Electronic device including display with bent area
    24.
    发明授权
    Electronic device including display with bent area 有权
    电子设备包括显示弯曲区域

    公开(公告)号:US09578149B2

    公开(公告)日:2017-02-21

    申请号:US14990458

    申请日:2016-01-07

    CPC classification number: H04M1/0268 H04B1/385 H04M1/0202 H04M1/0266 H04M1/185

    Abstract: A portable electronic device is provided. The electronic device includes a transparent front glass cover including a planar portion that forms a front surface of the electronic device, a planar rear glass cover that forms a rear surface of the electronic device, a metal bezel that surrounds a space formed by the front glass cover and the rear glass cover, and a flexible display device that is embedded in the space and exposed through the front glass cover. The front cover includes a left bent portion and a right bent portion on the left and right of the planar portion at the center of the front cover.

    Abstract translation: 提供便携式电子设备。 电子装置包括透明前玻璃盖,其包括形成电子装置的前表面的平面部分,形成电子装置的后表面的平面后玻璃盖,围绕由前玻璃形成的空间的金属边框 盖和后玻璃盖,以及嵌入在空间中并通过前玻璃罩暴露的柔性显示装置。 前盖包括在前盖的中心处的平面部分的左侧和右侧的左弯曲部分和右弯曲部分。

    ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING OF THE ELECTRONIC DEVICE
    26.
    发明申请
    ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING OF THE ELECTRONIC DEVICE 有权
    用于制造电子设备的电子设备和方法

    公开(公告)号:US20150245513A1

    公开(公告)日:2015-08-27

    申请号:US14559500

    申请日:2014-12-03

    Inventor: Hee-Cheul Moon

    Abstract: An electronic device includes an inner case, at least one radiator disposed on a surface of the inner case, and an outer case integrally formed on the surface of the inner case, in which the outer case at least partially conceals the radiator. A method for manufacturing a housing of an electronic device includes molding an inner member by injecting resin into an injection mold, extracting the inner member from the mold, forming or disposing a conductive pattern on a surface of the inner member, inserting the inner member comprising the conductive pattern into another injection mold, and molding a periphery member that encloses at least a portion of the inner member by injecting resin to the other injection mold, wherein rigidity or stiffness of the inner member is higher than that of the periphery member. Other embodiments are also disclosed.

    Abstract translation: 电子设备包括内壳体,设置在内壳体的表面上的至少一个散热器和一体地形成在内壳体的表面上的外壳,其中外壳至少部分地遮蔽散热器。 一种用于制造电子设备的外壳的方法包括:通过将树脂注射到注射模具中来模制内部构件,从模具中提取内部构件,在内部构件的表面上形成或布置导电图案,插入内部构件,其包括 将导电图案插入到另一个注射模具中,并且通过将树脂注射到另一注射模具来模制包围内部构件的至少一部分的外围构件,其中内部构件的刚性或刚度高于外围构件的刚度或刚度。 还公开了其他实施例。

    MOUNTING STRUCTURE FOR CIRCUIT BOARDS IN ELECTRONIC DEVICE
    27.
    发明申请
    MOUNTING STRUCTURE FOR CIRCUIT BOARDS IN ELECTRONIC DEVICE 有权
    电子设备中电路板的安装结构

    公开(公告)号:US20130294047A1

    公开(公告)日:2013-11-07

    申请号:US13875063

    申请日:2013-05-01

    Abstract: A mounting structure for circuit boards in an electronic device is provided. The mounting structure includes a housing, a first circuit board, a second circuit board, and an electrical connector. The housing houses parts. The first circuit board is fixed to the housing. The second circuit board is overlapped in at least a portion with the first circuit board and is fixed to the housing. The electrical connector is configured to electronically connect the first circuit board and the second circuit board.

    Abstract translation: 提供了一种用于电子设备中的电路板的安装结构。 安装结构包括壳体,第一电路板,第二电路板和电连接器。 住房部分。 第一个电路板固定在外壳上。 第二电路板至少与第一电路板重叠并且固定到壳体。 电连接器被配置为电连接第一电路板和第二电路板。

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