公开(公告)号：US20190072635A1

公开(公告)日：2019-03-07

申请号：US15908116

申请日：2018-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE ,  Hyeokki HONG

IPC: G01S3/808 ,  G10K11/178 ,  G10K11/36

CPC classification number: G01S3/8086 ,  G01S3/805 ,  G10K11/1781 ,  G10K11/36

Abstract: Provided is a sound direction detection sensor capable of detecting a direction from which sound is coming by using a multi-resonator array. The disclosed sound direction detection sensor includes two resonator arrays, each including a plurality of resonators having different resonance frequencies. The two resonator arrays have different directivities. Each resonator array serves as an audio sensor, and the sound direction detection sensor detects a direction from which sound is incident, regardless of a distance between audio sensors.

公开(公告)号：US20230212001A1

公开(公告)日：2023-07-06

申请号：US17941380

申请日：2022-09-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Choongho RHEE ,  Sungchan KANG ,  Cheheung KIM ,  Yongseop YOON

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81B2207/05 ,  B81B2207/03

Abstract: Provided is a micro electro-mechanical system (MEMS) sensor including a substrate including a first cavity, a first frame including a second cavity at least partially overlapping the first cavity, at least a portion of the first frame being spaced apart from the substrate, a plurality of resonators, each of the plurality of resonators including a first end connected to the first frame and a second end extending into the second cavity, and a second frame including a first region connected to the first frame and a second region spaced apart from the first frame and connected to the substrate.

公开(公告)号：US20230199358A1

公开(公告)日：2023-06-22

申请号：US17734677

申请日：2022-05-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongseop YOON ,  Cheheung KIM

IPC: H04R1/04 ,  H04R1/08 ,  H04R1/34

CPC classification number: H04R1/04 ,  H04R1/083 ,  H04R1/342

Abstract: A microphone package and an electronic apparatus including the same are provided. The microphone package includes a substrate in which an acoustic hole and a via hole are formed; an acoustic sensor attached to a front surface of the substrate and covering the acoustic hole; a first electrode pad provided on the front surface of the substrate; a second electrode pad provided on a rear surface of the substrate and electrically connected to the first electrode pad through the via hole; and a third electrode pad on a side surface of the substrate and electrically connected to the second electrode pad.

公开(公告)号：US20220240006A1

公开(公告)日：2022-07-28

申请号：US17717968

申请日：2022-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheheung KIM ,  Sungchan KANG ,  Hyeokki HONG ,  Hyunwook KANG ,  Yongseop YOON ,  Choongho RHEE

IPC: H04R1/32 ,  H04R3/00 ,  H04R17/10

Abstract: A compact directional acoustic sensor having an improved signal-to-noise ratio is disclosed. The disclosed directional acoustic sensor includes a first sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one first output signal having a first polarity based on external energy received from an input direction; a second sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one second output signal having a second polarity, that is different than the first polarity, based on the external energy received from the input direction; and at least one signal processor configured to generate at least one final output signal based on the at least one first output signal and the at least one second output signal.

公开(公告)号：US20220060814A1

公开(公告)日：2022-02-24

申请号：US17152292

申请日：2021-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Yongseop YOON ,  Hyeokki HONG

IPC: H04R1/32 ,  H04R17/02 ,  H04R17/10 ,  G01H13/00

Abstract: Provided is a directional acoustic sensor. The acoustic sensor includes a support a plurality of resonators provided on the support, and extending in a length direction. Each resonator of the plurality of resonators may include a base; and a frame provided on the base and extending continuously along a length of the base in the length direction. The base may have a thickness less than that of the frame.

公开(公告)号：US20210281242A1

公开(公告)日：2021-09-09

申请号：US17327117

申请日：2021-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE

IPC: H03H9/54 ,  H03H9/24 ,  G01H11/08 ,  H04R17/02 ,  H04R17/10 ,  H03H9/13

Abstract: A filter system includes a first resonator having a first resonant frequency, and a second resonator having a second resonant frequency different from the first resonant frequency, and electrically connected to the first resonator. A first response characteristic of the first resonator and a second response characteristic of the second resonator with respect to a frequency include a first section in which a first phase of the first resonator is equal to a second phase of the second resonator, and a second section in which the first phase is different from the second phase by 180 degrees. A first electrode of the first resonator is reversely connected to a second electrode of the second resonator.

公开(公告)号：US20190200119A1

公开(公告)日：2019-06-27

申请号：US16127565

申请日：2018-09-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchan KANG ,  Cheheung KIM ,  Sangha PARK ,  Yongseop YOON ,  Choongho RHEE ,  Hyeokki HONG

IPC: H04R1/34 ,  H04R1/04 ,  H04R7/04

Abstract: A directional microphone is provided which includes a substrate having a cavity that penetrates therethrough, a resonator array of at least one resonator, and a cover member. Each of the resonator array and the cover member covers covering at least a part of the cavity.

公开(公告)号：US20180038901A1

公开(公告)日：2018-02-08

申请号：US15450416

申请日：2017-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheheung KIM ,  Sungchan KANG ,  Yongseop YOON ,  Choongho RHEE

IPC: G01R23/16 ,  H03H9/24

CPC classification number: G01R23/16 ,  G01H3/08 ,  G01H11/08 ,  H03H9/2426 ,  H04R1/245 ,  H04R17/02 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A spectrum analyzer includes: a support substrate; and a plurality of resonators that have center frequencies different from each other, one end of each of the plurality of resonators being fixed to the support substrate. The plurality of resonators are arranged so that an interval between resonators having adjacent center frequencies is secured by a certain value or greater, thus reducing coupling and increasing analysis accuracy.

公开(公告)号：US20160051223A1

公开(公告)日：2016-02-25

申请号：US14826729

申请日：2015-08-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungjoo KIM ,  Yongseop YOON

IPC: A61B8/00 ,  A61B8/08 ,  A61B8/14

CPC classification number: A61B8/4444 ,  A61B8/0825 ,  A61B8/14 ,  A61B8/15 ,  A61B8/4477

Abstract: Provided are an ultrasonic wave diagnosis apparatus including a transducer with variable configurations and a manufacturing method of the same. According to an example embodiment, an ultrasonic wave diagnosis apparatus includes a first transducer unit including a plurality of transducers and a second transducer unit including a plurality of transducers. The first transducer unit and the second transducer unit may be symmetrically placed about a subject. The first transducer unit and the second transducer unit may be connected to each other in a sliding manner.

Abstract translation: 提供一种包括具有可变构造的换能器的超声波诊断装置及其制造方法。 根据示例性实施例，超声波诊断装置包括包括多个换能器的第一换能器单元和包括多个换能器的第二换能器单元。 第一换能器单元和第二换能器单元可以围绕被摄体对称地放置。 第一换能器单元和第二换能器单元可以以滑动的方式彼此连接。

公开(公告)号：US20160045935A1

公开(公告)日：2016-02-18

申请号：US14686459

申请日：2015-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongseop YOON ,  Sungchan KANG ,  Seokwhan CHUNG

IPC: B06B1/02 ,  B81B7/00 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B81B7/008 ,  B81C1/00031

Abstract: Example embodiments relate to a capacitive micromachined ultrasonic transducer (CMUT) having a nanopillar structure and a method of fabricating the same. The CMUT may include a conductive device substrate, a support defining a plurality of cavities corresponding to elements on the device substrate, a membrane on the support to form the plurality of cavities, an upper electrode on the membrane, and a plurality of nanopillars on at least one of the membrane and the device substrate exposed to the plurality of cavities.

Abstract translation: 示例实施例涉及具有纳米柱结构的电容微机械超声换能器（CMUT）及其制造方法。 CMUT可以包括导电器件衬底，限定对应于器件衬底上的元件的多个空腔的支撑件，支撑件上的膜以形成多个空腔，膜上的上电极以及在其上的多个纳米柱 膜和装置基板中的至少一个暴露于多个空腔。