公开(公告)号：US11617257B2

公开(公告)日：2023-03-28

申请号：US17298810

申请日：2021-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun Lee ,  Eunseok Hong ,  Byeongkeol Kim ,  Jongmin Jeon

IPC: H05K1/02 ,  H05K1/03

Abstract: Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band. The first multiple layers may include a first punched region in which at least a portion overlapping the first signal line and the second signal line is removed, the second multiple layers may include a second punched region in which at least a portion overlapping the power line is removed, and at least a portion of the second punched region and the first punched region overlap each other forming a slit penetrating the flexible circuit board in the first direction.

公开(公告)号：US11503702B2

公开(公告)日：2022-11-15

申请号：US17286160

申请日：2019-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunseok Hong

IPC: H05K1/02 ,  H01P3/08 ,  H05K1/14 ,  H05K9/00

Abstract: An electronic device according to various embodiments of the present invention may comprise: a circuit substrate comprising a first layer including a first wire, a second wire formed at one side surface of the first wire along the first wire, and a third wire formed at the other side surface of the first wire along the first wire, a second layer including a ground plane formed along the first wire, the second wire, and the third wire and electrically connected to the second wire and the third wire, and an insulation layer disposed between the first layer and the second layer and having first permittivity; and a conductive member which is disposed above the first layer to have a dielectric-fillable interval space along the first wire and is electrically connected to the ground of the electronic device, the dielectric having second permittivity lower than the first permittivity.

公开(公告)号：US11121067B2

公开(公告)日：2021-09-14

申请号：US16791575

申请日：2020-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunseok Hong

IPC: H01L23/498 ,  H01L23/528 ,  H01L25/065

Abstract: An electronic device includes a housing, a first substrate disposed in the housing and configured to face a first direction, wherein the first substrate includes a first interconnection, a second substrate located in the first direction from the first substrate, wherein the second substrate includes a second interconnection, and a plurality of interposers formed between the first substrate and the second substrate to electrically connect the first interconnection and the second interconnection, wherein the plurality of interposers is configured to at least partially surround a shielded space formed between the first substrate and the second substrate, wherein each of the plurality of interposers includes a plurality of layers configured to face a direction perpendicular to the first direction, and wherein at least one of the plurality of layers includes a conductive pattern that extends in the first direction and is electrically connected with the first interconnection and the second interconnection.

公开(公告)号：US10120466B2

公开(公告)日：2018-11-06

申请号：US15244185

申请日：2016-08-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyounghwan Park ,  Eunseok Hong ,  Shinho Kim ,  Wonseob Kim

IPC: G06F3/038 ,  G06F3/0346 ,  G06F3/0354 ,  G06F3/046

Abstract: A pen input device having malfunction prevention function and method of preventing malfunction thereof are disclosed. The pen input device includes: a housing having a bar form and having one end relatively narrowly opened to form a housing space; a resonant circuit housed within the housing; a tip that protrudes from an open end of the housing to the outside, the tip comprising a dielectric material and being configured to be movable within a predetermined range in a direction of a longitudinal axis of the housing, the tip being further configured to be self-centering; and a ground shielding portion formed in a portion of the housing in which electromagnetic induction occurs, the ground shielding portion not including the tip.

公开(公告)号：US12279365B2

公开(公告)日：2025-04-15

申请号：US17957870

申请日：2022-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunseok Hong

IPC: H05K1/02

Abstract: A flexible circuit board for transmitting a signal in a frequency band includes an intermediate region in which a signal line is disposed as a transmission line for transmitting the signal in the frequency band, and a pad region extending from the intermediate region and disposed at one end or both ends of the flexible circuit board, a pad electrically connected to the signal line and formed to face a first direction of the flexible circuit board, and a ground pattern overlapping at least a portion of the pad and formed to face a second direction of the flexible circuit board and disposed in the pad region where the second direction is opposite to the first direction.

公开(公告)号：US12245374B2

公开(公告)日：2025-03-04

申请号：US17982040

申请日：2022-11-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunseok Hong ,  Jungje Bang

IPC: H05K1/11

Abstract: An electronic device includes a housing, a first substrate, a second substrate, and an interposer disposed between the first substrate and the second substrate and configured to electrically connect the first substrate and the second substrate. The interposer includes a substrate, a first surface, a second surface, and a side surface. The interposer further includes a plurality of first conductive pads, a plurality of second conductive pads, a plurality of conductive posts, a plurality of third conductive terminals at least partially exposed on the first surface and electrically connected to the plurality of first conductive pads via a first conductive via (CV), and a plurality of fourth conductive terminals at least partially exposed on the second surface and electrically connected to the plurality of second conductive pads via a second CV.

公开(公告)号：US12144109B2

公开(公告)日：2024-11-12

申请号：US17967532

申请日：2022-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun Lee ,  Sungwon Park ,  Eunseok Hong

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: A printed circuit board is provided. The printed circuit board includes: an extending region extending along one direction, and a bending region configured to bend with respect to the extending region. The extending region and the bending region includes a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and at least one via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending region, a cross-sectional area of the via hole in contact with the first conductive layer is less than a cross-sectional area of the via hole in contact with the second conductive layer.

公开(公告)号：US11546454B2

公开(公告)日：2023-01-03

申请号：US15734759

申请日：2020-09-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunseok Hong

IPC: H05K5/00 ,  H04M1/02 ,  H05K1/02 ,  H05K1/11

Abstract: Various embodiments of the present disclosure relate to an electronic device which may include: a circuit board; at least one electronic component mounted on the upper surface of the circuit board; at least one connector mounted on the upper surface of the circuit board and electrically connected to the circuit board or the at least one electronic component; and a conductive frame which includes a side wall surrounding a space, in which the at least one electronic component and the at least one connector are disposed, and an extension part extending from one end of the side wall into the space.

公开(公告)号：US11523507B2

公开(公告)日：2022-12-06

申请号：US17267651

申请日：2019-08-09

Applicant: Samsung Electronics Co., Ltd. ,  SI FLEX CO., LTD.

Inventor： Sungwon Park ,  Junghyub Kim ,  Hwanyoul Jeong ,  Seungyup Lee ,  Youngsun Lee ,  Hesuk Jung ,  Eunseok Hong

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/14

Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent. According to one embodiment, a connection member may be provided, the connection member comprising, a first conductive layer including a first logic line, and a second conductive layer in contact with the first conductive layer and including a bonding sheet layer, wherein the second conductive layer includes, a second logic line formed on part of the second conductive layer, and an RF line formed on other part of the second conductive layer, the bonding sheet layer includes, the second conductive layer adhered over the second logic line and the RF line, a first insulating layer formed between the first conductive layer and the second conductive layer, and pins formed on one side of the first conductive layer and the second conductive layer and configured to be electrically connected to connection pins of an external module, and the second conductive layer includes at least one via formed between the second logic line and the RF line so as to energize between the layers included in the second conductive layer. Such a flexible connection member may vary according to embodiments, and an electronic device comprising the flexible connection member may be provided according to various other embodiments.

公开(公告)号：US11516912B2

公开(公告)日：2022-11-29

申请号：US17125512

申请日：2020-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongmin Jeon ,  Eunseok Hong

IPC: H05K1/03 ,  H05K1/18 ,  H05K3/46 ,  H05K3/36 ,  H05K3/02

Abstract: Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.