公开(公告)号：US5160807A

公开(公告)日：1992-11-03

申请号：US743481

申请日：1991-08-08

申请人： John J. Fry ,  George R. Hall, II

发明人： John J. Fry ,  George R. Hall, II

IPC分类号： H05K9/00

CPC分类号： H05K9/0033 ,  Y10S174/34 ,  Y10S174/35

摘要： An arrangement for providing radio frequency and electromagnetic interference protection to at least part of circuitry mounted on a circuit board comprises alternating slots and bridges which form a boundary between a protected area of the circuit board and an unprotected area of the circuit board. The circuit portions which require protection are mounted in the protected area and are covered by a top cover having fingers which extend through the slots. Connecting lines between the protected and unprotected portions of the circuit portions extend along the bridges between the slots. A bottom cover engages under the protected area and mates to the top cover for providing electromagnetic interference protection for the circuit portions within the protected area.

摘要翻译： 用于向安装在电路板上的电路的至少一部分提供射频和电磁干扰保护的装置包括形成电路板的保护区域和电路板的未受保护区域之间边界的交替的槽和桥。 需要保护的电路部分安装在保护区域中，并被具有延伸穿过狭槽的指状物的顶盖覆盖。 电路部分的受保护部分和未受保护部分之间的连接线沿着槽之间的桥延伸。 底盖接合在保护区下方并配合到顶盖，为保护区内的电路部分提供电磁干扰保护。

公开(公告)号：US5067232A

公开(公告)日：1991-11-26

申请号：US697004

申请日：1991-05-08

申请人： Peter Seidel ,  Karl Zell

发明人： Peter Seidel ,  Karl Zell

IPC分类号： H01R12/50 ,  H05K9/00

CPC分类号： H05K9/0022 ,  H01R23/6873 ,  Y10S174/35 ,  Y10T29/49139

摘要： A method for contacting shielding plates having press-in pins and attached to an upper side of a printed circuit board to further shielding plates also having press-in pins and located on a lower side of the printed circuit board. The upper shielding plate with press-in pins having arcuate press-in zones is placed free of force into respective through-contacted printed circuit board holes and is contacted against walls of the holes by pressing into the same holes press-in pins having V-shaped press-in zones of the lower shielding plate in order to achieve a gas-tight, good contacting, i.e. a shielding diverter.

摘要翻译： 用于接触具有压入销并且连接到印刷电路板的上侧的屏蔽板的方法，用于进一步屏蔽板，其也具有压入引脚并位于印刷电路板的下侧。 具有弓形压入区的压入销的上屏蔽板被放置在相应的通孔接触印刷电路板孔中，并且通过压入相同的孔而与孔的壁接触， 以便实现气密性良好的接触，即屏蔽转向器。

公开(公告)号：US5053924A

公开(公告)日：1991-10-01

申请号：US502365

申请日：1990-03-30

申请人： Jeffery F. Kurgan

发明人： Jeffery F. Kurgan

IPC分类号： H01R4/64 ,  H04B15/02 ,  H05K9/00

CPC分类号： H05K9/0035 ,  H04B15/02 ,  Y10S174/35

摘要： An electromagnetic shield for absorbing electromagnetic energy generated by a circuit disposed upn a circuit board. The shield is comprised of a thermally conductive material to further provide heat-sink capabilites. Clip members releasably fastened to a flange projecting from a shielding surface formed by the shield are aligned with the ground plane of a circuit board. By maintaining the shield in a confronting relationship with the circuit board, the clip members are caused to maintain the shielding surface in electrical contact with the circuit.

摘要翻译： 一种用于吸收由设置在电路板上的电路产生的电磁能的电磁屏蔽。 屏蔽由导热材料组成，以进一步提供散热能力。 可剥离地固定在由屏蔽罩形成的屏蔽面凸出的凸缘上的夹具与电路板的接地面对准。 通过将屏蔽件保持与电路板面对的关系，使夹子构件保持屏蔽表面与电路电接触。

公开(公告)号：US4816613A

公开(公告)日：1989-03-28

申请号：US137323

申请日：1987-12-23

申请人： Katsuo Ito ,  Kazunori Kinoshita ,  Kazuhiro Tsuji

发明人： Katsuo Ito ,  Kazunori Kinoshita ,  Kazuhiro Tsuji

IPC分类号： H05K5/04 ,  H05K5/02 ,  H05K9/00

CPC分类号： H05K9/006 ,  Y10S174/34 ,  Y10S174/35

摘要： An electrical shielding case for shielding a plurality of circuits from each other, which includes a plurality of plate portions formed by dividing a metallic flat plate, and remaining parts of the plate portions left for connection when outer peripheries of the plate portions are cut off, with each of the plate portions being folded at the remaining portions as fulcrums so as to form the electrical shielding case, and is characterized in that there are provided bendable cut and raised portions formed at parts of other confronting plate portions interfering with end faces of the plate portions upon folding thereof.

摘要翻译： 用于屏蔽多个电路的电屏蔽壳体，其包括通过划分金属平板而形成的多个板部分，以及当板部分的外周缘被切断时剩下的用于连接的板部分， 其中每个板部分在剩余部分处作为支点折叠以形成电屏蔽壳体，其特征在于，在其它相对的板部分的部分处形成弯曲的切割和凸起部分，该部分干涉其的端面 折叠时的板部分。

公开(公告)号：US4736069A

公开(公告)日：1988-04-05

申请号：US913206

申请日：1986-09-30

申请人： Aaron B. Mullins

发明人： Aaron B. Mullins

IPC分类号： H05K7/14 ,  H05K9/00

CPC分类号： H05K7/1461 ,  H05K9/0039 ,  Y10S174/35

摘要： Disclosed is an improved housing being comprised of a substrate and a cover that is plated to provide RF shielding. The substrate and cover are constructed of a like material to keep the coefficients of vibration approximately identical. Preferably, the substrate and cover material are ceramic thereby providing a rigid structure that minimizes vibration degradation.

摘要翻译： 公开了一种改进的壳体，其由基底和覆盖物组成，其被电镀以提供RF屏蔽。 衬底和盖子由类似材料构成以保持振动系数大致相同。 优选地，衬底和覆盖材料是陶瓷的，从而提供使振动降低最小化的刚性结构。

公开(公告)号：USB508639I5

公开(公告)日：1976-03-23

申请号：US50863974

申请日：1974-09-23

IPC分类号： H05K5/02 ,  H05K7/14 ,  H05K7/18 ,  H05K7/20 ,  H05K9/00

CPC分类号： H05K9/0062 ,  H05K7/1424 ,  H05K7/20 ,  Y10S174/35

公开(公告)号：US3862350A

公开(公告)日：1975-01-21

申请号：US40299973

申请日：1973-10-03

申请人： SINGER CO

发明人： MILOSAVICH BERNARD S

IPC分类号： H05K9/00

CPC分类号： H05K9/00 ,  Y10S174/35

摘要： This disclosure illustrates and describes an apparatus and a method for preventing the interference by strong electrical fields with the operation of electronic equipment. There are many situations where a substantial amount of electronic equipment is located in an area which is subjected to strong radiation fields. One example of such a situation is the installation of an aircraft simulator at an air base which utilizes high powered radio transmitters and radar transmission equipment. Interference in the operation of the electronic equipment by the radiant fields may cause improper operation of digital computers, damaging transient effects and complete disruption of intercomponent communication. This invention is used where such equipment is mounted upon a raised floor and in which the cables interconnecting the electronic components pass beneath the raised floor. In accordance with this invention the raised floor is constructed upon a sheet of highly conductive material which is then folded up around the sides and the ends of the raised floor and electrically grounded thereto so that the floor, the sheet of conductive material, and the cabinets containing the electronic gear thereon are connected together and completely surround the electrical equipment and the connecting cables.

摘要翻译： 本公开说明和描述了通过电子设备的操作来防止强电场干扰的装置和方法。 存在大量电子设备位于经受强辐射场的区域的许多情况。 这种情况的一个例子是在利用大功率无线电发射机和雷达传输设备的空中基地安装飞行器模拟器。 辐射场对电子设备操作的干扰可能导致数字计算机的不正确的操作，瞬时效应的破坏以及组件间通信的完全中断。 本发明用于将这种设备安装在高架地板上，并且其中将电子部件互连的电缆通过高架地板之下。 根据本发明，升高的地板被构造成一片高度导电的材料，然后将其折叠在高架地板的侧面和端部上并与之电接地，使得地板，导电材料片和柜体 将其上的电子齿轮连接在一起并且完全包围电气设备和连接电缆。

公开(公告)号：US3404215A

公开(公告)日：1968-10-01

申请号：US54260966

申请日：1966-04-14

申请人： SPRAGUE ELECTRIC CO

发明人： BURKS DARNALL P ,  MARTIN JACOB H

IPC分类号： H05K5/00

CPC分类号： H05K5/0095 ,  Y10S65/11 ,  Y10S174/35

公开(公告)号：US2964683A

公开(公告)日：1960-12-13

申请号：US66749857

申请日：1957-06-24

申请人： EASTMAN KODAK CO

发明人： ROMAN ROBERT J ,  MORIARTY JOHN M

IPC分类号： H05K9/00

CPC分类号： H05K9/0033 ,  Y10S174/35

公开(公告)号：US20150070859A1

公开(公告)日：2015-03-12

申请号：US14389844

申请日：2013-03-14

申请人： Harting Electronics GmbH

发明人： Marc Lindkamp ,  Rainer Bussmann

IPC分类号： H05K7/14

CPC分类号： H05K7/1427 ,  H05K5/0047 ,  H05K5/0052 ,  H05K5/006 ,  H05K7/1417 ,  H05K7/142 ,  H05K2203/167 ,  Y10S174/34 ,  Y10S174/35

摘要： In a housing 1 for receiving an electric circuit board 50 it is proposed to provide in a first housing half 2 of the housing 1 a plurality of bearing pads 20, 21 located at various levels. These bearing pads 20, 21 receive, together with counter bearing pads 30, 31 provided in a second housing half 30, the electric circuit board 50. A plurality of support points 55, 56 is provided on the electric circuit board 50, each of which support points 55, 56 is respectively associated with the bearing pads 20, 21 and counter bearing pads 30, 31. By removing individual support points 55, 56, the bearing pads 20, 21 and counter bearing pads 30, 31 are selected, on which the circuit board 50 is supposed to rest. By selecting the bearing pads 20, 21 and counter bearing pads 30, 31 lying at different levels, the level of the electric circuit board 50 in the housing 1 is determined.

摘要翻译： 在用于接收电路板50的壳体1中，建议在壳体1的第一壳体半部2中设置多个位于各种水平的轴承瓦块20,21。 这些轴承座20,21与设置在第二壳体半部30（电路板50）中的反向轴承座30,31一起接收。多个支撑点55,56设置在电路板50上，每个支撑点 支撑点55,56分别与轴承瓦块20,21和反向轴承瓦块30,31相关联。通过移除单独的支撑点55,56，选择轴承瓦块20,21和反向轴承瓦块30,31， 假定电路板50休息。 通过选择位于不同水平的轴承瓦块20,21和反向轴承座30,31，确定壳体1中的电路板50的高度。