摘要:
An object of the present invention is to provide a negative electrode which attains excellent Ohmic contact with an n-type gallium nitride-based compound semiconductor layer, which resists deterioration in characteristics which would be caused by heating, and which can be produced at high efficiency. Another object of the invention is to provide a gallium nitride-based compound semiconductor light-emitting device having the negative electrode. The inventive gallium nitride-based compound semiconductor light-emitting device comprises an n-type semiconductor layer of a gallium nitride-based compound semiconductor, a light-emitting layer of a gallium nitride-based compound semiconductor and a p-type semiconductor layer of a gallium nitride-based compound semiconductor formed on a substrate in this order, and has a negative electrode and a positive electrode provided on the n-type semiconductor layer and the p-type semiconductor layer, respectively; wherein the negative electrode comprises a bonding pad layer and a contact metal layer which is in contact with the n-type semiconductor layer, and the contact metal layer is composed of a Cr—Al alloy.
摘要:
In an electronic component (11) comprising an electronic circuit or a circuit element in a metallic case including a case (13) and a cover (39), a magnetic thin film (51) made of a magnetic loss material is provided on at least one part of an inner wall surface of the metallic case. In the magnetic loss material, its composition is represented by M-X—Y, wherein M denotes at least one of Fe, Co and Ni, X denotes at least one of elements other than M and Y, and Y denotes at least one of F, N and O. The maximum value &mgr;″max of an imaginary part &mgr;″, which is an imaginary number component of a complex permeability of the magnetic loss material, exists within a frequency range from 100 MHz to 10 GHz. A relative bandwidth bwr is not greater than 200% where the relative bandwidth bwr is obtained by extracting a frequency bandwidth between two frequencies at which the value of &mgr;″ is 50% of the maximum &mgr;″max and normalizing the frequency bandwidth at the center frequency thereof. It is possible to provide an electronic component including a metallic case, which contains a high-speed operation type of semiconductor device and/or an electronic circuit and in which undesired radiation is reduced.
摘要:
A semiconductor light emission element (1) includes: a substrate (110); multi-layered semiconductor layers (100) including a light emission layer (150) and layered on the substrate (110); a transparent electrode (170) including an indium oxide and layered on the multi-layered semiconductor layers (100); a first junction layer (190) including tantalum as a valve action metal and layered on the transparent electrode (170) in such a manner that a side of the first junction layer (190) being in contact with the transparent electrode (170) is a tantalum nitride layer or a tantalum oxide layer; and a first bonding pad electrode (200) layered on the first junction layer (190) and used for electrical connection with outside. This improves a bonding property of the transparent electrode or the semiconductor layer with the connection electrode and reliability of the electrodes.
摘要:
The first invention relates to a water-based ink for ink-jet printing which includes colorant-containing polymer particles (A) obtained by dispersing a colorant with a water-soluble polymer (x) and a water-insoluble polymer (y), a water-soluble organic solvent (B) and water, wherein a weight ratio of the water-insoluble polymer (y) to the water-soluble polymer (x) [(y)/(x)] is from 2.0 to 5.0, and a content of the water-soluble organic solvent (B) in the ink is from 10 to 70% by weight. The water-based ink for ink-jet printing according to the first invention is excellent in ejection property and optical density and exhibits a low viscosity. The second invention relates to a process for producing a water dispersion for ink-jet printing, which includes a step (I) of mixing a dispersion of a colorant with an emulsion of a water-insoluble polymer containing an organic solvent; a step (II) of subjecting the resulting mixture to dispersing treatment to obtain a dispersion of the colorant onto which the water-insoluble polymer is deposited; and a step (III) of removing the organic solvent from the resulting dispersion. The water dispersion produced by the process of the second invention is capable of exhibiting a high optical density suitable for high-speed printing.
摘要:
Disclosed is a semiconductor light emitting element (1) which is provided with an n-type semiconductor layer (140), a light emitting layer (150), a p-type semiconductor layer (160), a transparent electrode (170), a p-side electrode (300) formed on the transparent electrode (170), and an n-side electrode (400) formed on the n-type semiconductor layer (140). The p-side electrode (300) is provided with a p-side joining layer (310) and a p-side bonding pad electrode (320), which are laminated on the transparent electrode (170), and the n-side electrode (400) is provided with an n-side joining layer (410) and an n-side bonding pad electrode (420), which are laminated on the n-type semiconductor layer (140). The p-side joining layer (310) and the n-side joining layer (410) are configured of a mixed layer composed of TaN and Pt, and the p-side bonding pad electrode (320) and the n-side bonding pad electrode (420) are configured of a laminated structure composed of Pt and Au. Thus, the configuration is simplified by making the two electrodes have the common structure, and deterioration of the electrical characteristics of the semiconductor light emitting element is suppressed, while improving the joining property of the electrodes.
摘要:
This gallium nitride-based compound semiconductor light emitting device includes an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer that are composed of gallium nitride-based compound semiconductors and are deposited in that order on a substrate, and further includes a negative electrode and a positive electrode that are in contact with the n-type semiconductor layer and the p-type semiconductor layer, respectively, wherein the positive electrode has a translucent electrode composed of a three-layer structure including a contact metal layer that contacts at least the p-type semiconductor layer, a current diffusion layer provided on the contact metal layer and having conductivity greater than that of the contact metal layer, and a bonding pad layer provided on the current diffusion layer, and a mixed positive electrode-metal layer including a metal that forms the contact metal layer is present in a positive electrode side surface of the p-type semiconductor layer.
摘要:
An object of the present invention is to provide a gallium nitride compound semiconductor light-emitting device having a positive electrode that exhibits low contact resistance with a p-type gallium nitride compound semiconductor layer and that can be fabricated with high productivity. The inventive gallium nitride compound semiconductor light-emitting device includes a substrate, an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, a negative electrode provided in contact with the n-type semiconductor layer, and a positive electrode provided in contact with the p-type semiconductor layer, the layers being successively provided atop the substrate in this order and being composed of a gallium nitride compound semiconductor, wherein the positive electrode includes at least a contact metal layer which is in contact with the p-type semiconductor layer, the contact metal layer comprises at least one metal selected from the group consisting of Pt, Ir, Rh, Pd, Ru, Re, and Os, or an alloy containing said at least one metal, and the surface portion of the p-type semiconductor layer on the positive electrode side includes a positive-electrode-metal-containing layer that contains at least one metal selected from the group consisting of Pt, Ir, Rh, Pd, Ru, Re, and Os.
摘要:
In a connector having at least one contact (3a,3b) held by an insulator (2a), a high-frequency current suppressor (4a,4b) is provided on the contact or the insulator. The high-frequency current suppressor serves to attenuate a high-frequency current flowing through the contact and having a frequency within a frequency band between several tens MHz and several GHz.
摘要:
A semiconductor light emitting element (1) provided with an n-type semiconductor layer (140), a light emitting layer (150), a p-type semiconductor layer (160), a transparent electrode (170), a p-side electrode (300) formed on the transparent electrode, and an n-side electrode (400) formed on the n-type semiconductor layer. The p-side electrode has a p-side joining layer (310) and a p-side bonding pad electrode (320), which are laminated on the transparent electrode, and the n-side electrode has an n-side joining layer (410) and an n-side bonding pad electrode (420), which are laminated on the n-type semiconductor layer. The p-side joining layer and the n-side joining layer are configured of a mixed layer composed of TaN and Pt, and the p-side bonding pad electrode and the n-side bonding pad electrode are configured of a laminated structure composed of Pt and Au.
摘要:
An object of the present invention is to provide a positive electrode, in which the silver is used, for a compound-semiconductor light-emitting device high in inverse voltage and excellent in stability and productivity. The inventive positive electrode for a compound-semiconductor light-emitting device comprises a reflective layer of a silver alloy.