公开(公告)号：US07374391B2

公开(公告)日：2008-05-20

申请号：US11315873

申请日：2005-12-22

申请人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： B25J15/00

CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

公开(公告)号：US20060182536A1

公开(公告)日：2006-08-17

申请号：US11315984

申请日：2005-12-22

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： H01L21/677

CPC分类号： H01L21/68707 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

公开(公告)号：US20100280654A1

公开(公告)日：2010-11-04

申请号：US12840143

申请日：2010-07-20

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： H01L21/677 ,  H01L21/68

CPC分类号： B25J11/008 ,  B25J18/00 ,  G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.

摘要翻译： 提供了一种使用多室处理系统或集群工具处理衬底的方法和装置。 在本发明的一个实施例中，提供了机器人组件。 所述机器人组件包括可在第一方向上移动的第一运动组件和第二运动组件，所述第二运动组件联接到所述第一运动组件，并且可相对于所述第一运动组件在大致正交于所述第一运动组件的第二方向上移动 第一个方向 机器人组件还包括设置在第一运动组件或第二运动组件中的一个中的壳体，壳体内的致动器，以及设置在外壳中的风扇组件，其适于产生外壳内的压力小于 外壳外部压力。

公开(公告)号：US20070147976A1

公开(公告)日：2007-06-28

申请号：US11553820

申请日：2006-10-27

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： H01L21/677

CPC分类号： B25J11/008 ,  B25J18/00 ,  G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

公开(公告)号：US08911193B2

公开(公告)日：2014-12-16

申请号：US13305539

申请日：2011-11-28

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： B65H1/00 ,  H01L21/677 ,  G03F7/20 ,  H01L21/67

CPC分类号： B25J11/008 ,  B25J18/00 ,  G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.

摘要翻译： 提供了一种使用多室处理系统或集群工具处理衬底的方法和装置。 在本发明的一个实施例中，提供了机器人组件。 所述机器人组件包括可在第一方向上移动的第一运动组件和第二运动组件，所述第二运动组件联接到所述第一运动组件，并且可相对于所述第一运动组件在大致正交于所述第一运动组件的第二方向上移动 第一个方向 所述机器人组件还包括设置在所述第一运动组件或所述第二运动组件中的一个中的外壳，所述外壳包含垂直致动器组件的至少一部分，联接到所述外壳的支撑板和设置在所述第二运动组件上的第一传送机器人 支撑板

公开(公告)号：US08066466B2

公开(公告)日：2011-11-29

申请号：US12840143

申请日：2010-07-20

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： H01L21/677

CPC分类号： B25J11/008 ,  B25J18/00 ,  G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.

摘要翻译： 提供了一种使用多室处理系统或集群工具处理衬底的方法和装置。 在本发明的一个实施例中，提供了机器人组件。 所述机器人组件包括可在第一方向上移动的第一运动组件和第二运动组件，所述第二运动组件联接到所述第一运动组件，并且可相对于所述第一运动组件在大致正交于所述第一运动组件的第二方向上移动 第一个方向 机器人组件还包括设置在第一运动组件或第二运动组件中的一个中的壳体，壳体内的致动器，以及设置在外壳中的风扇组件，其适于产生外壳内的压力小于 外壳外部压力。

公开(公告)号：US07798764B2

公开(公告)日：2010-09-21

申请号：US11553820

申请日：2006-10-27

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： H01L21/67

CPC分类号： B25J11/008 ,  B25J18/00 ,  G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

摘要： A method and apparatus for processing substrates using a cluster tool that has an increased system throughput, increased system reliability, improved device yield performance, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robot assemblies that are configured in a parallel processing configuration and adapted to move in a vertical and a horizontal direction to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms.

摘要翻译： 一种使用具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能以及减少的占用空间的群集工具来处理衬底的方法和装置。 集群工具的各种实施例可以利用两个或更多个机器人组件，其被配置为并行处理配置并且适于在垂直和水平方向上移动以在保留在处理机架中的各种处理室之间传送衬底，使得期望的 处理顺序可以在基板上进行。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 而且，这里描述的各种实施例通常被配置为最小化和控制由衬底转移机构产生的颗粒。

公开(公告)号：US07374393B2

公开(公告)日：2008-05-20

申请号：US11398218

申请日：2006-04-05

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： B65G61/00

CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

公开(公告)号：US20070147982A1

公开(公告)日：2007-06-28

申请号：US11398218

申请日：2006-04-05

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Mario Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Mario Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： H01L21/677

CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

公开(公告)号：US07651306B2

公开(公告)日：2010-01-26

申请号：US11315984

申请日：2005-12-22

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： H01L21/677

CPC分类号： H01L21/68707 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

摘要： Embodiments of the invention provide a method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool.

摘要翻译： 本发明的实施例提供了一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量和减小的占地面积。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。