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公开(公告)号：US20250142035A1
公开(公告)日：2025-05-01
申请号：US18826889
申请日：2024-09-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Giuk KANG , Byunghwa LEE , Jeewoo NOH , Sojeong SHIM , Yeeun CHOI , Inyoung CHOI
IPC: H04N9/31
Abstract: An electronic apparatus is provided. The electronic apparatus includes a projector, a driver, memory storing one or more computer programs, and one or more processors communicatively coupled to the projector, the driver and the memory, and one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic apparatus control the projector to project first content onto a projection surface, based on the electronic apparatus moving from a first position to a second position, identify a projection angle for the projection surface based on the second position, obtain second content by changing a screen form of the first content based on the second position and the projection angle, and based on the electronic apparatus moving from the first position to the second position by controlling the driver, control the projector to project the second content onto the projection surface.
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公开(公告)号：US20250141764A1
公开(公告)日：2025-05-01
申请号：US19010802
申请日：2025-01-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： David GUTIERREZ ESTEVEZ
Abstract: A method of providing service experience analytics in a network is described. The method comprises: requesting or subscribing, by a service consumer from or to a network data analytics function (NWDAF) of the network, service experience analytics for one or more application(s) and/or service experience analytics for one or more network slice(s), via a request or a subscription; determining, by the NWDAF, whether to provide the service experience analytics for one or more application(s) and/or the service experience analytics for one or more network slice(s), based on the request or the subscription; providing, by the NWDAF to the service consumer, the service experience analytics for one or more application(s) and/or the service experience analytics for one or more network slice(s), according to a result of the determining. A network is also described.
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公开(公告)号：US20250141586A1
公开(公告)日：2025-05-01
申请号：US18670723
申请日：2024-05-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yibing Michelle WANG , Radwanul Hasan SIDDIQUE
Abstract: A device includes an electronic integrated circuit, the electronic integrated circuit including an optical demultiplexer and at least one photodetector optically coupled to the optical demultiplexer. The optical demultiplexer may have at least one nanostructured layer able to receive an incoming optical signal and separate the incoming optical signal into a first separated optical signal and a second separated optical signal. The device may have a first photodetector and a second photodetector, where the first photodetector may receive the first separated optical signal and the second photodetector may receive the second separated optical signal.
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24.发明申请公开(公告)号：US20250141516A1
公开(公告)日：2025-05-01
申请号：US18923403
申请日：2024-10-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngrok JANG , Hyoungju JI , Namjeong LEE , Younsun KIM
Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. A method performed by a terminal in a wireless communication system includes receiving, from a base station, first configuration information on a sounding reference signal (SRS) resource, receiving, from the base station, second configuration information for a channel state information (CSI) report, transmitting, to the base station, an SRS for a first channel between a first transmission and reception point (TRP) and the terminal based on the first configuration information, and transmitting, to the base station, the CSI report including a measurement result of a second channel between a second TRP and the terminal based on the second configuration information.
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公开(公告)号：US20250141479A1
公开(公告)日：2025-05-01
申请号：US18923005
申请日：2024-10-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungjae OH , Hyunuk KANG , Daeyoung LEE
Abstract: The disclosure relates to a fifth generation (5G) communication system or a sixth generation (6G) communication system. An electronic device in a wireless communication system can reduce or minimize the size of a power amplifier module (PAM) and can secure a relatively wide operating frequency band of the PAM.
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Patent Agency Ranking
公开(公告)号：US20250141445A1
公开(公告)日：2025-05-01
申请号：US18435329
申请日：2024-02-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Mohamed Badr Mahmoud Mohamed Badr YOUNIS
IPC: H03K17/687
Abstract: A system and method for operating an output driver are disclosed, the method comprising connecting a first P-channel field-effect transistor (PFET) between a supply voltage and an output node; connecting a second PFET in parallel with the first PFET between the supply voltage and the output node; connecting a first N-channel field-effect transistor (NFET) between the supply voltage and a gate of the second PFET; and adjusting a voltage at a gate of the first NFET based on a voltage at the output node to modulate a voltage of a gate of the second PFET to maintain a pull-up resistance within a predefined range.
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公开(公告)号：US20250141266A1
公开(公告)日：2025-05-01
申请号：US18824137
申请日：2024-09-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Bumjin PARK , Jedok KIM , Seho PARK , Sungku YEO , Hana CHOE
Abstract: An electronic device (e.g., a power supply device or a power receiving device) includes a housing including a first side of the electronic device and a second side opposite to the first side, a wireless charging coil disposed in the housing, and a magnet structure disposed in the housing to surround the coil and including a plurality of magnet pieces including a first magnet piece and a second magnet piece. The first magnet piece includes a first outer magnetized area having an N pole facing the first side, a first inner magnetized area disposed closer to the coil than the first outer magnetized area and having an S pole facing the first side, and a first non-magnetized area disposed between the first outer magnetized area and the first inner magnetized area. The second magnet piece includes a second outer magnetized area having an N pole facing the first side, a second inner magnetized area disposed closer to the coil than the second outer magnetized area and having an S pole facing the first side, and a second non-magnetized area disposed between the second outer magnetized area and the second inner magnetized area. The first magnet piece has a first magnetic force and the second magnet piece has a second magnetic force different from the first magnetic force.
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公开(公告)号：US20250140720A1
公开(公告)日：2025-05-01
申请号：US18763547
申请日：2024-07-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： DAWOON JUNG
IPC: H01L23/00 , H01L23/31 , H01L23/48 , H01L25/065
Abstract: A semiconductor package includes a first semiconductor chip, a chip structure on the first semiconductor chip, and a bonding structure between the first semiconductor chip and the chip structure, where the bonding structure includes a first conductive pad on an upper surface of the first semiconductor chip, a second conductive pad on a lower surface of the chip structure, a protective metal layer between the first conductive pad and the second conductive pad, and an intermetallic compound in the protective metal layer, where the protective metal layer covers a surface of the first conductive pad and a surface of the second conductive pad, where the semiconductor package further includes a first interface between the first semiconductor chip and the chip structure and a second interface between the protective metal layer and the second conductive pad.
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公开(公告)号：US20250140705A1
公开(公告)日：2025-05-01
申请号：US18749750
申请日：2024-06-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyuhyeon Choi
IPC: H01L23/538 , H01L21/56 , H01L23/00 , H01L23/31 , H01L23/498 , H01L25/18 , H10B80/00
Abstract: A semiconductor package includes a package substrate, a first semiconductor chip on the package substrate and including a plurality of first through vias, a second semiconductor chip spaced apart from the first semiconductor chip in a lateral direction parallel to an upper surface of the package substrate and including a plurality of second through vias, a third semiconductor chip on the first semiconductor chip, an interposer between the third semiconductor chip and the first semiconductor chip and electrically connecting the first semiconductor chip to the third semiconductor chip, a molding layer between the package substrate and the interposer and on the first semiconductor chip and the second semiconductor chip, a first solder ball between the first semiconductor chip and the interposer, and a second solder ball between the second semiconductor chip and the interposer.
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公开(公告)号：US20250140678A1
公开(公告)日：2025-05-01
申请号：US18783847
申请日：2024-07-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jihyun LEE , Insik HAN
IPC: H01L23/498 , H01L21/48 , H01L23/00 , H01L23/31
Abstract: A substrate includes a base substrate comprising a center region and a corner region in a plan view. The base substrate comprises wiring patterns and an insulating layer. First conductive pads are on an upper surface of the center region of the base substrate. Second conductive pads are on an upper surface of the corner region of the base substrate. Each of the first conductive pads has a circular or oval shape in the plan view. Each of the second conductive pads has a polygonal shape in the plan view.
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