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公开(公告)号：US11561350B2
公开(公告)日：2023-01-24
申请号：US17043529
申请日：2019-03-25
IPC分类号： G02B6/42
摘要： To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.
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公开(公告)号：US20180136392A1
公开(公告)日：2018-05-17
申请号：US15737386
申请日：2016-06-01
发明人： Shigeo Nagashima , Yoshiteru Jinnouchi , Takashi Nakayama , Hiroki Kawashiri , Ikuo Ogawa , Yusuke Nasu , Shunichi Soma
CPC分类号： G02B6/125 , G02B6/12 , G02B6/12004 , G02B6/126 , G02B6/13 , G02B6/136 , G02B2006/12116
摘要： In the case of implementing a polarization separation circuit, a polarization rotator, and the like by inserting a thin-film element into a substrate in one optical interference circuit, one common large-sized groove shared among a plurality of thin-film elements for their insertion has been formed. The optical waveguide type device of the present invention is configured such that at least one groove intersects only one corresponding optical waveguide for inserting the thin-film element and does not intersect other optical waveguides adjacent to the one corresponding optical waveguide. This groove substantially has a rectangular shape, and has a minimum size adapted to the thin-film element to be inserted so as to stably hold and fix the thin-film element in the groove. Adjacent grooves are formed so as to be arranged such that their portions in a direction substantially vertical to the optical waveguide are facing each other.
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公开(公告)号：US12078851B2
公开(公告)日：2024-09-03
申请号：US17602198
申请日：2020-04-16
发明人： Shunichi Soma , Yusuke Nasu , Ken Tsuzuki , Takashi Yamada , Kiyofumi Kikuchi
CPC分类号： G02B6/42 , G02B6/12 , G02B6/26 , G02B6/3636
摘要： In a pipe structure in which an optical fiber passes, miniaturization of the optical module in the longitudinal direction of the optical fiber is prevented. In the optical module according to the present invention, a holding structure of the optical fiber necessary to adopt the pipe structure is moved to a cover extension unit of the package. The optical fiber is adhered and fixed to the cover extension unit protruding from the cover body unit of the package to ensure protection of the optical fiber, and the optical waveguide chip is disposed to be closer to an inner wall of a side surface of the package. By disposing the optical waveguide chip to be close to the inner wall of the package as much as possible and reducing the mounting area in the package to the utmost, it is possible to realize miniaturization of the entire optical module.
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公开(公告)号：US11307356B2
公开(公告)日：2022-04-19
申请号：US16957259
申请日：2018-12-19
发明人： Yuichi Suzuki , Tomohiro Nakanishi , Motoki Minami , Hiroshi Tomita , Motohaya Ishii , Shuichiro Asakawa , Shunichi Soma
摘要： An optical module that has a structure ensuring reduction in size. The optical module has a structure where a part of a fiber block is protruded from a housing. By including a thin plate, this optical module can avoid entering of dust in the housing, allows a position shift of the fiber block due to a mounting position error of an optical component in the housing, a position shift of an opening portion due to a dimensional error of the housing, or a displacement due to a temperature change, and can reduce the coupling loss due to the optical axis misalignment.
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公开(公告)号：US20220066110A1
公开(公告)日：2022-03-03
申请号：US17420356
申请日：2020-01-07
发明人： Yuriko Kawamura , Yusuke Nasu , Kiyofumi Kikuchi , Shunichi Soma
摘要： An object is to easily convey by suction an optical module equipped with optical fibers having ends coupled to optical receptacles and mount the optical module on a substrate. An optical module according to the present invention includes an optical device to which optical fibers having ends coupled to optical receptacles are optically coupled and also includes a carrier composed of a substrate and adhesive layers formed on the upper and lower surfaces of the substrate. The optical device is bonded on the adhesive layer formed on the lower surface of the substrate. Part of the optical fibers and the optical receptacles are bonded on the adhesive layer formed on the surface of the substrate.
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公开(公告)号：US10908356B2
公开(公告)日：2021-02-02
申请号：US16346182
申请日：2017-11-02
发明人： Tomohiro Nakanishi , Motoki Minami , Satoru Konno , Yuichi Suzuki , Teruaki Sato , Shigeo Nagashima , Shinji Mino , Motohaya Ishii , Shunichi Soma , Shin Kamei , Shuichiro Asakawa
摘要： An optical circuit board which is mounted with a loop-back circuit for returning aligning light to the fiber array in the vicinity of the fiber array connection end. Since an aligning loop-back circuit can be formed in an optical waveguide pattern, a production cost does not increase in comparison to an optical circuit board of the related art. The aligning light combined from the optical fiber to the aligning port of the optical circuit board is returned to the optical fiber around the loop-back circuit. Therefore, it is possible to perform alignment using the returned light. That is, alignment can be performed while being mounted on a package without installing a light-reflecting film or mirror.
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公开(公告)号：US10165690B2
公开(公告)日：2018-12-25
申请号：US15735726
申请日：2016-06-17
发明人： Mitsuo Usui , Kiyofumi Kikuchi , Ken Tsuzuki , Hiroshi Fukuda , Shuichiro Asakawa , Shin Kamei , Shunichi Soma , Takashi Saida
摘要： In a conventional soldering method, an FPC-side electrode pad and a package-side electrode pad are closely joined together with a solder layer, and the soldered state after a joining process has not been easily confirmed visually. The present invention provides a solder joint structure including a side face electrode which is formed on each of the side faces of the end parts of an FPC board and a package or PCB board that are to be soldered, extending vertically relative to the faces constituting each of electrode pads on the boards, and which introduces solder. On the side face electrodes of the board end parts, a part of solder that is formed continuously from the solder joint portion is visible and the state of the solder joint between the electrode pads on the two boards can be confirmed. The efficiency of solder joint tests can be improved.
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