Abstract:
A testing apparatus for flip chip LEDs includes a transparent substrate, a spacing member, a flexible transparent carrier, and a vacuum generator. The spacing member is configured on a first surface of the transparent substrate. The flexible transparent carrier is removably assembled to the spacing member so that a closed space is formed by the flexible transparent carrier, the spacing member, and the first surface of the transparent substrate. The vacuum generator is connected to the closed space for pumping air out of the closed space, and then a part of the transparent substrate clings to the first surface to form a testing area for loading the flip chip LED.
Abstract:
The invention discloses a light emitting component measuring system and the method thereof which is capable of measuring the optical proprieties of a plurality of the devices under test (DUT). Each DUT is capable of receiving electricity so as to output an initial ray, wherein each initial ray has a first wavelength range. The light emitting component measuring system comprises a filtering device and a sensing device. The filtering device comprises a first filtering portion which can filter a corresponding third wavelength of the said initial rays and output a plurality of first filtered rays simultaneously. Each first filtered ray has a second wavelength range respectively. The said sensing device receives the ray outputted from the filtering device and generates an optical data accordingly.
Abstract:
The present invention provides a photosensor testing device with a built-in light source and a tester provided with said device, which has a base and an upper cover disposed above the base, characterized in that the upper cover is equipped with at least one light emitting diode (LED) assembly used as a light source for a photosensor under test to undergo testing operation. Therefore, the components such as high intensity discharge lamps and optical processing devices are unnecessary any more, reducing the bulk volume of the testing device and its related cost. Besides, the testing process would be speeded up and the testing accuracy could be improved, as well as the time consumed in replacing the light source would be saved.
Abstract:
Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a SIP device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray. The apparatus also includes a sorter automatically operable to remove each SIP device that did not pass electrical testing with SIP devices that did pass electrical testing until a tray of electrically tested SIP devices is fully populated with SIP devices that did pass electrical testing.
Abstract:
A method for testing System-In-Package (SIP) devices such as micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.
Abstract:
A high-speed optical sensing device is provided in the present invention. The high-speed optical sensing device has an optical detector, a lens set, and a beam splitter. The optical detector is utilized for detecting luminous intensity. The lens set is utilized for concentrating light beams toward a color analyzer. The beam splitter is aligned to the illuminating device to be detected and is utilized to separate the light beam generated by the illuminating device to the optical detector and the lens set simultaneously.
Abstract:
A method for testing micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time. The method of the illustrative embodiment include the steps of: providing a test hive comprising a plurality of test circuits corresponding in number to at least a predetermined portion of said cells and comprising a plurality of groups of test contacts, each group of said groups of test contacts being coupled to one of said test circuits and being oriented to engage said plurality of electrical contacts of a micro SD device disposed in a corresponding one of said cells; moving each said tray from said stack one at a time to a position proximate said test hive; causing relative movement of said tray proximate said test hive whereby said test hive engages said tray of micro SD device and said test hive such that electrical connection is made simultaneously by each of said groups of test contacts with said electrical contacts of a micro SD device disposed in said corresponding of said cells; and simultaneously, electrically testing at least a predetermined portion of said micro SD devices in each tray engaged by said hive without removing said micro SD devices from said tray.
Abstract:
An automatic testing method to be used by an IC testing system equipped with multiple testing sites. In this method the testing procedural information for each IC is stored in different sets of image files that are to be read by the testing system. Thus by inputting into the testing system the identification codes of the IC's that are going to be tested, the testing system would recognize which image files to use and the testing procedure would continue automatically. This method would greatly reduce the complex procedures needed to prepare an IC for testing in the prior art, thus leaving less room for human error and increasing the accuracy of the testing procedure.
Abstract:
An interference measurement system self-alignment method, which can be realized through an optical image interference measurement system. The method comprises the following steps of: utilizing the imaging device to get the optical information of the object to be measured and store the optical information thus obtained; performing the inclination adjustment of the first direction rotation axis of the object platform based on the direction of the interference fringe in the optical information until the interference fringes are adjusted to a defined orthogonal direction, thus eliminating the inclination of the first direction rotation axis; and performing the inclination adjustment of the second direction rotation axis of the object platform based on the expansion direction of the interference fringe in the optical information until the spacing of the interference fringes are adjusted to the maximum, thus eliminating the inclination of the second direction rotation axis.