知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

319 records (took 0.03 seconds)

    Electronic Devices With Sidewall Displays
    312.
    发明申请
    Electronic Devices With Sidewall Displays 有权
    带侧壁显示器的电子设备

    公开(公告)号：US20140240289A1

    公开(公告)日：2014-08-28

    申请号：US14273315

    申请日：2014-05-08

    Applicant: Apple Inc.

    Inventor： Scott A. Myers ,  Stephen Brian Lynch ,  Anthony S. Montevirgen

    IPC: G06F1/16 ,  G06F3/0488 ,  G06F3/0481 ,  G06F3/044

    CPC classification number: G06F3/041 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/04817 ,  G06F3/0488 ,  G06F3/04886 ,  G06F2203/04102 ,  G06F2203/04112 ,  H04M1/0268 ,  H04M1/0283 ,  H04M1/236 ,  H04M2250/16 ,  H04M2250/22

    Abstract: Electronic devices may be provided that contain flexible displays that are bent to form displays on multiple surfaces of the devices. Bent flexible displays may be bent to form front side displays and edge displays. Edge displays may be separated from front side displays or from other edge displays using patterned housing members, printed or painted masks, or by selectively activating and inactivating display pixels associated with the flexible display. Edge displays may alternately function as virtual buttons, virtual switches, or informational displays that are supplemental to front side displays. Virtual buttons may include transparent button members, lenses, haptic feedback components, audio feedback components, or other components for providing feedback to a user when virtual buttons are activated.

    Abstract translation: 可以提供包含柔性显示器的电子设备，其弯曲以在设备的多个表面上形成显示器。 弯曲的柔性显示器可以弯曲以形成前侧显示器和边缘显示器。 边缘显示器可以与前侧显示器或使用图案化外壳构件，印刷或涂漆的掩模或通过选择性地激活和失活与柔性显示器相关联的显示像素与其他边缘显示器分离。 边缘显示器可以交替地用作正面显示器补充的虚拟按钮，虚拟交换机或信息显示器。 虚拟按钮可以包括透明按钮构件，透镜，触觉反馈组件，音频反馈组件或用于当虚拟按钮被激活时向用户提供反馈的其他组件。

    Electronic Devices With Flexible Displays Having Fastened Bent Edges
    313.
    发明申请
    Electronic Devices With Flexible Displays Having Fastened Bent Edges 审中-公开
    具有固定弯曲边缘柔性显示器的电子设备

    公开(公告)号：US20140218856A1

    公开(公告)日：2014-08-07

    申请号：US14247124

    申请日：2014-04-07

    Applicant: Apple Inc.

    Inventor： John Raff ,  Scott A. Myers ,  Christopher Stringer

    IPC: G06F1/16

    CPC classification number: G06F1/1652 ,  G06F1/00 ,  G06F1/1601 ,  G06F1/1637 ,  H01L51/0097 ,  H04L1/00 ,  Y10T29/49002

    Abstract: An electronic device may be provided with a display having a flexible substrate with fastened bent edges. The flexible substrate may have an active region that includes an array of light-emitting elements such as organic light-emitting diodes. The flexible substrate may also have inactive regions that lie outside of the active region. The bent edges may include portions of the inactive regions and portions of the active region. The bent edges may be wrapped to conform to the shape of an internal support structure. The bent edges may be fastened to the support structure with fastening members that attach a housing member or an internal clamp to the support structure. The bent edges may be secured between the housing member or the internal clamp and the support structure. The fastening members may be engaged in openings in the support structure and may pass through or alongside the bent edges.

    Abstract translation: 电子设备可以设置有具有带有紧固的弯曲边缘的柔性基板的显示器。 柔性基板可以具有包括诸如有机发光二极管的发光元件阵列的有源区域。 柔性基板还可以具有位于有源区域之外的非活性区域。 弯曲边缘可以包括非活性区域的部分和有源区域的部分。 弯曲的边缘可以被包裹以符合内部支撑结构的形状。 弯曲的边缘可以通过将壳体构件或内部夹具附接到支撑结构的紧固构件紧固到支撑结构。 弯曲的边缘可以固定在壳体构件或内部夹子和支撑结构之间。 紧固构件可以接合在支撑结构中的开口中并且可以穿过弯曲边缘或与弯曲边缘并排。

    Capacitive Sensor Packaging
    314.
    发明申请
    Capacitive Sensor Packaging 审中-公开
    电容传感器封装

    公开(公告)号：US20140216914A1

    公开(公告)日：2014-08-07

    申请号：US14247419

    申请日：2014-04-08

    Applicant: Apple Inc.

    Inventor： Benjamin J. Pope ,  Shawn Arnold ,  Barry J. Corlett ,  Terry L. Gilton ,  Syed Husaini ,  Steven Webster ,  Scott A. Myers ,  Matthew D. Hill ,  Benjamin B. Lyon

    IPC: G06K9/00

    CPC classification number: G06K9/00087 ,  G06F3/044 ,  G06K9/0002 ,  G06K9/0004 ,  G06K9/00053 ,  G06K9/00073

    Abstract: An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.

    Abstract translation: 一种装置包括指纹传感器，其具有被配置为电容耦合到用户指纹的一组电容性元件。 指纹传感器可以设置在电子设备的控制按钮或显示元件下方，例如控制按钮和显示组件中的一个或多个。 响应元件响应于用户指纹的接近度，例如响应于控制按钮的运动的第一电路中的一个或两个，以及响应于指纹和显示元件的表面之间的耦合的第二电路。 指纹传感器比响应元件更靠近指纹。 控制按钮或显示组件可以包括各向异性介电材料，例如蓝宝石。

    CONTINUOUS SAPPHIRE GROWTH
    315.
    发明申请
    CONTINUOUS SAPPHIRE GROWTH 有权
    连续的SAPPHIRE增长

    公开(公告)号：US20140090592A1

    公开(公告)日：2014-04-03

    申请号：US13631602

    申请日：2012-09-28

    Applicant: APPLE INC.

    Inventor： Dale N. Memering ,  Scott A. Myers

    IPC: C30B15/02 ,  B26F3/00 ,  B28D5/00 ,  C30B15/32 ,  C30B15/30

    CPC classification number: C30B15/34 ,  C30B15/002 ,  C30B15/005 ,  C30B15/30 ,  C30B29/20 ,  C30B33/06 ,  Y10T117/1004 ,  Y10T117/1032 ,  Y10T117/106 ,  Y10T225/12

    Abstract: Systems and methods for continuous sapphire growth are disclosed. One embodiment may take the form of a method including feeding a base material into a crucible located within a growth chamber, heating the crucible to melt the base material and initiating crystalline growth in the melted base material to create a crystal structure. Additionally, the method includes pulling the crystal structure away from crucible and feeding the crystal structure out of the growth chamber.

    Abstract translation: 公开了连续蓝宝石生长的系统和方法。 一个实施例可以采用包括将基材输送到位于生长室内的坩埚中的方法的形式，加热坩埚以熔化基材并且引发熔融的基底材料中的晶体生长以产生晶体结构。 此外，该方法包括将晶体结构从坩埚中拉出并将晶体结构送出生长室。

    METHODS AND APPARATUS FOR ATTACHING MULTI-LAYER FLEX CIRCUITS TO SUBSTRATES
    316.
    发明申请
    METHODS AND APPARATUS FOR ATTACHING MULTI-LAYER FLEX CIRCUITS TO SUBSTRATES 审中-公开
    用于将多层复合电路连接到基板的方法和装置

    公开(公告)号：US20140069696A1

    公开(公告)日：2014-03-13

    申请号：US13633668

    申请日：2012-10-02

    Applicant: APPLE INC.

    Inventor： Fletcher R. Rothkopf ,  Scott A. Myers ,  Teodor Dabov

    IPC: H05K1/02 ,  H05K3/36

    CPC classification number: H05K3/361 ,  H05K1/117 ,  H05K1/118 ,  H05K3/323 ,  H05K2201/09409 ,  H05K2201/09845 ,  H05K2201/10136 ,  Y10T156/10

    Abstract: Multi-layer ACF flex circuits can be bonded to multiple, separate and distinct circuits on substrates. The multi-layer ACF bonds are formed by aligning each of multiple circuits with a separate portion of a multi-layer ACF flex circuit and then forming ACF bonds using a single or multiple thermodes. The selection of single or multiple thermodes depends on the required thermal profile for each of the ACF bonds. The multiple ACF bonds may also be formed to a single multi-layer ACF flex circuit independently such that realignment may occur after individual bonds have already been formed.

    Abstract translation: 多层ACF柔性电路可以结合到基板上的多个，分离和不同的电路。 多层ACF键通过将多个电路中的每一个与多层ACF柔性电路的单独部分对齐并且然后使用单个或多个热电偶形成ACF键来形成。 单个或多个热电偶的选择取决于每个ACF键的所需热分布。 多个ACF键也可以独立地形成为单个多层ACF柔性电路，使得可以在已经形成各个键之后进行重新对准。

    MOLDED EMI AND THERMAL SHIELD
    319.
    发明申请
    MOLDED EMI AND THERMAL SHIELD 有权
    模制EMI和热屏蔽

    公开(公告)号：US20130233611A1

    公开(公告)日：2013-09-12

    申请号：US13631236

    申请日：2012-09-28

    Applicant: APPLE INC.

    Inventor： Shayan Malek ,  Scott A. Myers ,  Michael B. Wittenberg

    IPC: H05K9/00 ,  B29C37/00

    CPC classification number: H05K9/0032

    Abstract: One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.

    Abstract translation: 模制屏蔽件的一个实施例可以包括符合并接收电气部件的空腔，适合和接收金属框架的狭缝以及耦合到模制屏蔽件的顶侧和侧面的金属层。 在一个实施例中，模制的屏蔽可以由硅形成，并且可以包括用于增强导电性的材料。 模制的屏蔽件可以耦合到金属框架，金属框架又可以耦合到地面，所得到的结构用于减少电气排放。 模制的屏蔽件可以通过传导将热量从电气部件传送出去。

Patent Agency Ranking