公开(公告)号：US20150061046A1

公开(公告)日：2015-03-05

申请号：US14013155

申请日：2013-08-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kuei-Sung Chang ,  Chia-Hua Chu ,  Yu-Chia Liu

IPC: B81B7/04 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/04 ,  B81B7/0041 ,  B81B7/02 ,  B81B2201/0235 ,  B81C1/00214 ,  B81C1/00269 ,  B81C1/00293 ,  B81C2203/0109 ,  B81C2203/0145

Abstract: The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the device wafer in a first ambient environment having a first pressure. The bonding forms a plurality of chambers abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of chambers. The one or more openings in the one or more of the plurality of chambers are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of chambers to be held at the different pressure.

Abstract translation: 本公开涉及一种在基板上形成具有多个具有不同压力的室的多个MEM装置的方法，以及相关联的装置。 在一些实施例中，该方法通过提供具有多个微机电系统（MEM）装置的装置晶片来执行。 帽盖晶片在具有第一压力的第一环境环境中结合到器件晶片上。 接合形成与多个保持在第一压力下的多个MEM装置邻接的多个室。 一个或多个开口形成在多个室中的一个或多个室中。 然后将多个腔室中的一个或多个室中的一个或多个开口密封在具有不同压力的不同环境环境中，从而使多个室中的一个或多个保持在不同的压力。