公开(公告)号：US20140362607A1

公开(公告)日：2014-12-11

申请号：US14466326

申请日：2014-08-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zengyi Lu ,  Yongfa Zhu ,  Yadong Bai ,  Wei Chen ,  Zhaoguo Jin

IPC: H02M3/337

CPC classification number: H02M3/3376 ,  H01F3/14 ,  H01F27/38 ,  H02M3/28 ,  H02M3/33592 ,  H02M2001/0064 ,  Y02B70/1475

Abstract: A magnetic integration double-ended converter with an integrated function of a transformer and an inductor includes an integrated magnetic member having a magnetic core with three magnetic columns having at least three windings (NP, NS1, NS2) and at least one energy storage air gap, where a primary winding (NP) and a first secondary winding (NS1) are both wound around a first magnetic column or are both wound around a second magnetic column and a third magnetic column, and a second secondary winding (NS2) is wound around the second magnetic column; an inverter circuit with double ends symmetrically working, acting on the primary winding (NP); and a group of synchronous rectifiers (SR1, SR2), gate electrode driving signals of which and gate electrode driving signals of a group of power switch diodes (S1, S2) of the inverter circuit with the double ends symmetrically working complement each other.

Abstract translation: 具有变压器和电感器的集成功能的磁集成双端转换器包括具有磁芯的集成磁性构件，磁芯具有三个具有至少三个绕组（NP，NS1，NS2）的磁柱和至少一个储能气隙 ，其中初级绕组（NP）和第一次级绕组（NS1）都卷绕在第一磁性柱上，或者二者缠绕在第二磁性柱和第三磁性柱上，并且第二次级绕组（NS2）缠绕在 第二磁柱; 作用在初级绕组（NP）上的双端对称工作的逆变电路; 和一组同步整流器（SR1，SR2），其双极端对称工作的逆变器电路的一组电源开关二极管（S1，S2）的栅电极驱动信号和栅电极驱动信号相互补充。

公开(公告)号：US20140004720A1

公开(公告)日：2014-01-02

申请号：US14016398

申请日：2013-09-03

Applicant: Huawei Technologies Co., Ltd.

Inventor： Kai Yao ,  Yongfa Zhu ,  Yingpei Huang

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10416

Abstract: A golden finger and a board edge interconnecting device are disclosed. The golden finger includes a printed circuit board (PCB) surface layer and at least one PCB inner layer, where a metal foil of the PCB inner layer is connected to a metal foil of the PCB surface layer through a current-carrying structure, so that a current-carrying channel of the golden finger passes through the PCB surface layer and the PCB inner layer. The board edge interconnecting device includes the foregoing golden finger. In the embodiments, a current-carrying capacity of a PCB in the golden finger is increased without increasing a size and thickness of a copper foil of the PCB in the golden finger, thereby effectively improving the current-carrying capacity of the PCB in the golden finger.

Abstract translation: 公开了金手指和板边缘互连装置。 金手指包括印刷电路板（PCB）表面层和至少一个PCB内层，其中PCB内层的金属箔通过载流结构连接到PCB表面层的金属箔，使得 金手指的载流通道穿过PCB表面层和PCB内层。 板边缘互连装置包括上述金手指。 在实施例中，金手指上的PCB的载流能力增加，而不增加金手指中PCB的铜箔的尺寸和厚度，从而有效地提高了黄金中PCB的载流能力 手指。

公开(公告)号：US12020857B2

公开(公告)日：2024-06-25

申请号：US17155579

申请日：2021-01-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Changsheng Pei ,  Yongfa Zhu ,  Zhiqiang Zeng

IPC: H01F38/14 ,  H01F27/28 ,  H01F27/29 ,  H02J7/02 ,  H02J50/10

CPC classification number: H01F38/14 ,  H01F27/2871 ,  H01F27/29 ,  H02J7/02 ,  H02J50/10

Abstract: A coil module includes a first planar coil winding and a second planar coil winding. A first coil of the first planar coil winding includes a first outer side part and a first inner side part. A first coil of the second planar coil winding includes a second outer side part and a second inner side part. An end part of the first outer side part is connected to an end part of the second inner side part, and an end part of the second outer side part is connected to an end part of the first inner side part.

公开(公告)号：US11916399B2

公开(公告)日：2024-02-27

申请号：US16878178

申请日：2020-05-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Changsheng Pei ,  Yongfa Zhu ,  Heqian Yang ,  Jinsen Cai

IPC: H02J50/00 ,  H01F27/28 ,  H02J50/12 ,  H01F27/29 ,  H01F27/34 ,  H01F38/14 ,  H02J50/40 ,  H02J50/10 ,  H02J50/70

CPC classification number: H02J50/005 ,  H01F27/2823 ,  H01F27/2871 ,  H01F27/292 ,  H01F27/346 ,  H01F38/14 ,  H02J50/10 ,  H02J50/12 ,  H02J50/402 ,  H02J50/70 ,  H01F2027/348

Abstract: This application describes a coil. The coil includes an output terminal, an input terminal, and a wire-winding part that is connected between the output terminal and the input terminal. A slot is disposed on at least a part of the wire-winding part, and a depth of the slot in any direction of a cross section of the wire-winding part is less than or equal to a distance between two points that are the farthest away from each other on the cross section of the wire-winding part. The wire-winding part is a metal conductor made through spiral winding. The input terminal and the output terminal are configured to connect the wire-winding part to an external circuit.

公开(公告)号：US20210012959A1

公开(公告)日：2021-01-14

申请号：US17032158

申请日：2020-09-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Changsheng Pei ,  Yongfa Zhu ,  Zhiqiang Zeng ,  Xiaowei Chen

IPC: H01F38/14 ,  H02J50/12 ,  H02J7/04 ,  H01F27/28 ,  H01F27/32

Abstract: This application discloses a coil module, which includes: an insulation layer, a first planar coil winding, and a second planar coil winding, one turn of coil of the first planar coil winding includes a first portion, a second portion, and a first connection part, and one turn of coil of the second planar coil winding includes a third portion, a fourth portion, and a second connection part. The first connection portion connects an outer side part of the first portion and an inner side part of the second portion, the second connection portion connects an inner side part of the third portion and an outer side part of the fourth portion, and there is an overlap between a projection of the first connection portion on a plane of the insulation layer and a projection of the second connection portion on the plane of the insulation layer.

公开(公告)号：US20200280216A1

公开(公告)日：2020-09-03

申请号：US16879309

申请日：2020-05-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Changsheng Pei ,  Zhiqiang Zeng ,  Yongfa Zhu

IPC: H02J50/12 ,  H02J7/00 ,  H02J50/90 ,  H02J50/80

Abstract: A wireless charging system includes a transmitter and a receiver, the transmitter includes a transmitter coil and a first series matching capacitor, the transmitter coil is connected to the first series matching capacitor in series to form a first oscillation circuit, and the first oscillation circuit is configured to transfer power to the receiver, and the receiver includes a receiver coil and a second series matching capacitor, the receiver coil is connected to the second series matching capacitor in series to form a second oscillation circuit, and the second oscillation circuit is configured to receive the power transferred by the first oscillation circuit.

公开(公告)号：US20200005985A1

公开(公告)日：2020-01-02

申请号：US16559231

申请日：2019-09-03

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shijun Yang ,  Heqian Yang ,  Yongfa Zhu ,  Wei Chen

IPC: H01F27/245 ,  H01L49/02 ,  H01F10/16 ,  H01F41/32 ,  H02M3/158

Abstract: A thin film inductor includes a first magnetic thin film and a second magnetic thin film that are adjacent, the first magnetic thin film is nested in the second magnetic thin film, and a relative magnetic permeability of the first magnetic thin film is less than a relative magnetic permeability of the second magnetic thin film, and a difference between the relative magnetic permeability of the first magnetic thin film and the relative magnetic permeability of the second magnetic thin film is greater than or equal to a first threshold, where when a magnetic induction intensity of the second magnetic thin film reaches a saturated magnetic induction intensity of the second magnetic thin film, a magnetic induction intensity of the first magnetic thin film is less than or equal to a saturated magnetic induction intensity of the first magnetic thin film.

公开(公告)号：US09699901B2

公开(公告)日：2017-07-04

申请号：US14016398

申请日：2013-09-03

Applicant: Huawei Technologies Co., Ltd.

Inventor： Kai Yao ,  Yongfa Zhu ,  Yingpei Huang

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/117 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10416

Abstract: A golden finger and a board edge interconnecting device are disclosed. The golden finger includes a printed circuit board (PCB) surface layer and at least one PCB inner layer, where a metal foil of the PCB inner layer is connected to a metal foil of the PCB surface layer through a current-carrying structure, so that a current-carrying channel of the golden finger passes through the PCB surface layer and the PCB inner layer. The board edge interconnecting device includes the foregoing golden finger. In the embodiments, a current-carrying capacity of a PCB in the golden finger is increased without increasing a size and thickness of a copper foil of the PCB in the golden finger, thereby effectively improving the current-carrying capacity of the PCB in the golden finger.

公开(公告)号：US09484142B2

公开(公告)日：2016-11-01

申请号：US15046656

申请日：2016-02-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Quan Guo ,  Yongfa Zhu ,  Chengzhang Han

IPC: H01F5/00 ,  H01F27/28 ,  H05K7/02 ,  H05K1/16 ,  H01F17/00 ,  H01F17/06 ,  H02M3/06 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H05K3/42 ,  H02M3/158

CPC classification number: H01F27/2804 ,  H01F5/00 ,  H01F17/0013 ,  H01F17/06 ,  H01F2027/2809 ,  H02M3/06 ,  H02M3/158 ,  H02M3/1588 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/165 ,  H05K1/18 ,  H05K3/429 ,  H05K7/02 ,  H05K2201/086 ,  H05K2201/10015 ,  Y02B70/1466

Abstract: The present invention discloses a circuit board, including a substrate and a magnetic core, where the magnetic core is embedded into the substrate, at least one turn of a winding conductor wound around the magnetic core is arranged on the substrate, each turn of the winding conductor includes a first end-surface conductor and a second end-surface conductor that are separately arranged on two ends of the magnetic core, and each turn of the winding conductor further includes a first side-surface conductor that penetrates through the magnetic core from an inner side of the magnetic core and a second side-surface conductor that penetrates through the magnetic core from an outer side of the magnetic core. The circuit board and the power conversion apparatus having the circuit board provided by the present invention, achieve larger inductance, save materials, and reduce cost for fabricating a power conversion apparatus.

Abstract translation: 本发明公开了一种电路板，包括基板和磁芯，其中磁芯嵌入基板中，缠绕在磁芯上的绕组导体的至少一圈设置在基板上，绕组的每一圈 导体包括分开布置在磁芯的两端上的第一端面导体和第二端面导体，绕组导体的每一圈还包括从第一侧面导体和第二端面导体穿过磁芯的第一侧面导体， 磁芯的内侧和从磁芯的外侧穿过磁芯的第二侧面导体。 具有本发明提供的电路板的电路板和电力转换装置实现更大的电感，节省材料并降低制造电力转换装置的成本。

公开(公告)号：US09425686B2

公开(公告)日：2016-08-23

申请号：US14577773

申请日：2014-12-19

Applicant: Huawei Technologies Co., Ltd.

Inventor： Feng Zheng ,  Changsheng Pei ,  Yongfa Zhu

IPC: H01F27/02 ,  H02M1/44 ,  H02M1/12 ,  H02M3/155 ,  H02M1/00

CPC classification number: H02M1/44 ,  H01F27/02 ,  H02M1/126 ,  H02M3/155 ,  H02M2001/0064 ,  H02M2001/123

Abstract: The present invention provides a voltage conversion device and a method for adjusting common mode noise impedance, which relates to the circuit field, and enables a common mode impedance value of a noise source and an impedance value of an EMI filter to enter a mismatch state, so as to reduce a restriction on design of the EMI filter, so that a size of the EMI filter is smaller and utilization efficiency of the EMI filter is higher. The method is: adjusting a common mode impedance value of a noise source by adjusting a balanced impedance value in a balanced winding on a voltage conversion device, so as to enable the common mode impedance value of the noise source and an impedance value of an EMI filter to enter a mismatch state.

Abstract translation: 本发明提供了一种与电路领域相关的用于调节共模噪声阻抗的电压转换装置和方法，并且使得噪声源的共模阻抗值和EMI滤波器的阻抗值能够进入失配状态， 以减少对EMI滤波器的设计的限制，使得EMI滤波器的尺寸更小，并且EMI滤波器的利用效率更高。 该方法是：通过调整电压转换装置的平衡绕组中的平衡阻抗值来调整噪声源的共模阻抗值，以使噪声源的共模阻抗值和EMI的阻抗值 过滤器进入不匹配状态。