公开(公告)号：US20020023777A1

公开(公告)日：2002-02-28

申请号：US09919319

申请日：2001-07-31

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda

IPC: H05K001/03

CPC classification number: H05K3/4069 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/12028 ,  Y10T428/12528

Abstract: A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

Abstract translation: 本发明的印刷电路板由电绝缘基材形成，所述电绝缘基材具有沿着所述电绝缘基材的厚度方向形成并且填充有电导体的通孔; 电绝缘基材包括通过用树脂浸渍保持器形成的芯层和形成在芯层两侧的树脂层; 以及在所述电绝缘基材的两面形成为规定图案并通过所述电导体彼此电连接的布线层。 布线层嵌入至少一个树脂层中。 两侧的树脂层的厚度不同，树脂层的薄层的厚度等于或小于电导体中所含的导电填料的平均粒径。 通过调节玻璃布等树脂保持架的两侧形成的树脂层的厚度，可以确保使用导电性糊料作为导电体的电路基板电连接时的高可靠性。