Display panel and electronic device

    公开(公告)号:US11662630B2

    公开(公告)日:2023-05-30

    申请号:US17054519

    申请日:2020-09-16

    CPC classification number: G02F1/13439 G02F1/13338 G02F1/133345

    Abstract: A display panel and an electronic device are provided. The display panel includes a first display area and a second display area. The first display area includes a first liquid crystal layer and a driving circuit layer. The driving circuit layer includes a first driving unit group and a second driving unit. The first driving unit group is configured to drive the first liquid crystal layer. The second display area includes the second liquid crystal layer and the transparent connection layer, and the second driving unit group drives the second liquid crystal layer through the transparent connection layer, so to complete the display area of the display panel.

    Backlight module and liquid crystal display

    公开(公告)号:US11287557B2

    公开(公告)日:2022-03-29

    申请号:US16769609

    申请日:2019-05-09

    Abstract: A backlight module and a liquid crystal display are provided. The backlight module realizes a narrow border of the backlight module by arranging a light source between a first protrusion portion of a support part and a light incident surface of a light guide plate. The backlight module cooperates with the liquid crystal display panel having a second protrusion portion and second notches of a stepped area, and a flexible printed circuit board passes through the second notches of the liquid crystal display panel and the first notches of the backlight module.

    Display device comprising a flip chip film connected to a connecting surface of a plurality of bonding pins and manufacturing method thereof

    公开(公告)号:US11126044B1

    公开(公告)日:2021-09-21

    申请号:US16625795

    申请日:2019-08-02

    Abstract: A display device and a manufacturing method of the display device are provided. The display device includes a first substrate, and a flip chip film. The first substrate is provided with bonding pins, conductive adhesive layers, and barriers. Each bonding pin is extended to a side edge of the first substrate, and each bonding pin includes a connecting surface which is flush with the side edge of the first substrate. Each conductive adhesive layer covers one side of each bonding pin, each conductive adhesive layer is extended to the side edge of the first substrate, and the conductive adhesive layer includes an auxiliary connecting surface which is flush with the side edge of the first substrate. Each barrier surrounds side surfaces of each conductive adhesive layer. The flip chip film is connected to the connecting surface and the auxiliary connecting surface.

    Array substrate and method of forming the same

    公开(公告)号:US10304860B2

    公开(公告)日:2019-05-28

    申请号:US15023379

    申请日:2016-02-25

    Abstract: An array substrate includes a substrate, a buffer layer, a first shielding pattern, a passivation layer, a first semiconductor pattern, a gate insulating layer, a first gate pattern, an interlayer insulating layer, and two first source/drain electrode patterns. A first through hole and a second through hole are arranged on the array substrate. One of the first source/drain electrode patterns is electrically connected to the first semiconductor pattern and the first shielding pattern through the first through hole. The other one of the first source/drain electrode patterns is electrically connected to the first semiconductor pattern through the second through hole and is insulated from the first shielding pattern. The present invention where the array substrate and the method of forming the array substrate are proposed is related to a top-gate design. The driving ability of the TFT driving circuit still improves without increasing the original processes and production costs.

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