公开(公告)号：US20150144388A1

公开(公告)日：2015-05-28

申请号：US14551007

申请日：2014-11-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： AKIO FURUSAWA ,  KIYOHIRO HINE ,  MASATO MORI ,  TAICHI NAKAMURA

IPC: H05K1/09 ,  B23K35/26 ,  H05K3/34 ,  H05K1/11 ,  H05K1/18

CPC classification number: B23K35/262 ,  B23K35/0222 ,  B23K35/26 ,  B23K35/40 ,  C22C13/00 ,  H05K1/11 ,  H05K1/111 ,  H05K1/18 ,  H05K3/244 ,  H05K3/3463 ,  H05K2201/0338 ,  H05K2201/10909

Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0≦[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0

Abstract translation: 用于包含含有含有Ni的Au电极的Au电极的焊接中使用的焊料包括满足0.3＆nlE的Ag; [Ag]＆nlE; 4.0，满足0＆nlE的Bi; [Bi]＆nlE; 1.0，满足0＆nlE的Cu; [Cu] 其中焊料中Ag，Bi，Cu和In的含量（质量％）分别由[Ag]，[Bi]，[Cu]和[In]表示。 当[Cu]在0 <[Cu] <0.5的范围内时，焊料材料包括In的范围为6.0＆nlE; [In]＆nlE; 6.8; In为5.2+（6-（1.55×[Cu 当Cu [Cu]在[Cu]的范围内时，[Cu]和nlE; 1.0，In的范围为5.2＆nlE; [In]＆nlE; 6.8当[Cu] 落在1.0 <[Cu]和nlE的范围内。 余量仅包括不少于87质量％的Sn。