公开(公告)号：US20210337651A1

公开(公告)日：2021-10-28

申请号：US17366836

申请日：2021-07-02

Applicant: RAYTHEON COMPANY

Inventor： Andrew Southworth ,  Kevin Wilder ,  James Benedict ,  Mary K. Herndon ,  Thomas V. Sikina ,  John P. Haven

IPC: H05K1/02 ,  H01Q1/38 ,  H01Q1/52 ,  H05K3/00 ,  H05K3/30

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

公开(公告)号：US11107610B2

公开(公告)日：2021-08-31

申请号：US16901429

申请日：2020-06-15

Applicant: Raytheon Company ,  University of Massachusetts

Inventor： Erika C. Klek ,  Mary K. Herndon ,  Thomas V. Sikina ,  James E. Benedict ,  Andrew R. Southworth ,  Kevin M. Wilder ,  Oshadha K. Ranasingha ,  Alkim Akyurtlu

IPC: H01C7/00 ,  H01B3/10 ,  H01C17/065

Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.