公开(公告)号：US08134760B2

公开(公告)日：2012-03-13

申请号：US12869358

申请日：2010-08-26

Applicant: Leo Baldwin

Inventor： Leo Baldwin

IPC: H04N1/04

CPC classification number: G01N21/9501 ,  G01N21/55 ,  G01N21/8806

Abstract: Systems and methods are provided for achieving convergent light rays emitted by a planar array of light sources. In one embodiment, an imaging device is provided for inspecting semiconductors or other objects. The imaging device includes one or more imaging lens for imaging light reflected from an object. The imaging device also includes a first light source attached to a planar circuit board and a second light source attached to the planar circuit board. The imaging device further includes a first Fresnel prism for directing light from the first light source toward the object from a first direction and a second Fresnel prism for directing light from the second light source toward the object from a second direction. In one embodiment, the imaging device also includes one or more optical elements for increasing or decreasing the divergence of the light.

Abstract translation: 提供了用于实现由平面光源阵列发射的会聚光线的系统和方法。 在一个实施例中，提供了用于检查半导体或其它物体的成像装置。 成像装置包括用于对从物体反射的光成像的一个或多个成像透镜。 成像装置还包括附接到平面电路板的第一光源和附接到平面电路板的第二光源。 成像装置还包括用于将来自第一光源的光从第一方向引导到物体的第一菲涅尔棱镜和用于将来自第二光源的光从第二方向引导到物体的第二菲涅尔棱镜。 在一个实施例中，成像装置还包括用于增加或减少光的发散的一个或多个光学元件。

公开(公告)号：US20100321491A1

公开(公告)日：2010-12-23

申请号：US12869358

申请日：2010-08-26

Applicant: Leo Baldwin

Inventor： Leo Baldwin

IPC: H04N7/18

CPC classification number: G01N21/9501 ,  G01N21/55 ,  G01N21/8806

Abstract: Systems and methods are provided for achieving convergent light rays emitted by a planar array of light sources. In one embodiment, an imaging device is provided for inspecting semiconductors or other objects. The imaging device includes one or more imaging lens for imaging light reflected from an object. The imaging device also includes a first light source attached to a planar circuit board and a second light source attached to the planar circuit board. The imaging device further includes a first Fresnel prism for directing light from the first light source toward the object from a first direction and a second Fresnel prism for directing light from the second light source toward the object from a second direction. In one embodiment, the imaging device also includes one or more optical elements for increasing or decreasing the divergence of the light.

Abstract translation: 提供了用于实现由平面光源阵列发射的会聚光线的系统和方法。 在一个实施例中，提供了用于检查半导体或其它物体的成像装置。 成像装置包括用于对从物体反射的光成像的一个或多个成像透镜。 成像装置还包括附接到平面电路板的第一光源和附接到平面电路板的第二光源。 成像装置还包括用于将来自第一光源的光从第一方向引导到物体的第一菲涅尔棱镜和用于将来自第二光源的光从第二方向引导到物体的第二菲涅尔棱镜。 在一个实施例中，成像装置还包括用于增加或减少光的发散的一个或多个光学元件。

公开(公告)号：US20090179017A1

公开(公告)日：2009-07-16

申请号：US12412853

申请日：2009-03-27

Applicant: Hisashi Matsumoto ,  Mark Singer ,  Leo Baldwin ,  Jeffrey E. Howerton ,  David V. Childers

Inventor： Hisashi Matsumoto ,  Mark Singer ,  Leo Baldwin ,  Jeffrey E. Howerton ,  David V. Childers

IPC: B23K26/38

CPC classification number: H05K3/0035 ,  B23K26/03 ,  B23K26/06 ,  B23K26/389 ,  B23K2101/42 ,  H05K1/0269 ,  H05K2201/09454 ,  H05K2203/163

Abstract: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.

Abstract translation: 用于在具有多个不同几何形状的多个捕获垫的电路基板的至少一层中激光形成盲通孔的方法可以包括：至少一个盲孔以形成在电路基板的至少一层中， 相对于在钻孔位置处形成的盲孔通孔几何值（例如面积和/或体积），距离钻孔位置预定距离内的捕获垫几何值（例如面积和/或体积）。 该过程可以包括基于评估设置至少一个激光操作参数，以便在盲通孔形成之后获得期望的捕获垫外观。 该过程可以包括将被定义为距电路基板的至少一层中的盲孔通孔位置的预定距离范围内的捕获区域成像，量化成像捕获区域的至少一个出现值，以及确定可接受性 基于量化外观值的成像捕获垫区域。

公开(公告)号：US20120250134A1

公开(公告)日：2012-10-04

申请号：US13494839

申请日：2012-06-12

Applicant: Mark A. Unrath ,  Peter Pirogovsky ,  Leo Baldwin

Inventor： Mark A. Unrath ,  Peter Pirogovsky ,  Leo Baldwin

IPC: G02F1/01

CPC classification number: B23K26/0676 ,  B23K26/0613 ,  B23K26/066 ,  B23K26/705

Abstract: A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.

Abstract translation: 激光处理系统快速且灵活地修改处理光束，以确定并实现特定应用（或应用的子集）的改进或最佳光束简档。 该系统降低了光束成形子系统对激光加工系统变化的敏感性，包括由制造公差，热漂移，部件性能变化以及其他系统变化来源引起的偏差。 某些实施例还操纵较低质量的激光束（较高的M2值）以提供可接受的成形梁轮廓。

公开(公告)号：US08198564B2

公开(公告)日：2012-06-12

申请号：US12207338

申请日：2008-09-09

Applicant: Mark A. Unrath ,  Peter Pirogovsky ,  Leo Baldwin

Inventor： Mark A. Unrath ,  Peter Pirogovsky ,  Leo Baldwin

IPC: B23K26/00

CPC classification number: B23K26/0676 ,  B23K26/0613 ,  B23K26/066 ,  B23K26/705

Abstract: A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.

Abstract translation: 激光处理系统快速且灵活地修改处理光束，以确定并实现特定应用（或应用的子集）的改进或最佳光束简档。 该系统降低了光束成形子系统对激光加工系统变化的敏感性，包括由制造公差，热漂移，部件性能变化以及其他系统变化来源引起的偏差。 某些实施例还操纵较低质量的激光束（较高的M2值）以提供可接受的成形梁轮廓。

公开(公告)号：US20100243626A1

公开(公告)日：2010-09-30

申请号：US12413531

申请日：2009-03-28

Applicant: Leo Baldwin

Inventor： Leo Baldwin

IPC: B23K26/00 ,  B23K26/06

CPC classification number: B23K26/073 ,  B23K26/0622

Abstract: A method and apparatus is presented for laser machining complex features in workpieces using programmable laser focal spot shapes. A deformable mirror is inserted into the laser beam path of a laser machining system and programmed to alter the shape of the laser beam focal spot in real time as the workpiece is being laser machined in order to achieve improved control over the shape and size of laser machined features.

Abstract translation: 提出了一种使用可编程激光焦点形状激光加工工件中复杂特征的方法和装置。 将可变形反射镜插入到激光加工系统的激光束路径中，并且被编程为在激光加工工件时实时改变激光束焦点的形状，以便实现对激光器的形状和尺寸的改进的控制 加工功能。

公开(公告)号：US20100224232A1

公开(公告)日：2010-09-09

申请号：US12720429

申请日：2010-03-09

Applicant: Eric Bryant Cummings ,  Leo Baldwin

Inventor： Eric Bryant Cummings ,  Leo Baldwin

IPC: H01L31/052

CPC classification number: G02B19/008 ,  F24S23/12 ,  F24S23/31 ,  F24S23/74 ,  F24S23/79 ,  F24S50/00 ,  G02B17/086 ,  G02B19/0028 ,  G02B19/0042 ,  H01L31/0543 ,  H01L31/0547 ,  Y02E10/45 ,  Y02E10/52

Abstract: Embodiments of the present invention employ certain techniques, alone or in combination, to enhance a range of acceptance angles at which an apparatus may efficiently collect solar radiation. One technique positions a passive secondary optical compensator element between collected light and a receiver. In certain embodiments, the compensator element accomplishes refraction followed by at least one total internal reflection of the collected light. Another technique employs a receiver having radially-oriented strings of cells connected in series, where strings in opposing sectors are connected in parallel and in series with each other to reduce a dependence of power and/or current output, on alignment of the collector apparatus relative to a light source.

Abstract translation: 本发明的实施例单独地或组合地采用某些技术来增强设备可有效收集太阳辐射的接受角度的范围。 一种技术在收集的光和接收器之间定位无源辅助光学补偿元件。 在某些实施例中，补偿器元件完成折射，接着是所收集的光的至少一个全内反射。 另一种技术采用具有串联连接的单元的径向取向串的接收器，其中相对的扇区中的串并联并且彼此串联连接，以减少功率和/或电流输出的依赖性，对集电器装置相对的对准 到光源。

公开(公告)号：US07787159B2

公开(公告)日：2010-08-31

申请号：US11482539

申请日：2006-07-07

Applicant: Leo Baldwin

Inventor： Leo Baldwin

IPC: H04N1/04

CPC classification number: G01N21/9501 ,  G01N21/55 ,  G01N21/8806

Abstract: Systems and methods are provided for achieving convergent light rays emitted by a planar array of light sources. In one embodiment, an imaging device is provided for inspecting semiconductors or other objects. The imaging device includes one or more imaging lens for imaging light reflected from an object. The imaging device also includes a first light source attached to a planar circuit board and a second light source attached to the planar circuit board. The imaging device further includes a first Fresnel prism for directing light from the first light source toward the object from a first direction and a second Fresnel prism for directing light from the second light source toward the object from a second direction. In one embodiment, the imaging device also includes one or more optical elements for increasing or decreasing the divergence of the light.

Abstract translation: 提供了用于实现由平面光源阵列发射的会聚光线的系统和方法。 在一个实施例中，提供了用于检查半导体或其它物体的成像装置。 成像装置包括用于对从物体反射的光成像的一个或多个成像透镜。 成像装置还包括附接到平面电路板的第一光源和附接到平面电路板的第二光源。 成像装置还包括用于将来自第一光源的光从第一方向引导到物体的第一菲涅尔棱镜和用于将来自第二光源的光从第二方向引导到物体的第二菲涅尔棱镜。 在一个实施例中，成像装置还包括用于增加或减少光的发散的一个或多个光学元件。

公开(公告)号：US07599576B2

公开(公告)日：2009-10-06

申请号：US10921032

申请日：2004-08-18

Applicant: Leo Baldwin

Inventor： Leo Baldwin

IPC: G06K9/40

CPC classification number: G06K9/2036

Abstract: A method of removing an artifact resulting from an in-line illumination device of an imaging system from an object image. It includes obtaining a first image of the artifact using a first artifact illumination level and imaging the object using the imaging system wherein the illumination device is using an object illumination level. An artifact image is independent of the object and has pixel values related to the illumination level. Thus, the artifact can be removed by subtracting respective pixel values of an artifact image from respective values of the object image on a pixel address-by-pixel address basis. Various illumination levels can be used to create more than one artifact image. The artifact image for the subtraction can be one of the images taken or can be a scaled image where an artifact image is scaled to the object illumination level.

Abstract translation: 一种从对象图像中去除由成像系统的在线照明装置产生的假象的方法。 它包括使用第一假象照明级获得伪像的第一图像，并且使用其中照明装置正在使用对象照明级别的成像系统对对象进行成像。 伪影图像与对象无关，并具有与照明级别相关的像素值。 因此，可以通过从像素地址逐像素地址的对象图像的各个值中减去伪影图像的各个像素值来去除伪像。 可以使用各种照明级别来创建多个伪影图像。 用于减法的伪影图像可以是拍摄的图像之一，也可以是将伪像图像缩放到对象照明级别的缩放图像。

公开(公告)号：US20080011715A1

公开(公告)日：2008-01-17

申请号：US11484531

申请日：2006-07-11

Applicant: Hisashi Matsumoto ,  Mark Singer ,  Leo Baldwin ,  Jeffrey E. Howerton ,  David V. Childers

Inventor： Hisashi Matsumoto ,  Mark Singer ,  Leo Baldwin ,  Jeffrey E. Howerton ,  David V. Childers

IPC: G01L21/30 ,  B44C1/22

CPC classification number: H05K3/0035 ,  B23K26/03 ,  B23K26/06 ,  B23K26/389 ,  B23K2101/42 ,  H05K1/0269 ,  H05K2201/09454 ,  H05K2203/163

Abstract: A process for laser forming a blind via in at least one layer of a circuit substrate having a plurality of capture pads of varying geometry can include, for at least one blind via to be formed in at least one layer of a circuit substrate, evaluating a capture pad geometry value (such as area and/or volume) within a predetermined distance from a drilling location with respect to a blind via geometry value (such as area and/or volume) to be formed at the drilling location. The process can include setting at least one laser operating parameter based on the evaluation in order to obtain a desired capture pad appearance after blind via formation. The process can include imaging a capture pad area defined as an area within a predetermined distance from a blind via drilling location in at least one layer of a circuit substrate, quantifying at least one appearance value for the imaged capture pad area, and determining an acceptability of the imaged capture pad areas based on the quantified appearance value.

Abstract translation: 用于在具有多个不同几何形状的多个捕获垫的电路基板的至少一层中激光形成盲通孔的方法可以包括：至少一个盲孔以形成在电路基板的至少一层中， 相对于在钻孔位置处形成的盲孔通孔几何值（例如面积和/或体积），距离钻孔位置预定距离内的捕获垫几何值（例如面积和/或体积）。 该过程可以包括基于评估设置至少一个激光操作参数，以便在盲通孔形成之后获得期望的捕获垫外观。 该过程可以包括将被定义为距电路基板的至少一层中的盲孔通孔位置的预定距离范围内的捕获区域成像，量化成像捕获区域的至少一个出现值，以及确定可接受性 基于量化外观值的成像捕获垫区域。