06

    CPC分类号： H01L33/58 ,  F21K9/23 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L33/0079 ,  H01L33/20 ,  H01L33/405 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the first conductive type semiconductor layer includes a stepped structure having a second top surface stepped lower than the first top surface thereof; an insulating layer disposed on a lateral surface of the light emitting structure and the second top surface of the first conductive type semiconductor layer; an electrode electrically connected with the first conductive type semiconductor layer; an electrode layer under the second conductive type semiconductor layer; and a protective layer disposed on a periphery portion of a lower surface of the second conductive type semiconductor layer.

    摘要翻译： 公开了一种发光器件和具有该发光器件的发光器件封装。 发光器件包括在第一导电类型半导体层和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构，其中第一导电类型半导体层 包括阶梯式结构，其具有比第一顶表面低的第二顶表面; 绝缘层，设置在所述发光结构的侧表面和所述第一导电类型半导体层的所述第二顶表面上; 与第一导电型半导体层电连接的电极; 第二导电型半导体层下的电极层; 以及设置在所述第二导电型半导体层的下表面的周边部分上的保护层。

    Light emitting device and light emitting device package having the same
    36.
    发明授权
    Light emitting device and light emitting device package having the same 有权
    发光器件和具有该发光器件的发光器件封装

    公开(公告)号：US08143639B2

    公开(公告)日：2012-03-27

    申请号：US13011479

    申请日：2011-01-21

    申请人： Hwan Hee Jeong ,  Ji Hyung Moon ,  Sang Youl Lee ,  June O Song

    发明人： Hwan Hee Jeong ,  Ji Hyung Moon ,  Sang Youl Lee ,  June O Song

    IPC分类号： H01L33/00

    CPC分类号： H01L33/42 ,  H01L33/22 ,  H01L33/405 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, an electrode on the first conductive type semiconductor layer, a reflective layer under the second conductive type semiconductor layer, a protective layer at outer peripheral portions of a lower surface of the second conductive type semiconductor layer, and a light extraction structure including a compound semiconductor on the protective layer.

    摘要翻译： 公开了一种发光器件和发光器件封装。 发光器件包括在第一导电类型半导体层和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构，第一导电类型的电极 半导体层，第二导电类型半导体层下面的反射层，在第二导电类型半导体层的下表面的外周部分处的保护层，以及在保护层上包括化合物半导体的光提取结构。

    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM
    39.
    发明申请
    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM 有权
    发光装置，发光装置包装和照明系统

    公开(公告)号：US20110248237A1

    公开(公告)日：2011-10-13

    申请号：US13049126

    申请日：2011-03-16

    申请人： Kwang Ki CHOI ,  Hwan Hee Jeong ,  Sang Youl Lee ,  June O Song ,  Ji Hyung Moon

    发明人： Kwang Ki CHOI ,  Hwan Hee Jeong ,  Sang Youl Lee ,  June O Song ,  Ji Hyung Moon

    IPC分类号： H01L33/06

    CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/385 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer, a conductive layer, a bonding layer, a support member, first and second pads, and first and second electrodes. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The conductive layer is disposed under the light emitting structure layer. The bonding layer is disposed under the conductive layer. The support member is disposed under the bonding layer. The first pad is disposed under the support member. The second pad is disposed under the support member at a distance from the first pad. The first electrode is connected between the first conductive type semiconductor layer and the first pad. The second electrode is connected between the bonding layer and the second pad.

    摘要翻译： 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括发光结构层，导电层，接合层，支撑构件，第一和第二焊盘以及第一和第二电极。 发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层。 导电层设置在发光结构层的下方。 接合层设置在导电层下方。 支撑构件设置在接合层下方。 第一衬垫设置在支撑构件的下方。 第二垫片设置在支撑构件的下方距离第一垫片一定距离处。 第一电极连接在第一导电类型半导体层和第一焊盘之间。 第二电极连接在接合层和第二焊盘之间。