Invention Grant
- Patent Title: Light emitting device, light emitting device package, method of manufacturing light emitting device and illumination system
- Patent Title (中): 发光装置,发光装置封装,制造发光装置的方法和照明系统
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Application No.: US13030600Application Date: 2011-02-18
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Publication No.: US08395182B2Publication Date: 2013-03-12
- Inventor: Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
- Applicant: Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge LLP
- Priority: KR10-2010-0016043 20100223
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting device according to the embodiment includes a substrate; a protective layer on the substrate; a electrode layer on the protective layer; a light emitting structure disposed on the electrode layer to generate light and provided with a first semiconductor layer, an active layer under the first semiconductor layer, and a second conductive semiconductor layer under the active layer; and a first electrode having a first end disposed on a top surface of the light emitting structure and a second end disposed on the protective layer. The protective layer comes into Schottky contact with at least one of the electrode layer and the first electrode.
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Information query
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