公开(公告)号：US10239989B2

公开(公告)日：2019-03-26

申请号：US15533940

申请日：2015-12-08

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Yoshinori Tadokoro ,  Dai Shiota

IPC: C08G59/42 ,  C08L63/00 ,  C08G59/40 ,  C08G59/50 ,  C08G59/56 ,  C08J5/04 ,  C08G59/68 ,  C08K5/09 ,  C08K5/10 ,  C08G59/52

Abstract: A curable composition that can be cured at low temperature in a short time regardless of the type of epoxy compound that is mixed therewith, and has a long pot life; an adhesive comprising said curable composition; a method for producing a fiber-reinforced composite material that uses the curable composition; and a fiber-reinforced composite material containing a matrix comprising the curable composition. A curing agent mixture composition that can be cured at low temperature and in a short time, and provides the curable composition with a long pot life. An epoxy compound (A) and an imidazole compound (B) are blended in with the curable composition. In addition, the imidazole compound (B) and at least one type of crosslinking agent (C) are blended in with the curing agent mixture composition.

公开(公告)号：US09891527B2

公开(公告)日：2018-02-13

申请号：US14168305

申请日：2014-01-30

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Hiroki Chisaka ,  Kunihiro Noda ,  Dai Shiota

IPC: G03F7/32 ,  G03F7/023 ,  G03F7/038 ,  G03F7/40

CPC classification number: G03F7/325 ,  G03F7/0233 ,  G03F7/0387 ,  G03F7/40

Abstract: A developing solution for a polyimide precursor containing N,N,N′,N′-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method.

公开(公告)号：US09529258B2

公开(公告)日：2016-12-27

申请号：US14758199

申请日：2013-12-25

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Dai Shiota ,  Kazuya Someya

IPC: G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  C07D233/60 ,  C07C323/47 ,  C07D209/86 ,  C08K5/33 ,  G03F7/038 ,  C09D179/08 ,  C08G73/10 ,  C07D233/56 ,  C08K5/34

CPC classification number: G03F7/0041 ,  C07C323/47 ,  C07D209/86 ,  C07D233/56 ,  C07D233/60 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/1078 ,  C08K5/33 ,  C08K5/34 ,  C09D179/08 ,  G03F7/0045 ,  G03F7/0387 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  G03F7/40 ,  C08K5/3445

Abstract: The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.

Abstract translation: 本发明提供一种能量敏感性树脂组合物，其中使用所述组合物的聚酰亚胺薄膜或聚酰亚胺模塑制品的制造方法以及形成所述组合物的图案的方法。 该组合物即使通过在低温下进行热处理也提供具有优异的耐热性和低介电常数的聚酰亚胺树脂。 该组合物含有通过使四羧酸二酐和二胺，溶剂和通过光和/或热的作用分解并产生碱和/或酸的化合物（A）反应而获得的聚酰胺酸。 制造聚酰亚胺膜或聚酰亚胺模塑制品的方法包括形成包含该组合物的涂膜或模制品，并通过曝光或加热分解膜或产品中的化合物（A）。 顺序形成图案的方法包括成膜，选择性地曝光，显影和加热薄膜或产品。

公开(公告)号：US09458355B2

公开(公告)日：2016-10-04

申请号：US13971003

申请日：2013-08-20

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Dai Shiota ,  Kazuya Someya

IPC: C08G69/26 ,  C09D179/08 ,  C08L79/08 ,  G02F1/1337 ,  C08G73/10

CPC classification number: C09D179/08 ,  C08G69/26 ,  C08G73/1028 ,  C08G73/1032 ,  C08G73/1067 ,  C08L79/08 ,  C08L2666/20 ,  G02F1/133723

Abstract: A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N′,N′-tetramethylurea.

Abstract translation: 通过加热在N，N，N'，N'-四甲基脲中由四羧酸二酐组分和二胺组分反应得到的聚酰胺酸制得的聚酰亚胺树脂。

公开(公告)号：US20150337084A1

公开(公告)日：2015-11-26

申请号：US14716581

申请日：2015-05-19

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Dai Shiota ,  Masaru Shida

IPC: C08G73/22

CPC classification number: C08G73/22

Abstract: A method for producing a polybenzoxazole resin, in which even when a polybenzoxazole precursor is heat treated at a low temperature, a polybenzoxazole resin that is excellent in mechanical properties, such as tensile elongation, and in chemical resistance, is suppressed in terms of coloration, and is high in transparency can be produced. A polybenzoxazole resin is formed by heating a polybenzoxazole precursor which is obtained by allowing an aromatic diaminediol and a diformyl compound or a dicarboxylic acid dihalide, to react with each other in a solvent containing an amide compound or a urea compound each having a specified structure, at 120° C. to 350° C.

Abstract translation: 即使在聚苯并恶唑前体在低温下进行热处理的聚苯并恶唑树脂的制造方法，在着色方面抑制机械性能如拉伸伸长率和耐化学性优异的聚苯并恶唑树脂， 并且透明度高可以生产。 通过加热通过使芳族二胺二醇和二酰基化合物或二羧酸二卤化物得到的聚苯并恶唑前体在含有具有特定结构的酰胺化合物或脲化合物的溶剂中进行反应而形成聚苯并恶唑树脂， 在120℃至350℃

公开(公告)号：US20140234784A1

公开(公告)日：2014-08-21

申请号：US14168305

申请日：2014-01-30

Applicant: Tokyo Ohka Kogyo Co., Ltd.

Inventor： Hiroki Chisaka ,  Kunihiro Noda ,  Dai Shiota

IPC: G03F7/32

CPC classification number: G03F7/325 ,  G03F7/0233 ,  G03F7/0387 ,  G03F7/40

Abstract: A developing solution for a polyimide precursor containing N,N,N′,N′-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method.

Abstract translation: 含有N，N，N'，N'-四甲基脲和碳原子数1〜5的低级醇的聚酰亚胺前体的显影液。 显影液增加了显影余量，导致聚酰亚胺类树脂膜的膜厚减少甚至不降低。 一种感光性聚酰亚胺树脂组合物的显影处理方法，包括使至少一部分曝光的感光性聚酰亚胺前体树脂组合物与显影液一起显影; 以及图案形成方法，包括形成包含感光性聚酰亚胺前体树脂组合物的涂膜或成型体，选择性地曝光涂膜或成型，并通过显影处理方法显影曝光的涂膜或模塑。

公开(公告)号：US11926681B2

公开(公告)日：2024-03-12

申请号：US17837415

申请日：2022-06-10

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Hiroki Chisaka ,  Shinsuke Kawatsu

IPC: C08F2/46 ,  C08F2/50 ,  C08F18/10 ,  C08F36/14 ,  C08G61/04 ,  C08K3/22 ,  B33Y70/00

CPC classification number: C08F18/10 ,  C08F36/14 ,  C08K3/22 ,  B33Y70/00 ,  C08K2003/2244 ,  C08K2201/011

Abstract: A curable composition capable of forming a cured product having a high refractive index and suppressed increase in reflectance, a cured product of the curable composition, and a method for producing the cured product using the curable composition. The curable composition includes a photopolymerizable monomer, metal oxide nanoparticles, and a photopolymerization initiating agent. The photopolymerizable monomer includes a compound represented by the following formula (a1). In the formula, R1 and R2 each independently represents a single bond or an alkylene group, R3 represents an alkyl group, an alkenyl group, an alkoxy group, or a hydroxy group, and n represents 0 or 1

公开(公告)号：US11905433B2

公开(公告)日：2024-02-20

申请号：US17452353

申请日：2021-10-26

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Kunihiro Noda ,  Hiroki Chisaka ,  Kazuya Someya ,  Dai Shiota

IPC: C09D183/16 ,  B05D3/02 ,  C08G77/52 ,  C08K5/1545 ,  C08K5/5399 ,  C08G77/16 ,  B05D3/04 ,  C08K5/3445 ,  C08K5/17 ,  B05D1/00 ,  C08G77/60

CPC classification number: C09D183/16 ,  B05D3/02 ,  B05D3/0254 ,  B05D3/0406 ,  C08G77/16 ,  C08G77/52 ,  C08K5/1545 ,  C08K5/175 ,  C08K5/3445 ,  C08K5/5399 ,  B05D1/005 ,  B05D2203/35 ,  C08G77/60

Abstract: An energy-sensitive composition that yields a cured product with excellent thermal resistance and crack resistance, a cured product of the composition, and a method of forming a cured product. The energy-sensitive composition includes a polysilane and a thermal base generator, in which the thermal base generator includes an ionic compound and a nonionic compound. An anion moiety in the ionic compound preferably includes at least one of an anion having an oxaxanthone skeleton, an anion having a ketoprofen skeleton, and an anion having a fluorenone skeleton.

公开(公告)号：US11136435B2

公开(公告)日：2021-10-05

申请号：US16070401

申请日：2017-01-12

Applicant: ENEOS CORPORATION ,  TOKYO OHKA KOGYO CO., LTD.

Inventor： Shinichi Komatsu ,  Kunihiro Noda ,  Hiroki Chisaka ,  Dai Shiota

IPC: C08G73/10 ,  C08J5/18 ,  C08K5/00 ,  C09D179/08

Abstract: A method for producing a polyimide film includes: obtaining a polyamic acid solution having a viscosity of 5 to 150 cps by preparing a raw material mixture liquid containing a solvent, a tetracarboxylic dianhydride represented by a specific general formula, and an aromatic diamine represented by a specific general formula, and has a total content of the tetracarboxylic dianhydride and aromatic diamine of 15% by mass or less, and reacting the tetracarboxylic dianhydride and aromatic diamine with each other in the raw material mixture liquid forming a polyamic acid having a repeating unit represented by a specific general formula; obtaining a polyimide-forming mixture liquid by adding a compound represented by a specific general formula to the polyamic acid solution; and obtaining a polyimide film represented by a specific general formula by forming a film made of the polyimide-forming mixture liquid, followed by imidization of the polyamic acid in the film.

公开(公告)号：US10829662B2

公开(公告)日：2020-11-10

申请号：US15974191

申请日：2018-05-08

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Kazuya Someya ,  Hiroki Chisaka ,  Naozumi Matsumoto ,  Koichi Misumi ,  Dai Shiota

IPC: C08F2/46 ,  C08F2/50 ,  C09D163/00 ,  C08G59/40 ,  C09D7/62 ,  C08G59/24 ,  C08G59/68 ,  C08L63/00 ,  C08K9/04 ,  C08K3/22

Abstract: A curable composition capable of forming a cured product having high refractive index and excellent bending resistance, a cured product of the curable composition, a cured film made of the cured product, a display panel provided with the cured film, and a method for producing a cured product using the above-mentioned curable composition. The curable composition includes a curable compound and a curing agent. The curable compound contains a curable compound including, as a main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, followed by mixing a metal oxide in which a capping agent is covalently bonded to a surface thereof.