公开(公告)号：US11430705B2

公开(公告)日：2022-08-30

申请号：US16845485

申请日：2020-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungryong Han ,  Sangmoo Park ,  Hyunsun Kim

IPC: H01L21/66 ,  H01L25/16 ,  H01L33/62 ,  H01L25/075 ,  H01L27/15 ,  G09G3/32 ,  G09G3/00 ,  H01L33/00

Abstract: A display panel and a method of manufacturing thereof are provided. The method of manufacturing a display panel includes forming a driving circuit on a substrate; forming an electrode, including a first area and a second area therewith, on the driving circuit; mounting a first micro Light Emitting Diode (LED), for forming a sub pixel, on the first area; forming an absorption layer on the second area, the absorption layer configured to absorb an external light; removing, based on the sub pixel being defective, the absorption layer; and mounting a second micro LED on the second area after removing the absorption layer.

公开(公告)号：US20220173270A1

公开(公告)日：2022-06-02

申请号：US17674520

申请日：2022-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Sangmoo Park ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Minsub Oh ,  Dongyeob Lee

IPC: H01L33/00 ,  H01L33/62

Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

公开(公告)号：US20200083283A1

公开(公告)日：2020-03-12

申请号：US16561161

申请日：2019-09-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonsuk Lee ,  Doyoung Kwag ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh

IPC: H01L27/15 ,  H01L27/32 ,  G02F1/135

Abstract: A display module includes a substrate, a plurality of LEDs that are disposed on the substrate and irradiate light, and a light blocking layer that covers the plurality of LEDs, and fills intervals among the plurality of LEDs, each interval of the intervals being a distance between two adjacent LEDs of the plurality of LEDs, and wherein the light blocking layer includes a plurality of openings formed such that a top surface of each of the plurality of LEDs is exposed

公开(公告)号：US20230387095A1

公开(公告)日：2023-11-30

申请号：US18208034

申请日：2023-06-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeseok Kim ,  Eunhye Kim ,  Sangmoo Park ,  Yoonsuk Lee ,  Seungryong Han

IPC: H01L25/16 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2919 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29021 ,  H01L2224/29028 ,  H01L2224/32147 ,  H01L2924/12041

Abstract: In some embodiments, a display module for implementing an image using an inorganic light emitting device includes a substrate, a thin film transistor (TFT) layer provided on the substrate, a plurality of connection pads provided on the TFT layer, an anisotropic conductive layer provided on the TFT layer, an inorganic light emitting element bonded to the anisotropic conductive layer, and a conductive ball control layer provided in a surrounding area of the plurality of connection pads. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive balls distributed inside the adhesive layer. The inorganic light emitting element includes a plurality of electrodes corresponding to the plurality of connection pads. The conductive ball control layer is configured to restrict the plurality of conductive balls from moving in a direction perpendicular to a bonding direction while the inorganic light emitting element is being bonded to the anisotropic conductive layer.

公开(公告)号：US11710431B2

公开(公告)日：2023-07-25

申请号：US17070581

申请日：2020-10-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul Kim ,  Doyoung Kwag ,  Sangmoo Park ,  Minsub Oh

IPC: G09G3/00 ,  H01L27/15 ,  H01L33/38 ,  H01L33/62

CPC classification number: G09G3/006 ,  H01L27/156 ,  H01L33/38 ,  H01L33/62

Abstract: A method of manufacturing a display apparatus includes performing a first repair process of detecting a first defective light emitting diode (LED) from among a plurality of LEDs provided on a sapphire substrate and removing the first defective LED; attaching the plurality of LEDs to electrode patterns of an interposer substrate and separating the sapphire substrate from the plurality of LEDs; and performing a second repair process of detecting a second defective LED among the plurality of LEDs attached to the electrode patterns and replacing the second defective LED.

公开(公告)号：US11469343B2

公开(公告)日：2022-10-11

申请号：US16768492

申请日：2019-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk Lee ,  Doyoung Kwag ,  Sangmoo Park

IPC: H01L33/00 ,  H01L33/56 ,  H01L21/683

Abstract: A compression bonding apparatus is disclosed. The compression bonding apparatus comprises: a stage configured to support a substrate on which a plurality of light emitting elements are arranged on an adhesive layer having a predetermined viscosity; a support member disposed on the stage and surrounding at least a part of a side surface of the substrate; and a pressing member configured to press the plurality of light emitting elements, wherein the support member is configured to have a height equal to or greater than the height of the substrate.

公开(公告)号：US11289622B2

公开(公告)日：2022-03-29

申请号：US16832884

申请日：2020-03-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk Lee ,  Sangmoo Park ,  Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Minsub Oh ,  Dongyeob Lee

IPC: H01L33/00 ,  H01L33/62

Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.

公开(公告)号：US11289462B2

公开(公告)日：2022-03-29

申请号：US16866027

申请日：2020-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Byungchul Kim ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Dongyeob Lee ,  Yoonsuk Lee

IPC: H01L25/13 ,  H01L33/00

Abstract: A display module is provided. The display module includes: a substrate; a thin film transistor (TFT) layer formed on one surface of the substrate; and a plurality of micro LEDs disposed on the TFT layer. The plurality of micro LEDs are transferred from a transfer substrate to the TFT layer by a laser beam radiated to the transfer substrate through openings of a mask. The openings correspond to regions in which the respective micro LEDs of the transfer substrate are arranged and the openings correspond to a width, a length, or a unit area of each of the micro LEDs.

公开(公告)号：US11244932B2

公开(公告)日：2022-02-08

申请号：US16675944

申请日：2019-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L25/075 ,  H01L33/62 ,  H01L25/16 ,  H01L23/00 ,  H01L33/48 ,  H01L33/38 ,  H01L33/32 ,  H01L33/06

Abstract: A display apparatus includes a substrate in which a plurality of pads are disposed, a plurality of micro LEDs, wherein each micro LED from among the plurality of micro LEDs is electrically connected to a respective group of pads from among the plurality of pads and mounted on the substrate, and a plurality of protrusion members, wherein each protrusion member from among the plurality of protrusion members protrudes from the substrate and is formed adjacent to a respective pad from among the plurality of pads.

公开(公告)号：US11222797B2

公开(公告)日：2022-01-11

申请号：US16731468

申请日：2019-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Eunhye Kim ,  Sangmoo Park ,  Minsub Oh ,  Yoonsuk Lee

IPC: H01L21/67 ,  H01L33/62 ,  H01L25/075 ,  H01L21/683

Abstract: A light-emitting diode (LED) transfer device is provided. The LED transfer device includes a transfer assembly configured to move a first substrate, on which a plurality of LEDs are provided, above a second substrate, a laser light source configured to emit a laser beam toward the first substrate, a mask that is disposed between the first substrate and the laser light source and has a plurality of openings that are configured to be selectively exposed and blocked and a processor configured to control the transfer assembly to move the first substrate to a predetermined position and selectively rotate the first substrate, and control the mask to expose and block the plurality of openings corresponding to the plurality of LEDs to be transferred from the first substrate to the second substrate.